DE69834716T2 - Asymmetrische stromversorgungseinheiten für bipolare elektrostatische halter und deren verfahren - Google Patents
Asymmetrische stromversorgungseinheiten für bipolare elektrostatische halter und deren verfahren Download PDFInfo
- Publication number
- DE69834716T2 DE69834716T2 DE69834716T DE69834716T DE69834716T2 DE 69834716 T2 DE69834716 T2 DE 69834716T2 DE 69834716 T DE69834716 T DE 69834716T DE 69834716 T DE69834716 T DE 69834716T DE 69834716 T2 DE69834716 T2 DE 69834716T2
- Authority
- DE
- Germany
- Prior art keywords
- power supply
- node
- voltages
- asymmetrical
- resistive element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 230000004044 response Effects 0.000 claims description 12
- 230000000670 limiting effect Effects 0.000 claims description 8
- 230000008859 change Effects 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 claims 4
- 239000003795 chemical substances by application Substances 0.000 claims 3
- 230000008878 coupling Effects 0.000 abstract 3
- 238000010168 coupling process Methods 0.000 abstract 3
- 238000005859 coupling reaction Methods 0.000 abstract 3
- 239000001307 helium Substances 0.000 description 16
- 229910052734 helium Inorganic materials 0.000 description 16
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 16
- 239000007789 gas Substances 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 230000002829 reductive effect Effects 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000009411 base construction Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/23—Chucks or sockets with magnetic or electrostatic means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/824,104 US5835335A (en) | 1997-03-26 | 1997-03-26 | Unbalanced bipolar electrostatic chuck power supplies and methods thereof |
| US824104 | 1997-03-26 | ||
| PCT/US1998/005676 WO1998043291A1 (en) | 1997-03-26 | 1998-03-24 | Unbalanced bipolar electrostatic chuck power supplies and methods therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69834716D1 DE69834716D1 (de) | 2006-07-06 |
| DE69834716T2 true DE69834716T2 (de) | 2007-05-03 |
Family
ID=25240591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69834716T Expired - Lifetime DE69834716T2 (de) | 1997-03-26 | 1998-03-24 | Asymmetrische stromversorgungseinheiten für bipolare elektrostatische halter und deren verfahren |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5835335A (enExample) |
| EP (1) | EP0970517B1 (enExample) |
| JP (1) | JP4169792B2 (enExample) |
| KR (1) | KR100538599B1 (enExample) |
| AT (1) | ATE328365T1 (enExample) |
| DE (1) | DE69834716T2 (enExample) |
| TW (1) | TW432464B (enExample) |
| WO (1) | WO1998043291A1 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5953200A (en) * | 1998-02-05 | 1999-09-14 | Vlsi Technology, Inc. | Multiple pole electrostatic chuck with self healing mechanism for wafer clamping |
| US6346428B1 (en) * | 1998-08-17 | 2002-02-12 | Tegal Corporation | Method and apparatus for minimizing semiconductor wafer arcing during semiconductor wafer processing |
| US6361645B1 (en) * | 1998-10-08 | 2002-03-26 | Lam Research Corporation | Method and device for compensating wafer bias in a plasma processing chamber |
| US6188564B1 (en) * | 1999-03-31 | 2001-02-13 | Lam Research Corporation | Method and apparatus for compensating non-uniform wafer processing in plasma processing chamber |
| EP1061639A2 (en) * | 1999-06-17 | 2000-12-20 | Applied Materials, Inc. | Chucking system amd method |
| TW454320B (en) * | 2000-05-12 | 2001-09-11 | Siliconware Precision Industries Co Ltd | Semiconductor devices with heat-dissipation stiffener and manufacturing method thereof |
| JP2003115442A (ja) * | 2001-10-04 | 2003-04-18 | Nikon Corp | 荷電粒子線露光装置におけるレチクル又はウエハの静電チャック方法 |
| US6898065B2 (en) * | 2002-07-26 | 2005-05-24 | Brad Mays | Method and apparatus for operating an electrostatic chuck in a semiconductor substrate processing system |
| US7026174B2 (en) * | 2002-09-30 | 2006-04-11 | Lam Research Corporation | Method for reducing wafer arcing |
| EP1635388A4 (en) * | 2003-06-17 | 2009-10-21 | Creative Tech Corp | DIPOLAR ELECTROSTATIC CLAMPING DEVICE |
| JP2005182494A (ja) * | 2003-12-19 | 2005-07-07 | Mitsubishi Electric Corp | 電流増幅回路およびそれを備える液晶表示装置 |
| US20120140362A1 (en) * | 2010-12-02 | 2012-06-07 | Mathew Robins | Method of Operating a Heating Element for Underfloor Heating |
| US9076831B2 (en) * | 2011-11-04 | 2015-07-07 | Lam Research Corporation | Substrate clamping system and method for operating the same |
| US9754809B2 (en) * | 2013-11-11 | 2017-09-05 | Western Alliance Bank | Tri-modal carrier for a semiconductive wafer |
| US10236202B2 (en) * | 2013-11-11 | 2019-03-19 | Diablo Capital, Inc. | System and method for adhering a semiconductive wafer to a mobile electrostatic carrier through a vacuum |
| CN104715988B (zh) * | 2013-12-17 | 2017-05-24 | 中微半导体设备(上海)有限公司 | 等离子体处理装置及其基片直流偏置电压测量方法 |
| EP3399545B1 (en) * | 2017-05-04 | 2021-09-29 | Meyer Burger (Germany) GmbH | Substrate treatment system |
| JP6933097B2 (ja) * | 2017-11-13 | 2021-09-08 | オムロン株式会社 | 電源システム、電源装置の動作状態表示法、およびプログラム |
| CN112635381B (zh) * | 2019-10-08 | 2022-03-22 | 长鑫存储技术有限公司 | 控制方法、控制系统及半导体制造设备 |
| GB202310034D0 (en) * | 2023-06-30 | 2023-08-16 | Spts Technologies Ltd | Plasma etching method and apparatus |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4692836A (en) * | 1983-10-31 | 1987-09-08 | Toshiba Kikai Kabushiki Kaisha | Electrostatic chucks |
| DE3705866A1 (de) * | 1987-02-24 | 1988-09-01 | Siemens Ag | Schaltungsanordnung zum erzeugen von symmetrischen ausgangsspannungen |
| JP2779950B2 (ja) * | 1989-04-25 | 1998-07-23 | 東陶機器株式会社 | 静電チャックの電圧印加方法および電圧印加装置 |
| EP0439000B1 (en) * | 1990-01-25 | 1994-09-14 | Applied Materials, Inc. | Electrostatic clamp and method |
| US5325261A (en) * | 1991-05-17 | 1994-06-28 | Unisearch Limited | Electrostatic chuck with improved release |
| US5557215A (en) * | 1993-05-12 | 1996-09-17 | Tokyo Electron Limited | Self-bias measuring method, apparatus thereof and electrostatic chucking apparatus |
| US5463525A (en) * | 1993-12-20 | 1995-10-31 | International Business Machines Corporation | Guard ring electrostatic chuck |
| US5467249A (en) * | 1993-12-20 | 1995-11-14 | International Business Machines Corporation | Electrostatic chuck with reference electrode |
| US5535507A (en) * | 1993-12-20 | 1996-07-16 | International Business Machines Corporation | Method of making electrostatic chuck with oxide insulator |
| US5708250A (en) * | 1996-03-29 | 1998-01-13 | Lam Resarch Corporation | Voltage controller for electrostatic chuck of vacuum plasma processors |
| US5812361A (en) * | 1996-03-29 | 1998-09-22 | Lam Research Corporation | Dynamic feedback electrostatic wafer chuck |
-
1997
- 1997-03-26 US US08/824,104 patent/US5835335A/en not_active Expired - Lifetime
-
1998
- 1998-03-24 EP EP98911954A patent/EP0970517B1/en not_active Expired - Lifetime
- 1998-03-24 AT AT98911954T patent/ATE328365T1/de not_active IP Right Cessation
- 1998-03-24 DE DE69834716T patent/DE69834716T2/de not_active Expired - Lifetime
- 1998-03-24 WO PCT/US1998/005676 patent/WO1998043291A1/en not_active Ceased
- 1998-03-24 JP JP54588298A patent/JP4169792B2/ja not_active Expired - Fee Related
- 1998-03-24 KR KR10-1999-7008778A patent/KR100538599B1/ko not_active Expired - Fee Related
- 1998-03-26 TW TW087104757A patent/TW432464B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR100538599B1 (ko) | 2005-12-22 |
| ATE328365T1 (de) | 2006-06-15 |
| US5835335A (en) | 1998-11-10 |
| TW432464B (en) | 2001-05-01 |
| JP2001525123A (ja) | 2001-12-04 |
| KR20010005710A (ko) | 2001-01-15 |
| WO1998043291A1 (en) | 1998-10-01 |
| EP0970517B1 (en) | 2006-05-31 |
| DE69834716D1 (de) | 2006-07-06 |
| JP4169792B2 (ja) | 2008-10-22 |
| EP0970517A1 (en) | 2000-01-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE69834716T2 (de) | Asymmetrische stromversorgungseinheiten für bipolare elektrostatische halter und deren verfahren | |
| DE69726858T2 (de) | Verfahren und apparate zur klemmung und entklemmung einer halbleiterscheibe in einem scheibenbearbeitungssystem | |
| EP1593143B1 (de) | Leistungszufuhrregeleinheit | |
| DE2702456C2 (enExample) | ||
| DE3441470A1 (de) | Anordnung zum aetzen von halbleiterscheiben | |
| AT383223B (de) | Schaltung zur abtastung eines eingangssignals | |
| DE2825465A1 (de) | Regelung einer hochspannungsversorgung | |
| DE102004048687A1 (de) | Bildanzeigevorrichtung und Inspektionsverfahren für diese | |
| DE69107377T2 (de) | Bildaufnahmegerät. | |
| DE2840034C2 (enExample) | ||
| DE2149119C3 (de) | Koronaaufladevorrichtung für die Elektrofotografie | |
| DE2725985C2 (enExample) | ||
| DE1906496A1 (de) | Entmagnetisierungs-Schaltungsanordnung | |
| EP3884893B1 (de) | Medizingerät mit einem betriebssicheren netzteil | |
| DE2165602C2 (de) | Anordnung zur Erzeugung einer sich mit hoher Frequenz zyklisch stufenweise ändernden hohen Ausgangsgleichspannung | |
| DE2617858C3 (de) | Verfahren und Vorrichtung zum gleichförmigen Aufladen eines begrenzten Bereiches eines elektrofotografischen Aufzeichnungsmaterials mittels einer Koronaentladung | |
| DE3504936A1 (de) | Stromdichte-steuervorrichtung | |
| DE3144046A1 (de) | Schaltkreis, dessen anwendung in einer schreibvorrichtung und diese schreibvorrichtung | |
| DE10014383C2 (de) | Entmagnetisierungsschaltung | |
| DE29608484U1 (de) | Plasmaerzeugungseinrichtung mit einer Hohlkathode | |
| DE60216622T2 (de) | Minimumdetektor | |
| EP0104478A1 (de) | Anordnung und Verfahren zur Spannungsmessung an einem vergrabenen Messobjekt | |
| DE1073655B (de) | Verfahren zum Ändern der Bildhelligkeit in Korpuskularstrahlgeräten, insbesondere in Elektronenmikroskopen | |
| DE1941973B2 (de) | Symmetrisches festkoerper-spannungsversorgungssystem | |
| DE102016115980B4 (de) | Zündgenerator und Verfahren zum Erzeugen von elektrischen Zündfunken zum Zünden von Plasmen in Mikrosystemen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition |