DE69835914D1 - Verbundmaterial für Kühlkörper für Halbleiter und Herstellung - Google Patents

Verbundmaterial für Kühlkörper für Halbleiter und Herstellung

Info

Publication number
DE69835914D1
DE69835914D1 DE69835914T DE69835914T DE69835914D1 DE 69835914 D1 DE69835914 D1 DE 69835914D1 DE 69835914 T DE69835914 T DE 69835914T DE 69835914 T DE69835914 T DE 69835914T DE 69835914 D1 DE69835914 D1 DE 69835914D1
Authority
DE
Germany
Prior art keywords
heatsinks
semiconductors
manufacturing
composite material
composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69835914T
Other languages
English (en)
Other versions
DE69835914T2 (de
Inventor
Shuhei Ishikawa
Tsutomu Mitsui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Application granted granted Critical
Publication of DE69835914D1 publication Critical patent/DE69835914D1/de
Publication of DE69835914T2 publication Critical patent/DE69835914T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5127—Cu, e.g. Cu-CuO eutectic
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/10—Alloys containing non-metals
    • C22C1/1036—Alloys containing non-metals starting from a melt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249955—Void-containing component partially impregnated with adjacent component
    • Y10T428/249956—Void-containing component is inorganic
    • Y10T428/249957—Inorganic impregnant
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249967—Inorganic matrix in void-containing component
    • Y10T428/249969—Of silicon-containing material [e.g., glass, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249967—Inorganic matrix in void-containing component
    • Y10T428/24997—Of metal-containing material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249971—Preformed hollow element-containing
    • Y10T428/249974—Metal- or silicon-containing element

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Structural Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
DE1998635914 1997-02-14 1998-02-13 Verbundmaterial für Kühlkörper für Halbleiter und Herstellung Expired - Lifetime DE69835914T2 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP3069897 1997-02-14
JP3069897 1997-02-14
JP12754097 1997-05-16
JP12754097 1997-05-16
JP35910197A JPH1129379A (ja) 1997-02-14 1997-12-26 半導体ヒートシンク用複合材料及びその製造方法
JP35910197 1997-12-26

Publications (2)

Publication Number Publication Date
DE69835914D1 true DE69835914D1 (de) 2006-11-02
DE69835914T2 DE69835914T2 (de) 2007-05-24

Family

ID=27287062

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1998635914 Expired - Lifetime DE69835914T2 (de) 1997-02-14 1998-02-13 Verbundmaterial für Kühlkörper für Halbleiter und Herstellung

Country Status (6)

Country Link
US (2) US6110577A (de)
EP (1) EP0859410B1 (de)
JP (1) JPH1129379A (de)
KR (1) KR100304457B1 (de)
CN (1) CN1157784C (de)
DE (1) DE69835914T2 (de)

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KR100487635B1 (ko) * 1997-12-31 2005-07-28 주식회사 하이닉스반도체 반도체의패키지몸체제조방법
JP2000037355A (ja) 1998-07-24 2000-02-08 Fuji Photo Film Co Ltd グルコース濃度測定方法および装置
US6280496B1 (en) * 1998-09-14 2001-08-28 Sumitomo Electric Industries, Ltd. Silicon carbide based composite material and manufacturing method thereof
KR100352993B1 (ko) * 1998-12-07 2002-09-18 가부시끼가이샤 히다치 세이사꾸쇼 복합재료 및 그 용도
JP4360061B2 (ja) * 1999-06-14 2009-11-11 住友電気工業株式会社 半導体装置用部材およびそれを用いた半導体装置
EP1160860B1 (de) * 1999-12-24 2010-10-27 NGK Insulators, Ltd. Kühlkörpermaterial und verfahren zu seiner herstellung
JP2003152145A (ja) * 2001-08-31 2003-05-23 Sumitomo Electric Ind Ltd 半導体放熱用基板とその製造方法及びパッケージ
JP4203283B2 (ja) * 2001-09-19 2008-12-24 日本碍子株式会社 複合材料
US20030131476A1 (en) * 2001-09-28 2003-07-17 Vlad Ocher Heat conduits and terminal radiator for microcircuit packaging and manufacturing process
JP2003201528A (ja) * 2001-10-26 2003-07-18 Ngk Insulators Ltd ヒートシンク材
JP2004253736A (ja) * 2003-02-21 2004-09-09 Ngk Insulators Ltd ヒートスプレッダモジュール
US6705393B1 (en) * 2003-02-25 2004-03-16 Abc Taiwan Electronics Corp. Ceramic heat sink with micro-pores structure
JP4014528B2 (ja) * 2003-03-28 2007-11-28 日本碍子株式会社 ヒートスプレッダモジュールの製造方法及びヒートスプレッダモジュール
DE10350035A1 (de) * 2003-10-27 2005-05-25 Robert Bosch Gmbh Verfahren zur Herstellung eines Verbundbauteils und metall-keramisches Bauteil
US20060035413A1 (en) * 2004-01-13 2006-02-16 Cookson Electronics, Inc. Thermal protection for electronic components during processing
US20050151555A1 (en) * 2004-01-13 2005-07-14 Cookson Electronics, Inc. Cooling devices and methods of using them
US7437874B2 (en) * 2005-03-10 2008-10-21 Detroit Diesel Corporation System and method for backpressure compensation for controlling exhaust gas particulate emissions
JP4378334B2 (ja) * 2005-09-09 2009-12-02 日本碍子株式会社 ヒートスプレッダモジュール及びその製造方法
DE102006051201A1 (de) * 2006-10-30 2008-05-08 Robert Bosch Gmbh Werkstoff für tribologische Anwendungen
US20110044003A1 (en) * 2007-07-17 2011-02-24 Huang-Han Chen Heatsink structure
DE102008005529A1 (de) * 2008-01-22 2009-07-23 Robert Bosch Gmbh Kühlkörper und Verfahren zur Herstellung eines Kühlkörpers
US7947331B2 (en) * 2008-04-28 2011-05-24 Tsinghua University Method for making thermal interface material
WO2011037876A1 (en) 2009-09-25 2011-03-31 Cree, Inc. Lighting device having heat dissipation element
US20110174436A1 (en) * 2010-01-19 2011-07-21 Mohsen Ghajar Thermal conductivity treatment
JP2012119671A (ja) 2010-11-11 2012-06-21 Kitagawa Ind Co Ltd 電子回路及びヒートシンク
DE102011000455A1 (de) * 2011-01-14 2012-07-19 Azur Space Solar Power Gmbh Anordnen und Verfahren zum Kühlen eines Trägers
DE102013007274B4 (de) * 2013-04-26 2020-01-16 Wieland-Werke Ag Konstruktionsteil aus einer Kupfergusslegierung
CN104329907B (zh) * 2014-11-20 2017-01-18 南京艾布纳密封技术股份有限公司 一种浸渗罐制冷装置
US10568205B2 (en) 2016-07-27 2020-02-18 Corning Incorporated Ceramic and polymer composite, and uses thereof
JP7134111B2 (ja) * 2019-02-08 2022-09-09 三菱電機株式会社 半導体モジュールおよび半導体モジュールの評価方法
US11858863B2 (en) * 2020-08-06 2024-01-02 William Carty Method for fabricating perfectly wetting surfaces

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JPH05507319A (ja) * 1990-05-09 1993-10-21 ランキサイド　テクノロジー　カンパニー，リミティド　パートナーシップ 金属マトリックス複合物用硬化フィラー材料
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Also Published As

Publication number Publication date
DE69835914T2 (de) 2007-05-24
EP0859410A2 (de) 1998-08-19
US6479095B1 (en) 2002-11-12
KR19980071256A (ko) 1998-10-26
KR100304457B1 (ko) 2002-03-08
EP0859410A3 (de) 1999-12-15
CN1201256A (zh) 1998-12-09
CN1157784C (zh) 2004-07-14
EP0859410B1 (de) 2006-09-20
US6110577A (en) 2000-08-29
JPH1129379A (ja) 1999-02-02

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Legal Events

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