DE69839391D1 - Leitpaste und nichtreziproke schaltungselemente damit - Google Patents
Leitpaste und nichtreziproke schaltungselemente damitInfo
- Publication number
- DE69839391D1 DE69839391D1 DE69839391T DE69839391T DE69839391D1 DE 69839391 D1 DE69839391 D1 DE 69839391D1 DE 69839391 T DE69839391 T DE 69839391T DE 69839391 T DE69839391 T DE 69839391T DE 69839391 D1 DE69839391 D1 DE 69839391D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit elements
- reciprocal circuit
- elements therewith
- power paste
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/32—Non-reciprocal transmission devices
- H01P1/38—Circulators
- H01P1/383—Junction circulators, e.g. Y-circulators
- H01P1/387—Strip line circulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Conductive Materials (AREA)
- Non-Reversible Transmitting Devices (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29952597 | 1997-10-16 | ||
JP9299525A JPH11120818A (ja) | 1997-10-16 | 1997-10-16 | 導電体ペーストおよびそれを用いた非可逆回路素子 |
PCT/JP1998/004678 WO1999021193A1 (fr) | 1997-10-16 | 1998-10-16 | Pate conductrice et elements de circuit irreversibles formes par utilisation de cette pate |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69839391D1 true DE69839391D1 (de) | 2008-06-05 |
DE69839391T2 DE69839391T2 (de) | 2009-06-25 |
Family
ID=17873732
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69839391T Expired - Fee Related DE69839391T2 (de) | 1997-10-16 | 1998-10-16 | Leitpaste und nichtreziproke schaltungselemente damit |
Country Status (5)
Country | Link |
---|---|
US (1) | US6110569A (de) |
EP (1) | EP0967621B1 (de) |
JP (1) | JPH11120818A (de) |
DE (1) | DE69839391T2 (de) |
WO (1) | WO1999021193A1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100581971B1 (ko) * | 2003-02-11 | 2006-05-22 | 주식회사 동진쎄미켐 | 미세 전극 형성용 고점도 Ag 페이스트 조성물 및 이를이용하여 제조된 미세 전극 |
US20080315238A1 (en) * | 2005-12-22 | 2008-12-25 | Beckers Lucas Johannes Anna Ma | Porous Circuitry Material for Led Submounts |
US7749592B2 (en) * | 2007-02-06 | 2010-07-06 | Tdk Corpoation | Multilayer ceramic substrate |
US8652873B1 (en) * | 2012-08-03 | 2014-02-18 | E I Du Pont De Nemours And Company | Thick-film paste containing lead-vanadium-based oxide and its use in the manufacture of semiconductor devices |
KR20150028014A (ko) * | 2013-09-05 | 2015-03-13 | 삼성전기주식회사 | 자성체 조성물 및 이를 이용한 적층형 전자부품 |
WO2016017240A1 (ja) * | 2014-07-28 | 2016-02-04 | 株式会社村田製作所 | 導電性ペースト、及びガラス物品 |
CN118136305A (zh) * | 2024-02-29 | 2024-06-04 | 佛山市中科兴新材料有限公司 | 一种导电浆料及其应用 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02234308A (ja) * | 1989-03-07 | 1990-09-17 | Sumitomo Metal Mining Co Ltd | 導電性被膜形成用組成物 |
US5013360A (en) * | 1989-09-15 | 1991-05-07 | Vlsi Packaging Materials, Inc. | Sealing glass compositions |
JPH0589718A (ja) * | 1991-01-16 | 1993-04-09 | Sumitomo Metal Mining Co Ltd | 導体ペースト |
JP2898121B2 (ja) * | 1991-05-01 | 1999-05-31 | ティーディーケイ株式会社 | 導体ぺーストおよび配線基板 |
JP2965222B2 (ja) * | 1991-07-31 | 1999-10-18 | 太平洋セメント株式会社 | 導体ペースト |
JPH0589717A (ja) * | 1991-09-27 | 1993-04-09 | Sumitomo Metal Mining Co Ltd | 導体ペースト |
JP3003374B2 (ja) * | 1992-03-27 | 2000-01-24 | 松下電器産業株式会社 | 酸化亜鉛バリスタおよびその製造方法および被覆用結晶化ガラス組成物 |
JP3152873B2 (ja) * | 1995-06-30 | 2001-04-03 | 京セラ株式会社 | 低温焼成回路基板 |
JPH0922615A (ja) * | 1995-07-05 | 1997-01-21 | Tdk Corp | 導体材料および積層セラミック部品 |
JPH09198919A (ja) * | 1996-01-19 | 1997-07-31 | Matsushita Electric Ind Co Ltd | 導電ペースト及びそれを用いたセラミックス部品 |
-
1997
- 1997-10-16 JP JP9299525A patent/JPH11120818A/ja active Pending
-
1998
- 1998-10-16 DE DE69839391T patent/DE69839391T2/de not_active Expired - Fee Related
- 1998-10-16 WO PCT/JP1998/004678 patent/WO1999021193A1/ja active IP Right Grant
- 1998-10-16 EP EP98947900A patent/EP0967621B1/de not_active Expired - Lifetime
- 1998-10-16 US US09/173,619 patent/US6110569A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH11120818A (ja) | 1999-04-30 |
DE69839391T2 (de) | 2009-06-25 |
EP0967621A1 (de) | 1999-12-29 |
US6110569A (en) | 2000-08-29 |
EP0967621A4 (de) | 2005-10-05 |
EP0967621B1 (de) | 2008-04-23 |
WO1999021193A1 (fr) | 1999-04-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |