DE69823194D1 - Polierflüssigkeitsspender - Google Patents

Polierflüssigkeitsspender

Info

Publication number
DE69823194D1
DE69823194D1 DE69823194T DE69823194T DE69823194D1 DE 69823194 D1 DE69823194 D1 DE 69823194D1 DE 69823194 T DE69823194 T DE 69823194T DE 69823194 T DE69823194 T DE 69823194T DE 69823194 D1 DE69823194 D1 DE 69823194D1
Authority
DE
Germany
Prior art keywords
polishing liquid
liquid dispenser
dispenser
polishing
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69823194T
Other languages
English (en)
Other versions
DE69823194T2 (de
Inventor
Norio Kimura
Hirokuni Hiyama
Yutaka Wada
Kiyotaka Kawashima
Manabu Tsujimura
Takayoshi Kawamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of DE69823194D1 publication Critical patent/DE69823194D1/de
Publication of DE69823194T2 publication Critical patent/DE69823194T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S451/00—Abrading
    • Y10S451/91—Ultrasonic

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
DE69823194T 1997-12-08 1998-12-08 Polierflüssigkeitsspender Expired - Fee Related DE69823194T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP35413497 1997-12-08
PCT/JP1998/005541 WO1999029505A1 (fr) 1997-12-08 1998-12-08 Distributeur de solution de polissage

Publications (2)

Publication Number Publication Date
DE69823194D1 true DE69823194D1 (de) 2004-05-19
DE69823194T2 DE69823194T2 (de) 2005-04-21

Family

ID=18435526

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69823194T Expired - Fee Related DE69823194T2 (de) 1997-12-08 1998-12-08 Polierflüssigkeitsspender

Country Status (5)

Country Link
US (1) US6406364B1 (de)
EP (1) EP0990486B1 (de)
KR (1) KR100567982B1 (de)
DE (1) DE69823194T2 (de)
WO (1) WO1999029505A1 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3538042B2 (ja) * 1998-11-24 2004-06-14 松下電器産業株式会社 スラリー供給装置及びスラリー供給方法
US6196900B1 (en) * 1999-09-07 2001-03-06 Vlsi Technology, Inc. Ultrasonic transducer slurry dispenser
US6423638B1 (en) * 1999-09-28 2002-07-23 Motorola, Inc. Filter apparatus and method therefor
JP2001150346A (ja) * 1999-11-25 2001-06-05 Nec Corp スラリー供給装置
TW541230B (en) * 2000-10-06 2003-07-11 Ebara Corp Method for supplying slurry to polishing apparatus
US6709313B2 (en) * 2000-11-17 2004-03-23 Rion Co., Ltd. Apparatus for producing polishing solution and apparatus for feeding the same
US6672943B2 (en) 2001-01-26 2004-01-06 Wafer Solutions, Inc. Eccentric abrasive wheel for wafer processing
US6632012B2 (en) * 2001-03-30 2003-10-14 Wafer Solutions, Inc. Mixing manifold for multiple inlet chemistry fluids
KR100428787B1 (ko) * 2001-11-28 2004-04-28 삼성전자주식회사 슬러리 저장 유니트 및 사용점에서의 혼합 유니트를 갖는슬러리 공급장치
TW538853U (en) * 2002-05-03 2003-06-21 Nanya Technology Corp Device for mixing polishing solvent with consistent property and slurry supply system
US20090037028A1 (en) * 2004-09-30 2009-02-05 Garcia James P Apparatus for dispensing precise volumes of fluid
US20060074529A1 (en) * 2004-09-30 2006-04-06 Garcia James P Apparatus for dispensing precise volumes of fluid
JP2006271449A (ja) * 2005-03-28 2006-10-12 Toray Ireeve Corp 洗浄機能付きの微酸性水噴霧器
KR100647194B1 (ko) * 2005-06-08 2006-11-23 (주)수도프리미엄엔지니어링 반도체 소자 및 엘씨디 제조용 액상물의 분사장치 및 이를이용한 ｃｍｐ 장치
KR20090039784A (ko) * 2006-07-17 2009-04-22 셀레리티 인크. 고순도 물질을 처리하기 위한 시스템 및 방법
US7799115B2 (en) 2006-07-17 2010-09-21 Mega Fluid Systems, Inc. System and method for processing high purity materials
JP5297695B2 (ja) * 2008-05-30 2013-09-25 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 スラリー供給装置及び同装置を用いる半導体ウェーハの研磨方法
US20100206818A1 (en) * 2009-02-19 2010-08-19 Chartered Semiconductor Manufacturing, Ltd. Ultrasonic filtration for cmp slurry
JP5505713B2 (ja) * 2010-04-26 2014-05-28 株式会社Ｓｕｍｃｏ 研磨液分配装置及びこれを備えた研磨装置
US8992287B2 (en) * 2011-12-01 2015-03-31 Taiwan Semiconductor Manufacturing Co., Ltd. Slurry supply system for CMP process
US9770804B2 (en) 2013-03-18 2017-09-26 Versum Materials Us, Llc Slurry supply and/or chemical blend supply apparatuses, processes, methods of use and methods of manufacture
CN103639889A (zh) * 2013-12-05 2014-03-19 天津中环领先材料技术有限公司 一种用于无蜡抛光设备的配液供液装置及其使用方法
CN114750078B (zh) * 2022-06-13 2022-10-21 中国航发上海商用航空发动机制造有限责任公司 喷嘴、喷挡阀、以及光整装置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55106769A (en) * 1979-01-31 1980-08-15 Masami Masuko Lapping method and its apparatus
JPS5830112B2 (ja) 1979-07-25 1983-06-27 ウラジミ−ル、フヨ−ドロウイツチ、ウシヤコフ 研摩材含有懸濁液の調製供給機械
JPS5964276A (ja) 1982-09-30 1984-04-12 Sumitomo Electric Ind Ltd 研磨液供給装置
SU1516313A1 (ru) 1988-02-01 1989-10-23 Предприятие П/Я В-8450 Устройство дл подачи суспензии
US5803599A (en) * 1990-09-17 1998-09-08 Applied Chemical Solutions Apparatus and method for mixing chemicals to be used in chemical-mechanical polishing procedures
US5245790A (en) 1992-02-14 1993-09-21 Lsi Logic Corporation Ultrasonic energy enhanced chemi-mechanical polishing of silicon wafers
US5245796A (en) * 1992-04-02 1993-09-21 At&T Bell Laboratories Slurry polisher using ultrasonic agitation
JPH06106478A (ja) 1992-09-25 1994-04-19 Kyushu Electron Metal Co Ltd 研磨装置への研磨剤の供給方法とその供給装置
CA2111010A1 (en) 1993-01-29 1994-07-30 Robert James Hagerty Method of finely polishing planar optical elements
JPH07164320A (ja) 1993-12-15 1995-06-27 Y A Shii Kk 研磨液供給装置
JPH10503431A (ja) * 1994-07-19 1998-03-31 アプライド ケミカル ソルーションズ インコーポレーティッド 化学機械的研磨処理に用いるための装置及び方法
US5688364A (en) 1994-12-22 1997-11-18 Sony Corporation Chemical-mechanical polishing method and apparatus using ultrasound applied to the carrier and platen
JP2565146B2 (ja) * 1994-12-26 1996-12-18 日本電気株式会社 液体定量輸送装置
JPH09239661A (ja) 1996-03-04 1997-09-16 Nippei Toyama Corp 廃スラリ処理方法及びその装置
DE19546988A1 (de) 1995-12-15 1997-06-19 Wacker Siltronic Halbleitermat Verfahren und Vorrichtung zur Bearbeitung von Halbleitermaterial
US6059920A (en) * 1996-02-20 2000-05-09 Kabushiki Kaisha Toshiba Semiconductor device polishing apparatus having improved polishing liquid supplying apparatus, and polishing liquid supplying method
US5664990A (en) * 1996-07-29 1997-09-09 Integrated Process Equipment Corp. Slurry recycling in CMP apparatus
US5868608A (en) 1996-08-13 1999-02-09 Lsi Logic Corporation Subsonic to supersonic and ultrasonic conditioning of a polishing pad in a chemical mechanical polishing apparatus
US5857893A (en) * 1996-10-02 1999-01-12 Speedfam Corporation Methods and apparatus for measuring and dispensing processing solutions to a CMP machine
US5791970A (en) * 1997-04-07 1998-08-11 Yueh; William Slurry recycling system for chemical-mechanical polishing apparatus
US6024829A (en) * 1998-05-21 2000-02-15 Lucent Technologies Inc. Method of reducing agglomerate particles in a polishing slurry
US6053802A (en) * 1999-06-03 2000-04-25 Promos Technologies, Inc. Stabilization of slurry used in chemical mechanical polishing of semiconductor wafers by megasonic pulse

Also Published As

Publication number Publication date
EP0990486A4 (de) 2001-02-28
EP0990486B1 (de) 2004-04-14
WO1999029505A8 (fr) 1999-07-15
EP0990486A1 (de) 2000-04-05
WO1999029505A1 (fr) 1999-06-17
US6406364B1 (en) 2002-06-18
DE69823194T2 (de) 2005-04-21
KR20000070826A (ko) 2000-11-25
KR100567982B1 (ko) 2006-04-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee