DE69830121D1 - Polierschlamm Spendevorrichtung - Google Patents

Polierschlamm Spendevorrichtung

Info

Publication number
DE69830121D1
DE69830121D1 DE69830121T DE69830121T DE69830121D1 DE 69830121 D1 DE69830121 D1 DE 69830121D1 DE 69830121 T DE69830121 T DE 69830121T DE 69830121 T DE69830121 T DE 69830121T DE 69830121 D1 DE69830121 D1 DE 69830121D1
Authority
DE
Germany
Prior art keywords
polishing slurry
slurry dispenser
dispenser
polishing
slurry
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69830121T
Other languages
English (en)
Other versions
DE69830121T2 (de
Inventor
Kiyotaka Kawashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP31621797A external-priority patent/JP3788550B2/ja
Priority claimed from JP31621697A external-priority patent/JP3801325B2/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of DE69830121D1 publication Critical patent/DE69830121D1/de
Application granted granted Critical
Publication of DE69830121T2 publication Critical patent/DE69830121T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE69830121T 1997-10-31 1998-10-29 Polierschlamm Spendevorrichtung Expired - Fee Related DE69830121T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP31621697 1997-10-31
JP31621797A JP3788550B2 (ja) 1997-10-31 1997-10-31 砥液供給装置
JP31621797 1997-10-31
JP31621697A JP3801325B2 (ja) 1997-10-31 1997-10-31 研磨装置及び半導体ウエハの研磨方法

Publications (2)

Publication Number Publication Date
DE69830121D1 true DE69830121D1 (de) 2005-06-16
DE69830121T2 DE69830121T2 (de) 2006-02-23

Family

ID=26568585

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69830121T Expired - Fee Related DE69830121T2 (de) 1997-10-31 1998-10-29 Polierschlamm Spendevorrichtung

Country Status (5)

Country Link
US (1) US6293849B1 (de)
EP (1) EP0913233B1 (de)
DE (1) DE69830121T2 (de)
SG (1) SG75889A1 (de)
TW (1) TW416893B (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3538042B2 (ja) * 1998-11-24 2004-06-14 松下電器産業株式会社 スラリー供給装置及びスラリー供給方法
US6200202B1 (en) * 1998-11-30 2001-03-13 Seh America, Inc. System and method for supplying slurry to a semiconductor processing machine
JP2002170792A (ja) * 2000-11-29 2002-06-14 Mitsubishi Electric Corp 研磨液供給装置及び研磨液供給方法、研磨装置及び研磨方法、並びに、半導体装置の製造方法
US6736154B2 (en) * 2001-01-26 2004-05-18 American Air Liquide, Inc. Pressure vessel systems and methods for dispensing liquid chemical compositions
US6606917B2 (en) * 2001-11-26 2003-08-19 Emerson Electric Co. High purity coriolis mass flow controller
US20030098069A1 (en) * 2001-11-26 2003-05-29 Sund Wesley E. High purity fluid delivery system
US7204679B2 (en) * 2002-09-30 2007-04-17 Emerson Electric Co. Flow control system
US6860723B2 (en) * 2002-10-05 2005-03-01 Taiwan Semiconductor Manufacturing Co., Ltd Slurry flow control and monitor system for chemical mechanical polisher
US6984166B2 (en) * 2003-08-01 2006-01-10 Chartered Semiconductor Manufacturing Ltd. Zone polishing using variable slurry solid content
WO2006077994A1 (en) * 2005-01-21 2006-07-27 Ebara Corporation Substrate polishing method and apparatus
US7810674B2 (en) * 2005-07-26 2010-10-12 Millipore Corporation Liquid dispensing system with enhanced mixing
US7427227B2 (en) * 2005-08-30 2008-09-23 Denso Corporation Method and apparatus for fluid polishing
US7950547B2 (en) * 2006-01-12 2011-05-31 Millipore Corporation Reservoir for liquid dispensing system with enhanced mixing
CA2882518C (en) * 2006-07-07 2019-08-27 Fair Oaks Farms Brands, Inc. Liquid food dispenser system and method
WO2008141206A2 (en) * 2007-05-09 2008-11-20 Advanced Technology Materials, Inc. Systems and methods for material blending and distribution
WO2009076276A2 (en) * 2007-12-06 2009-06-18 Advanced Technology Materials, Inc. Systems and methods for delivery of fluid-containing process material combinations
US8561627B1 (en) * 2008-09-26 2013-10-22 Intermolecular, Inc. Calibration of a chemical dispense system
TW201210722A (en) * 2010-09-03 2012-03-16 Rexon Ind Corp Ltd Tile cutter with a liquid level display
US9770804B2 (en) 2013-03-18 2017-09-26 Versum Materials Us, Llc Slurry supply and/or chemical blend supply apparatuses, processes, methods of use and methods of manufacture
US9662761B2 (en) * 2013-12-02 2017-05-30 Ebara Corporation Polishing apparatus
CN103639889A (zh) * 2013-12-05 2014-03-19 天津中环领先材料技术有限公司 一种用于无蜡抛光设备的配液供液装置及其使用方法
CN108284390B (zh) * 2018-03-16 2023-07-18 湘潭大学 一种抛光液供给系统
CN108637913B (zh) * 2018-06-06 2024-01-16 蚌埠国显科技有限公司 一种抛光机集中供液系统
US11518696B2 (en) 2018-08-29 2022-12-06 Mks Instruments Ozonated water delivery system and method of use
CN110238708B (zh) * 2019-06-20 2024-01-23 中国工程物理研究院激光聚变研究中心 一种磁流变抛光机床磁流变液循环系统
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems
CN113118964A (zh) * 2021-04-23 2021-07-16 长鑫存储技术有限公司 化学机械研磨装置
CN115890459A (zh) * 2022-12-30 2023-04-04 湖南科鑫泰电子有限公司 一种石英晶片抛光装置及抛光方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5417346A (en) * 1990-09-17 1995-05-23 Applied Chemical Solutions Process and apparatus for electronic control of the transfer and delivery of high purity chemicals
JPH0752045A (ja) 1993-08-17 1995-02-28 Ebara Corp ポリッシング装置の砥液供給装置
US5658183A (en) * 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
US5679059A (en) * 1994-11-29 1997-10-21 Ebara Corporation Polishing aparatus and method
JP2971714B2 (ja) 1993-10-01 1999-11-08 住友金属工業株式会社 半導体基板の鏡面研磨方法
JPH10503431A (ja) * 1994-07-19 1998-03-31 アプライド ケミカル ソルーションズ インコーポレーティッド 化学機械的研磨処理に用いるための装置及び方法
JP2933488B2 (ja) * 1994-08-10 1999-08-16 日本電気株式会社 研磨方法および研磨装置
JP3734289B2 (ja) * 1995-01-24 2006-01-11 株式会社荏原製作所 ポリッシング装置
JP3690837B2 (ja) * 1995-05-02 2005-08-31 株式会社荏原製作所 ポリッシング装置及び方法
US5665656A (en) * 1995-05-17 1997-09-09 National Semiconductor Corporation Method and apparatus for polishing a semiconductor substrate wafer
US5578529A (en) * 1995-06-02 1996-11-26 Motorola Inc. Method for using rinse spray bar in chemical mechanical polishing
JP3311203B2 (ja) * 1995-06-13 2002-08-05 株式会社東芝 半導体装置の製造方法及び半導体製造装置、半導体ウェーハの化学的機械的ポリッシング方法
JP3678468B2 (ja) * 1995-07-18 2005-08-03 株式会社荏原製作所 ポリッシング装置
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5750440A (en) * 1995-11-20 1998-05-12 Motorola, Inc. Apparatus and method for dynamically mixing slurry for chemical mechanical polishing
US5762539A (en) * 1996-02-27 1998-06-09 Ebara Corporation Apparatus for and method for polishing workpiece
US5885134A (en) * 1996-04-18 1999-03-23 Ebara Corporation Polishing apparatus
US5823854A (en) * 1996-05-28 1998-10-20 Industrial Technology Research Institute Chemical-mechanical polish (CMP) pad conditioner
KR100202659B1 (ko) * 1996-07-09 1999-06-15 구본준 반도체웨이퍼의 기계화학적 연마장치
US5785584A (en) * 1996-08-30 1998-07-28 International Business Machines Corporation Planarizing apparatus with deflectable polishing pad
JPH1076153A (ja) 1996-09-05 1998-03-24 Fujitsu Ltd 液体自動供給装置及びその異常検出装置

Also Published As

Publication number Publication date
US6293849B1 (en) 2001-09-25
EP0913233A2 (de) 1999-05-06
EP0913233A3 (de) 2002-10-30
EP0913233B1 (de) 2005-05-11
TW416893B (en) 2001-01-01
SG75889A1 (en) 2000-10-24
DE69830121T2 (de) 2006-02-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee