DE69828834D1 - Ferroelektrische Speicherzelle und deren Herstellungsverfahren - Google Patents

Ferroelektrische Speicherzelle und deren Herstellungsverfahren

Info

Publication number
DE69828834D1
DE69828834D1 DE69828834T DE69828834T DE69828834D1 DE 69828834 D1 DE69828834 D1 DE 69828834D1 DE 69828834 T DE69828834 T DE 69828834T DE 69828834 T DE69828834 T DE 69828834T DE 69828834 D1 DE69828834 D1 DE 69828834D1
Authority
DE
Germany
Prior art keywords
memory cell
production process
ferroelectric memory
ferroelectric
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69828834T
Other languages
English (en)
Other versions
DE69828834T2 (de
Inventor
Sheng Teng Hsu
Jong Jan Lee
Chien-Hsiung Peng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Sharp Microelectronics Technology Inc
Original Assignee
Sharp Corp
Sharp Microelectronics Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/812,579 external-priority patent/US5731608A/en
Priority claimed from US08/834,499 external-priority patent/US6018171A/en
Priority claimed from US08/870,375 external-priority patent/US6048738A/en
Priority claimed from US08/869,534 external-priority patent/US5942776A/en
Priority claimed from US08/870,161 external-priority patent/US5932904A/en
Priority claimed from US08/905,380 external-priority patent/US5962884A/en
Application filed by Sharp Corp, Sharp Microelectronics Technology Inc filed Critical Sharp Corp
Application granted granted Critical
Publication of DE69828834D1 publication Critical patent/DE69828834D1/de
Publication of DE69828834T2 publication Critical patent/DE69828834T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H01L28/55—Capacitors with a dielectric comprising a perovskite structure material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H01L28/60—Electrodes
    • H01L28/65—Electrodes comprising a noble metal or a noble metal oxide, e.g. platinum (Pt), ruthenium (Ru), ruthenium dioxide (RuO2), iridium (Ir), iridium dioxide (IrO2)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/401—Multistep manufacturing processes
    • H01L29/4011—Multistep manufacturing processes for data storage electrodes
    • H01L29/40111—Multistep manufacturing processes for data storage electrodes the electrodes comprising a layer which is used for its ferroelectric properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/78391—Field effect transistors with field effect produced by an insulated gate the gate comprising a layer which is used for its ferroelectric properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B51/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B51/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory transistors
    • H10B51/30—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory transistors characterised by the memory core region
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
    • G11C11/223—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements using MOS with ferroelectric gate insulating film

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
  • Electrodes Of Semiconductors (AREA)
DE69828834T 1997-03-07 1998-03-06 Ferroelektrische Speicherzelle und deren Herstellungsverfahren Expired - Lifetime DE69828834T2 (de)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
US905380 1992-06-29
US08/812,579 US5731608A (en) 1997-03-07 1997-03-07 One transistor ferroelectric memory cell and method of making the same
US812579 1997-03-07
US834499 1997-04-04
US08/834,499 US6018171A (en) 1997-03-07 1997-04-04 Shallow junction ferroelectric memory cell having a laterally extending p-n junction and method of making the same
US08/870,375 US6048738A (en) 1997-03-07 1997-06-06 Method of making ferroelectric memory cell for VLSI RAM array
US08/869,534 US5942776A (en) 1997-03-07 1997-06-06 Shallow junction ferroelectric memory cell and method of making the same
US870375 1997-06-06
US869534 1997-06-06
US08/870,161 US5932904A (en) 1997-03-07 1997-06-06 Two transistor ferroelectric memory cell
US08/905,380 US5962884A (en) 1997-03-07 1997-08-04 Single transistor ferroelectric memory cell with asymmetrical ferroelectric polarization and method of making the same
US870161 2001-05-29

Publications (2)

Publication Number Publication Date
DE69828834D1 true DE69828834D1 (de) 2005-03-10
DE69828834T2 DE69828834T2 (de) 2006-01-12

Family

ID=27560309

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69828834T Expired - Lifetime DE69828834T2 (de) 1997-03-07 1998-03-06 Ferroelektrische Speicherzelle und deren Herstellungsverfahren

Country Status (4)

Country Link
EP (1) EP0869557B1 (de)
JP (1) JP4080050B2 (de)
KR (1) KR100288372B1 (de)
DE (1) DE69828834T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108807416A (zh) * 2017-05-03 2018-11-13 格芯公司 包括基于埋置铁电材料的储存机制的非易失性晶体管元件

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6011285A (en) * 1998-01-02 2000-01-04 Sharp Laboratories Of America, Inc. C-axis oriented thin film ferroelectric transistor memory cell and method of making the same
US6242771B1 (en) * 1998-01-02 2001-06-05 Sharp Laboratories Of America, Inc. Chemical vapor deposition of PB5GE3O11 thin film for ferroelectric applications
US6339238B1 (en) 1998-10-13 2002-01-15 Symetrix Corporation Ferroelectric field effect transistor, memory utilizing same, and method of operating same
US6441414B1 (en) 1998-10-13 2002-08-27 Symetrix Corporation Ferroelectric field effect transistor, memory utilizing same, and method of operating same
DE19850852A1 (de) * 1998-11-04 2000-05-11 Siemens Ag Ferroelektrischer Transistor und Verfahren zu dessen Herstellung
US6048740A (en) * 1998-11-05 2000-04-11 Sharp Laboratories Of America, Inc. Ferroelectric nonvolatile transistor and method of making same
US6151241A (en) * 1999-05-19 2000-11-21 Symetrix Corporation Ferroelectric memory with disturb protection
US6495878B1 (en) 1999-08-02 2002-12-17 Symetrix Corporation Interlayer oxide containing thin films for high dielectric constant application
CN1358326A (zh) * 1999-06-10 2002-07-10 塞姆特里克斯公司 高介电常数的金属氧化物薄膜
JP3390704B2 (ja) * 1999-08-26 2003-03-31 株式会社半導体理工学研究センター 強誘電体不揮発性メモリ
JP2001127265A (ja) * 1999-10-29 2001-05-11 Matsushita Electronics Industry Corp 半導体記憶装置およびその駆動方法
EP1126525A3 (de) 2000-02-15 2005-10-19 Matsushita Electric Industrial Co., Ltd. Halbleiterspeicheranordnung, deren Verfahren zum Treiben, und deren Herstellungsverfahren
EP1501128A1 (de) * 2003-07-23 2005-01-26 STMicroelectronics S.r.l. Dreidimensionale ferroeleektrische Speicherzelle und deren Herstellungsverfahren
JP2006073939A (ja) 2004-09-06 2006-03-16 Toshiba Corp 不揮発性半導体記憶装置及び不揮発性半導体記憶装置の製造方法
KR100772024B1 (ko) * 2006-04-14 2007-10-31 조선대학교산학협력단 Ｃｍｐ를 이용한 ｆｒａｍ 제조방법
KR100866314B1 (ko) * 2006-12-13 2008-11-03 서울시립대학교 산학협력단 엠에프엠에스형 전계효과 트랜지스터 및 강유전체 메모리장치
KR101559995B1 (ko) * 2007-10-26 2015-10-15 서울시립대학교 산학협력단 엠에프엠에스형 전계효과 트랜지스터 및 강유전체 메모리 장치와 이들의 제조방법
WO2009054707A2 (en) * 2007-10-26 2009-04-30 University Of Seoul Industry Cooperation Foundation Mfms-fet, ferroelectric memory device, and methods of manufacturing the same
KR101418593B1 (ko) * 2007-11-15 2014-07-10 서울시립대학교 산학협력단 엠에프엠에스형 전계효과 트랜지스터 및 강유전체 메모리장치

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3089671B2 (ja) * 1991-02-08 2000-09-18 日産自動車株式会社 半導体記憶装置
US5303182A (en) * 1991-11-08 1994-04-12 Rohm Co., Ltd. Nonvolatile semiconductor memory utilizing a ferroelectric film
US5541870A (en) * 1994-10-28 1996-07-30 Symetrix Corporation Ferroelectric memory and non-volatile memory cell for same
JP2982652B2 (ja) * 1995-04-21 1999-11-29 日本電気株式会社 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108807416A (zh) * 2017-05-03 2018-11-13 格芯公司 包括基于埋置铁电材料的储存机制的非易失性晶体管元件
CN108807416B (zh) * 2017-05-03 2023-06-20 格芯(美国)集成电路科技有限公司 包括基于埋置铁电材料的储存机制的非易失性晶体管元件

Also Published As

Publication number Publication date
JPH10294389A (ja) 1998-11-04
DE69828834T2 (de) 2006-01-12
EP0869557B1 (de) 2005-02-02
EP0869557A3 (de) 1999-01-07
KR100288372B1 (ko) 2001-06-01
EP0869557A2 (de) 1998-10-07
JP4080050B2 (ja) 2008-04-23
KR19980080005A (ko) 1998-11-25

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