DE69811600T2 - Halbleiterlasermodul - Google Patents

Halbleiterlasermodul

Info

Publication number
DE69811600T2
DE69811600T2 DE69811600T DE69811600T DE69811600T2 DE 69811600 T2 DE69811600 T2 DE 69811600T2 DE 69811600 T DE69811600 T DE 69811600T DE 69811600 T DE69811600 T DE 69811600T DE 69811600 T2 DE69811600 T2 DE 69811600T2
Authority
DE
Germany
Prior art keywords
semiconductor laser
laser module
module
semiconductor
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69811600T
Other languages
English (en)
Other versions
DE69811600D1 (de
Inventor
Tomonari Kosugi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of DE69811600D1 publication Critical patent/DE69811600D1/de
Application granted granted Critical
Publication of DE69811600T2 publication Critical patent/DE69811600T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02438—Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)
DE69811600T 1997-10-24 1998-10-23 Halbleiterlasermodul Expired - Lifetime DE69811600T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29259497A JP3226854B2 (ja) 1997-10-24 1997-10-24 半導体レーザモジュール

Publications (2)

Publication Number Publication Date
DE69811600D1 DE69811600D1 (de) 2003-04-03
DE69811600T2 true DE69811600T2 (de) 2003-09-04

Family

ID=17783811

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69811600T Expired - Lifetime DE69811600T2 (de) 1997-10-24 1998-10-23 Halbleiterlasermodul

Country Status (4)

Country Link
US (1) US6116792A (de)
EP (1) EP0911923B1 (de)
JP (1) JP3226854B2 (de)
DE (1) DE69811600T2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6161028A (en) * 1999-03-10 2000-12-12 Optiscan Biomedical Corporation Method for determining analyte concentration using periodic temperature modulation and phase detection
KR100396360B1 (ko) * 2000-11-16 2003-09-02 주식회사 솔고 바이오메디칼 고출력 반도체 레이저 모듈
US20030002825A1 (en) * 2001-07-02 2003-01-02 Karker Jeffrey A. Carrier sub-assembly with inserts and method for making the same
JP2003324238A (ja) * 2002-05-02 2003-11-14 Sumitomo Electric Ind Ltd レーザモジュールおよび光ネットワーク
JP3977315B2 (ja) 2003-10-31 2007-09-19 ファイベスト株式会社 光通信器、光通信システムおよび光送受信器
US7426225B2 (en) 2004-02-19 2008-09-16 Sumitomo Electric Industries, Ltd. Optical sub-assembly having a thermo-electric cooler and an optical transceiver using the optical sub-assembly
JP4515298B2 (ja) * 2005-03-22 2010-07-28 富士フイルム株式会社 レーザー装置の組立方法
JP2009224494A (ja) * 2008-03-14 2009-10-01 Fujitsu Ltd 光半導体装置
CN204315911U (zh) * 2012-06-22 2015-05-06 古河电气工业株式会社 光学元件模块
US11556047B2 (en) 2019-08-16 2023-01-17 Tdk Taiwan Corp. Optical member driving mechanism including matrix structure that corresponds to noise

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH058511A (ja) * 1991-07-04 1993-01-19 Seiko Epson Corp プリンタ
JPH0555710A (ja) * 1991-08-23 1993-03-05 Nec Corp 半導体レーザモジユール
JPH05315696A (ja) * 1992-05-06 1993-11-26 Nec Corp 半導体レーザモジュール
JPH06169133A (ja) * 1992-11-30 1994-06-14 Ando Electric Co Ltd 電子冷却素子付半導体レーザモジュール
JPH07131106A (ja) * 1993-10-29 1995-05-19 Nec Corp 半導体レーザモジュール
JP3116777B2 (ja) * 1995-07-07 2000-12-11 日本電気株式会社 半導体レーザモジュール
JPH0990174A (ja) * 1995-09-28 1997-04-04 Furukawa Electric Co Ltd:The 半導体レーザモジュール
JPH09251120A (ja) * 1996-03-15 1997-09-22 Nec Corp 半導体レーザモジュール
JP2828025B2 (ja) * 1996-03-29 1998-11-25 日本電気株式会社 半導体レーザモジュール
JP3047352B2 (ja) * 1996-06-28 2000-05-29 日本電気株式会社 温度制御型光結合構造
JP3480223B2 (ja) * 1997-02-28 2003-12-15 松下電器産業株式会社 スピーカボックス装置

Also Published As

Publication number Publication date
EP0911923A2 (de) 1999-04-28
EP0911923B1 (de) 2003-02-26
US6116792A (en) 2000-09-12
EP0911923A3 (de) 2000-06-14
JP3226854B2 (ja) 2001-11-05
JPH11126946A (ja) 1999-05-11
DE69811600D1 (de) 2003-04-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition