DE69927108D1 - Halbleiteranordnung mit einem Leitungsdraht - Google Patents

Halbleiteranordnung mit einem Leitungsdraht

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Publication number
DE69927108D1
DE69927108D1 DE69927108T DE69927108T DE69927108D1 DE 69927108 D1 DE69927108 D1 DE 69927108D1 DE 69927108 T DE69927108 T DE 69927108T DE 69927108 T DE69927108 T DE 69927108T DE 69927108 D1 DE69927108 D1 DE 69927108D1
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Germany
Prior art keywords
conductor wire
semiconductor arrangement
semiconductor
arrangement
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69927108T
Other languages
English (en)
Other versions
DE69927108T2 (de
Inventor
Mitsutoshi Higashi
Hideaki Sakaguchi
Kazunari Imai
Masahiro Kyozuka
Mitsuharu Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Publication of DE69927108D1 publication Critical patent/DE69927108D1/de
Application granted granted Critical
Publication of DE69927108T2 publication Critical patent/DE69927108T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
DE69927108T 1998-10-30 1999-10-29 Halbleiteranordnung mit einem Leitungsdraht Expired - Fee Related DE69927108T2 (de)

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JP31083498 1998-10-30
JP11234380A JP2000200804A (ja) 1998-10-30 1999-08-20 半導体装置及びその製造方法

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KR (1) KR20000029392A (de)
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Publication number Priority date Publication date Assignee Title
JP3502800B2 (ja) * 1999-12-15 2004-03-02 新光電気工業株式会社 半導体装置の製造方法
US20020113322A1 (en) * 2000-06-12 2002-08-22 Shinichi Terashima Semiconductor device and method to produce the same
US6884707B1 (en) * 2000-09-08 2005-04-26 Gabe Cherian Interconnections
JP3486872B2 (ja) 2001-01-26 2004-01-13 Ｎｅｃセミコンダクターズ九州株式会社 半導体装置及びその製造方法
JP2002353371A (ja) * 2001-05-25 2002-12-06 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
KR100422346B1 (ko) * 2001-06-12 2004-03-12 주식회사 하이닉스반도체 칩크기 패키지 구조 및 그 제조방법
JP2004259530A (ja) 2003-02-25 2004-09-16 Shinko Electric Ind Co Ltd 外部接触端子を有する半導体装置及びその使用方法
US7061096B2 (en) * 2003-09-24 2006-06-13 Silicon Pipe, Inc. Multi-surface IC packaging structures and methods for their manufacture
KR100713931B1 (ko) * 2006-03-29 2007-05-07 주식회사 하이닉스반도체 고속 및 고성능의 반도체 패키지
US9093448B2 (en) 2008-11-25 2015-07-28 Lord Corporation Methods for protecting a die surface with photocurable materials
CN102224583B (zh) * 2008-11-25 2014-09-10 洛德公司 使用光固化性材料保护晶片表面的方法
JP4658268B2 (ja) * 2008-11-26 2011-03-23 三菱電機株式会社 電力用半導体モジュール
CN105719978B (zh) * 2016-05-09 2018-12-04 中芯长电半导体（江阴）有限公司 一种近间距铜针封装结构及其制备方法
US10325878B2 (en) * 2016-06-30 2019-06-18 Kulicke And Soffa Industries, Inc. Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops
CA3083143C (en) * 2017-11-20 2021-06-08 University Of Central Florida Research Foundation, Inc. Monolithic neural interface system
JP7052426B2 (ja) * 2018-03-02 2022-04-12 富士電機株式会社 半導体装置および半導体装置の製造方法

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JPS60157245A (ja) * 1984-01-25 1985-08-17 Mitsubishi Electric Corp 半導体装置用パツケ−ジ
JPS6257223A (ja) * 1985-09-06 1987-03-12 Seiko Epson Corp 半導体装置の製造方法
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
JPH04171946A (ja) * 1990-11-06 1992-06-19 Fujitsu Ltd 半導体装置の製造方法
JPH0745751A (ja) * 1993-07-30 1995-02-14 Nippon Chemicon Corp 回路素子の封止構造
US5495667A (en) * 1994-11-07 1996-03-05 Micron Technology, Inc. Method for forming contact pins for semiconductor dice and interconnects

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JP2000200804A (ja) 2000-07-18
KR20000029392A (ko) 2000-05-25
TW434763B (en) 2001-05-16
US20030107131A1 (en) 2003-06-12
DE69927108T2 (de) 2006-06-14
EP0997939A1 (de) 2000-05-03
EP0997939B1 (de) 2005-09-07
US20010028108A1 (en) 2001-10-11

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