JP4169792B2 - 不平衡二極静電チャック電源供給装置およびその方法 - Google Patents

不平衡二極静電チャック電源供給装置およびその方法 Download PDF

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Publication number
JP4169792B2
JP4169792B2 JP54588298A JP54588298A JP4169792B2 JP 4169792 B2 JP4169792 B2 JP 4169792B2 JP 54588298 A JP54588298 A JP 54588298A JP 54588298 A JP54588298 A JP 54588298A JP 4169792 B2 JP4169792 B2 JP 4169792B2
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Japan
Prior art keywords
power supply
unbalanced
voltage
voltage power
terminal
Prior art date
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Expired - Fee Related
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JP54588298A
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English (en)
Japanese (ja)
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JP2001525123A (ja
JP2001525123A5 (enExample
Inventor
ロス・チャールス・ピー．
ライ・キャンフェング
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Lam Research Corp
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Lam Research Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
JP54588298A 1997-03-26 1998-03-24 不平衡二極静電チャック電源供給装置およびその方法 Expired - Fee Related JP4169792B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/824,104 US5835335A (en) 1997-03-26 1997-03-26 Unbalanced bipolar electrostatic chuck power supplies and methods thereof
US08/824,104 1997-03-26
PCT/US1998/005676 WO1998043291A1 (en) 1997-03-26 1998-03-24 Unbalanced bipolar electrostatic chuck power supplies and methods therefor

Publications (3)

Publication Number Publication Date
JP2001525123A JP2001525123A (ja) 2001-12-04
JP2001525123A5 JP2001525123A5 (enExample) 2005-11-10
JP4169792B2 true JP4169792B2 (ja) 2008-10-22

Family

ID=25240591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54588298A Expired - Fee Related JP4169792B2 (ja) 1997-03-26 1998-03-24 不平衡二極静電チャック電源供給装置およびその方法

Country Status (8)

Country Link
US (1) US5835335A (enExample)
EP (1) EP0970517B1 (enExample)
JP (1) JP4169792B2 (enExample)
KR (1) KR100538599B1 (enExample)
AT (1) ATE328365T1 (enExample)
DE (1) DE69834716T2 (enExample)
TW (1) TW432464B (enExample)
WO (1) WO1998043291A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5953200A (en) * 1998-02-05 1999-09-14 Vlsi Technology, Inc. Multiple pole electrostatic chuck with self healing mechanism for wafer clamping
US6346428B1 (en) * 1998-08-17 2002-02-12 Tegal Corporation Method and apparatus for minimizing semiconductor wafer arcing during semiconductor wafer processing
US6361645B1 (en) * 1998-10-08 2002-03-26 Lam Research Corporation Method and device for compensating wafer bias in a plasma processing chamber
US6188564B1 (en) * 1999-03-31 2001-02-13 Lam Research Corporation Method and apparatus for compensating non-uniform wafer processing in plasma processing chamber
EP1061639A2 (en) * 1999-06-17 2000-12-20 Applied Materials, Inc. Chucking system amd method
TW454320B (en) * 2000-05-12 2001-09-11 Siliconware Precision Industries Co Ltd Semiconductor devices with heat-dissipation stiffener and manufacturing method thereof
JP2003115442A (ja) * 2001-10-04 2003-04-18 Nikon Corp 荷電粒子線露光装置におけるレチクル又はウエハの静電チャック方法
US6898065B2 (en) * 2002-07-26 2005-05-24 Brad Mays Method and apparatus for operating an electrostatic chuck in a semiconductor substrate processing system
US7026174B2 (en) * 2002-09-30 2006-04-11 Lam Research Corporation Method for reducing wafer arcing
EP1635388A4 (en) * 2003-06-17 2009-10-21 Creative Tech Corp DIPOLAR ELECTROSTATIC CLAMPING DEVICE
JP2005182494A (ja) * 2003-12-19 2005-07-07 Mitsubishi Electric Corp 電流増幅回路およびそれを備える液晶表示装置
US20120140362A1 (en) * 2010-12-02 2012-06-07 Mathew Robins Method of Operating a Heating Element for Underfloor Heating
US9076831B2 (en) * 2011-11-04 2015-07-07 Lam Research Corporation Substrate clamping system and method for operating the same
US9754809B2 (en) * 2013-11-11 2017-09-05 Western Alliance Bank Tri-modal carrier for a semiconductive wafer
US10236202B2 (en) * 2013-11-11 2019-03-19 Diablo Capital, Inc. System and method for adhering a semiconductive wafer to a mobile electrostatic carrier through a vacuum
CN104715988B (zh) * 2013-12-17 2017-05-24 中微半导体设备(上海)有限公司 等离子体处理装置及其基片直流偏置电压测量方法
EP3399545B1 (en) * 2017-05-04 2021-09-29 Meyer Burger (Germany) GmbH Substrate treatment system
JP6933097B2 (ja) * 2017-11-13 2021-09-08 オムロン株式会社 電源システム、電源装置の動作状態表示法、およびプログラム
CN112635381B (zh) * 2019-10-08 2022-03-22 长鑫存储技术有限公司 控制方法、控制系统及半导体制造设备
GB202310034D0 (en) * 2023-06-30 2023-08-16 Spts Technologies Ltd Plasma etching method and apparatus

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692836A (en) * 1983-10-31 1987-09-08 Toshiba Kikai Kabushiki Kaisha Electrostatic chucks
DE3705866A1 (de) * 1987-02-24 1988-09-01 Siemens Ag Schaltungsanordnung zum erzeugen von symmetrischen ausgangsspannungen
JP2779950B2 (ja) * 1989-04-25 1998-07-23 東陶機器株式会社 静電チャックの電圧印加方法および電圧印加装置
EP0439000B1 (en) * 1990-01-25 1994-09-14 Applied Materials, Inc. Electrostatic clamp and method
US5325261A (en) * 1991-05-17 1994-06-28 Unisearch Limited Electrostatic chuck with improved release
US5557215A (en) * 1993-05-12 1996-09-17 Tokyo Electron Limited Self-bias measuring method, apparatus thereof and electrostatic chucking apparatus
US5463525A (en) * 1993-12-20 1995-10-31 International Business Machines Corporation Guard ring electrostatic chuck
US5467249A (en) * 1993-12-20 1995-11-14 International Business Machines Corporation Electrostatic chuck with reference electrode
US5535507A (en) * 1993-12-20 1996-07-16 International Business Machines Corporation Method of making electrostatic chuck with oxide insulator
US5708250A (en) * 1996-03-29 1998-01-13 Lam Resarch Corporation Voltage controller for electrostatic chuck of vacuum plasma processors
US5812361A (en) * 1996-03-29 1998-09-22 Lam Research Corporation Dynamic feedback electrostatic wafer chuck

Also Published As

Publication number Publication date
KR100538599B1 (ko) 2005-12-22
ATE328365T1 (de) 2006-06-15
US5835335A (en) 1998-11-10
TW432464B (en) 2001-05-01
JP2001525123A (ja) 2001-12-04
DE69834716T2 (de) 2007-05-03
KR20010005710A (ko) 2001-01-15
WO1998043291A1 (en) 1998-10-01
EP0970517B1 (en) 2006-05-31
DE69834716D1 (de) 2006-07-06
EP0970517A1 (en) 2000-01-12

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