DE69920813D1 - Klebstoff zur Befestigung von Chips zur Anwendung bei der Mikroelekronischen Anordnung - Google Patents

Klebstoff zur Befestigung von Chips zur Anwendung bei der Mikroelekronischen Anordnung

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Publication number
DE69920813D1
DE69920813D1 DE69920813T DE69920813T DE69920813D1 DE 69920813 D1 DE69920813 D1 DE 69920813D1 DE 69920813 T DE69920813 T DE 69920813T DE 69920813 T DE69920813 T DE 69920813T DE 69920813 D1 DE69920813 D1 DE 69920813D1
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Germany
Prior art keywords
adhesive
microelectronic arrangement
chips
fastening
fastening chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69920813T
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English (en)
Other versions
DE69920813T2 (de
Inventor
Donald Herr
Rose Ann Schultz
Ping Yong Xu
Scott R Mclaughlin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Starch and Chemical Investment Holding Corp
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National Starch and Chemical Investment Holding Corp
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Application granted granted Critical
Publication of DE69920813D1 publication Critical patent/DE69920813D1/de
Publication of DE69920813T2 publication Critical patent/DE69920813T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
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    • H01L2924/06—Polymers
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    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
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    • H01L2924/11—Device type
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747—Copper [Cu] as principal constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Pyrrole Compounds (AREA)
DE69920813T 1998-07-02 1999-07-01 Klebstoff zur Befestigung von Chips zur Anwendung bei der Mikroelekronischen Anordnung Expired - Lifetime DE69920813T2 (de)

Applications Claiming Priority (4)

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US336245 1981-12-31
US9149298P 1998-07-02 1998-07-02
US91492P 1998-07-02
US09/336,245 US6265530B1 (en) 1998-07-02 1999-06-18 Die attach adhesives for use in microelectronic devices

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DE69920813T2 DE69920813T2 (de) 2006-02-23

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US (2) US6265530B1 (de)
EP (1) EP0969065B1 (de)
JP (1) JP2000044888A (de)
KR (1) KR100602887B1 (de)
CN (1) CN1145682C (de)
DE (1) DE69920813T2 (de)
HK (1) HK1028904A1 (de)
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DE69920813T2 (de) 2006-02-23
TW496891B (en) 2002-08-01
EP0969065B1 (de) 2004-10-06
JP2000044888A (ja) 2000-02-15
SG73662A1 (en) 2000-06-20
US6265530B1 (en) 2001-07-24
KR100602887B1 (ko) 2006-07-19
KR20000011449A (ko) 2000-02-25
EP0969065A2 (de) 2000-01-05
CN1248603A (zh) 2000-03-29
HK1028904A1 (en) 2001-03-09
US20020007042A1 (en) 2002-01-17
CN1145682C (zh) 2004-04-14

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