DE69819081D1 - Feines Kupferpulver und Verfahren seiner Herstellung - Google Patents
Feines Kupferpulver und Verfahren seiner HerstellungInfo
- Publication number
- DE69819081D1 DE69819081D1 DE69819081T DE69819081T DE69819081D1 DE 69819081 D1 DE69819081 D1 DE 69819081D1 DE 69819081 T DE69819081 T DE 69819081T DE 69819081 T DE69819081 T DE 69819081T DE 69819081 D1 DE69819081 D1 DE 69819081D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacture
- copper powder
- fine copper
- fine
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14633697 | 1997-06-04 | ||
JP9146336A JP2911429B2 (ja) | 1997-06-04 | 1997-06-04 | 銅微粉末の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69819081D1 true DE69819081D1 (de) | 2003-11-27 |
DE69819081T2 DE69819081T2 (de) | 2004-07-08 |
Family
ID=15405395
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69819081T Expired - Lifetime DE69819081T2 (de) | 1997-06-04 | 1998-05-29 | Feines Kupferpulver und Verfahren seiner Herstellung |
Country Status (7)
Country | Link |
---|---|
US (2) | US6174344B1 (de) |
EP (1) | EP0887132B1 (de) |
JP (1) | JP2911429B2 (de) |
KR (1) | KR100480863B1 (de) |
DE (1) | DE69819081T2 (de) |
ES (1) | ES2205319T3 (de) |
TW (1) | TW374030B (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2911429B2 (ja) * | 1997-06-04 | 1999-06-23 | 三井金属鉱業株式会社 | 銅微粉末の製造方法 |
KR100743844B1 (ko) * | 1999-12-01 | 2007-08-02 | 도와 마이닝 가부시끼가이샤 | 구리 분말 및 구리 분말의 제조 방법 |
US6332895B1 (en) * | 2000-03-08 | 2001-12-25 | Loubert Suddaby | Expandable intervertebral fusion implant having improved stability |
JP3473548B2 (ja) * | 2000-04-27 | 2003-12-08 | 株式会社村田製作所 | 金属粉末の製造方法,金属粉末,これを用いた導電性ペーストならびにこれを用いた積層セラミック電子部品 |
US6881240B2 (en) * | 2000-09-18 | 2005-04-19 | Dowa Mining Co., Ltd. | Copper powder for electrically conductive paste |
JP4195581B2 (ja) * | 2002-05-27 | 2008-12-10 | 三井金属鉱業株式会社 | 銅粉の製造方法及びその方法で得られた銅粉 |
JP4490305B2 (ja) | 2005-02-18 | 2010-06-23 | Dowaホールディングス株式会社 | 銅粉 |
JP4821014B2 (ja) | 2005-03-22 | 2011-11-24 | Dowaエレクトロニクス株式会社 | 銅粉の製造法 |
US7517382B2 (en) * | 2005-04-20 | 2009-04-14 | Gang Zhao | Production of fine particle copper powders |
JP4934993B2 (ja) * | 2005-05-25 | 2012-05-23 | 住友電気工業株式会社 | 導電性ペーストおよびそれを用いた配線基板 |
US20070039417A1 (en) * | 2005-08-18 | 2007-02-22 | Dehuan Huang | Method for preparing nano-complex-powder comprising multiple components and silver |
JP5144022B2 (ja) * | 2006-03-24 | 2013-02-13 | 三井金属鉱業株式会社 | 銅粉の製造方法及びその製造方法で得られた銅粉 |
JP4924167B2 (ja) * | 2006-04-13 | 2012-04-25 | 日立化成工業株式会社 | 導電性ペースト、並びにこれを用いたプリプレグ、金属箔張積層板、及びプリント配線板 |
JP4748279B2 (ja) * | 2006-04-13 | 2011-08-17 | 日立化成工業株式会社 | 導電性ペースト、並びにこれを用いたプリプレグ、金属箔張積層板、及びプリント配線板 |
JP4660784B2 (ja) * | 2006-12-01 | 2011-03-30 | Dowaエレクトロニクス株式会社 | 導電ペースト |
EP2185474B1 (de) * | 2007-07-31 | 2011-02-09 | Umicore | Hydrometallurgisches verfahren zur herstellung von kupferoxid |
JP5392884B2 (ja) * | 2007-09-21 | 2014-01-22 | 三井金属鉱業株式会社 | 銅粉の製造方法 |
JP2010018675A (ja) * | 2008-07-09 | 2010-01-28 | Mitsuboshi Belting Ltd | 厚膜形成用ペースト |
JP5606421B2 (ja) * | 2011-10-27 | 2014-10-15 | 株式会社日立製作所 | 銅ナノ粒子を用いた焼結性接合材料及びその製造方法及び電子部材の接合方法 |
CN102590406B (zh) * | 2012-01-16 | 2013-12-18 | 湖南中烟工业有限责任公司 | 基于气相色谱-质谱分析数据的三维信息对比分析方法 |
SG2013066683A (en) * | 2012-09-10 | 2014-04-28 | Heraeus Precious Metals North America Conshohocken Llc | Low firing temperature copper composition |
KR101397980B1 (ko) | 2012-10-08 | 2014-05-27 | 한국지질자원연구원 | 구리이온을 포함하는 혼합 용액으로부터 구리이온을 제거하여 분말을 형성하는 구리분말 제조 방법 |
CN102941351B (zh) * | 2012-11-27 | 2015-08-26 | 中国船舶重工集团公司第七一二研究所 | 一种超细铜粉的制备方法 |
JP6225783B2 (ja) * | 2014-03-25 | 2017-11-08 | 住友金属鉱山株式会社 | 銅微粒子、導電ペースト組成物及びこれらの製造方法 |
CN104084599B (zh) * | 2014-08-02 | 2016-03-30 | 天津市职业大学 | 一种导电银浆用超细球形银粉的生产方法 |
US10347388B2 (en) * | 2015-03-05 | 2019-07-09 | Namics Corporation | Conductive copper paste, conductive copper paste cured film, and semiconductor device |
TWI652695B (zh) * | 2017-08-16 | 2019-03-01 | 昇貿科技股份有限公司 | Liquid composition |
JP6549298B1 (ja) * | 2018-09-21 | 2019-07-24 | Jx金属株式会社 | 易解砕性銅粉及びその製造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6381706A (ja) * | 1986-09-26 | 1988-04-12 | 三井金属鉱業株式会社 | 銅系厚膜用組成物 |
US4944797A (en) * | 1989-01-03 | 1990-07-31 | Gte Products Corporation | Low oxygen content fine spherical copper particles and process for producing same by fluid energy milling and high temperature processing |
JPH0793051B2 (ja) * | 1989-01-26 | 1995-10-09 | 第一工業製薬株式会社 | 銅導体組成物 |
JP2728726B2 (ja) * | 1989-05-10 | 1998-03-18 | 正同化学工業株式会社 | 微粒子銅粉末の製造方法 |
JP2638271B2 (ja) | 1990-09-06 | 1997-08-06 | 住友金属工業株式会社 | 銅微粉末の製造方法 |
JPH04235205A (ja) | 1991-01-09 | 1992-08-24 | Sumitomo Metal Ind Ltd | 銅粉の製造方法 |
JPH05221637A (ja) * | 1992-02-10 | 1993-08-31 | Sumitomo Metal Ind Ltd | 酸化第一銅粉末および銅粉末の製造方法 |
JPH0768562B2 (ja) * | 1992-11-25 | 1995-07-26 | 三井金属鉱業株式会社 | 半田付け可能な導電性塗料用銅粉の製造方法 |
JPH07233403A (ja) * | 1994-02-24 | 1995-09-05 | Mitsui Mining & Smelting Co Ltd | スルーホール形成導電性組成物用銅粉 |
JPH093510A (ja) * | 1995-06-22 | 1997-01-07 | Fukuda Metal Foil & Powder Co Ltd | 金属粉末射出成形用銅粉末及びそれを用いた射出 成形品の製造方法 |
JP2911429B2 (ja) * | 1997-06-04 | 1999-06-23 | 三井金属鉱業株式会社 | 銅微粉末の製造方法 |
-
1997
- 1997-06-04 JP JP9146336A patent/JP2911429B2/ja not_active Expired - Lifetime
-
1998
- 1998-05-29 EP EP98109915A patent/EP0887132B1/de not_active Expired - Lifetime
- 1998-05-29 DE DE69819081T patent/DE69819081T2/de not_active Expired - Lifetime
- 1998-05-29 ES ES98109915T patent/ES2205319T3/es not_active Expired - Lifetime
- 1998-06-02 US US09/088,490 patent/US6174344B1/en not_active Expired - Lifetime
- 1998-06-03 KR KR10-1998-0020679A patent/KR100480863B1/ko not_active IP Right Cessation
- 1998-06-04 TW TW087108792A patent/TW374030B/zh not_active IP Right Cessation
-
2000
- 2000-11-17 US US09/714,198 patent/US6391087B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW374030B (en) | 1999-11-11 |
EP0887132A2 (de) | 1998-12-30 |
ES2205319T3 (es) | 2004-05-01 |
JPH10330801A (ja) | 1998-12-15 |
EP0887132B1 (de) | 2003-10-22 |
JP2911429B2 (ja) | 1999-06-23 |
US6174344B1 (en) | 2001-01-16 |
KR100480863B1 (ko) | 2005-08-29 |
EP0887132A3 (de) | 2001-11-14 |
US6391087B1 (en) | 2002-05-21 |
DE69819081T2 (de) | 2004-07-08 |
KR19990006665A (ko) | 1999-01-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8327 | Change in the person/name/address of the patent owner |
Owner name: MITSUI MINING CO., LTD., TOKIO/TOKYO, JP |
|
8364 | No opposition during term of opposition |