DE69807602D1 - Resistzusammensetzungen - Google Patents
ResistzusammensetzungenInfo
- Publication number
- DE69807602D1 DE69807602D1 DE69807602T DE69807602T DE69807602D1 DE 69807602 D1 DE69807602 D1 DE 69807602D1 DE 69807602 T DE69807602 T DE 69807602T DE 69807602 T DE69807602 T DE 69807602T DE 69807602 D1 DE69807602 D1 DE 69807602D1
- Authority
- DE
- Germany
- Prior art keywords
- resist compositions
- resist
- compositions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000203 mixture Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18581497 | 1997-06-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69807602D1 true DE69807602D1 (de) | 2002-10-10 |
DE69807602T2 DE69807602T2 (de) | 2003-06-05 |
Family
ID=16177359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69807602T Expired - Lifetime DE69807602T2 (de) | 1997-06-26 | 1998-06-26 | Resistzusammensetzungen |
Country Status (5)
Country | Link |
---|---|
US (1) | US6274286B1 (de) |
EP (1) | EP0887705B1 (de) |
KR (1) | KR100539641B1 (de) |
DE (1) | DE69807602T2 (de) |
TW (1) | TW526390B (de) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6852466B2 (en) * | 1998-12-23 | 2005-02-08 | Shipley Company, L.L.C. | Photoresist compositions particularly suitable for short wavelength imaging |
US6638684B2 (en) * | 1999-08-31 | 2003-10-28 | Tokyo Ohka Kogyo Co., Ltd. | Photosensitive laminate, process for forming resist pattern using same and positive resist composition |
US6673511B1 (en) * | 1999-10-29 | 2004-01-06 | Shin-Etsu Chemical Co., Ltd. | Resist composition |
US7192681B2 (en) * | 2001-07-05 | 2007-03-20 | Fuji Photo Film Co., Ltd. | Positive photosensitive composition |
US6645696B1 (en) * | 2001-11-30 | 2003-11-11 | Euv Llc. | Photoimageable composition |
US20040166434A1 (en) | 2003-02-21 | 2004-08-26 | Dammel Ralph R. | Photoresist composition for deep ultraviolet lithography |
JP4235466B2 (ja) * | 2003-02-24 | 2009-03-11 | Azエレクトロニックマテリアルズ株式会社 | 水溶性樹脂組成物、パターン形成方法及びレジストパターンの検査方法 |
EP1598701A4 (de) * | 2003-02-25 | 2009-12-09 | Tokyo Ohka Kogyo Co Ltd | Fotoresistzusammensetzung und verfahren zur bildung einer resiststruktur |
JP4012480B2 (ja) * | 2003-03-28 | 2007-11-21 | Azエレクトロニックマテリアルズ株式会社 | 微細パターン形成補助剤及びその製造法 |
JP2004334060A (ja) * | 2003-05-12 | 2004-11-25 | Shin Etsu Chem Co Ltd | 化学増幅型レジスト用光酸発生剤及びそれを含有するレジスト材料並びにパターン形成方法 |
US7189491B2 (en) * | 2003-12-11 | 2007-03-13 | Az Electronic Materials Usa Corp. | Photoresist composition for deep UV and process thereof |
US7595141B2 (en) * | 2004-10-26 | 2009-09-29 | Az Electronic Materials Usa Corp. | Composition for coating over a photoresist pattern |
US7537879B2 (en) | 2004-11-22 | 2009-05-26 | Az Electronic Materials Usa Corp. | Photoresist composition for deep UV and process thereof |
JP5203575B2 (ja) * | 2005-05-04 | 2013-06-05 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | コーティング組成物 |
US7255970B2 (en) * | 2005-07-12 | 2007-08-14 | Az Electronic Materials Usa Corp. | Photoresist composition for imaging thick films |
US20070105040A1 (en) * | 2005-11-10 | 2007-05-10 | Toukhy Medhat A | Developable undercoating composition for thick photoresist layers |
JP4857138B2 (ja) * | 2006-03-23 | 2012-01-18 | 富士フイルム株式会社 | レジスト組成物及びそれを用いたパターン形成方法 |
US7923200B2 (en) * | 2007-04-09 | 2011-04-12 | Az Electronic Materials Usa Corp. | Composition for coating over a photoresist pattern comprising a lactam |
JP5069494B2 (ja) * | 2007-05-01 | 2012-11-07 | AzエレクトロニックマテリアルズIp株式会社 | 微細化パターン形成用水溶性樹脂組成物およびこれを用いた微細パターン形成方法 |
US20090042148A1 (en) * | 2007-08-06 | 2009-02-12 | Munirathna Padmanaban | Photoresist Composition for Deep UV and Process Thereof |
JP5071658B2 (ja) * | 2008-02-14 | 2012-11-14 | 信越化学工業株式会社 | レジスト材料、レジスト保護膜材料、及びパターン形成方法 |
JP4703674B2 (ja) * | 2008-03-14 | 2011-06-15 | 富士フイルム株式会社 | レジスト組成物及びそれを用いたパターン形成方法 |
US7745077B2 (en) * | 2008-06-18 | 2010-06-29 | Az Electronic Materials Usa Corp. | Composition for coating over a photoresist pattern |
US8168367B2 (en) | 2008-07-11 | 2012-05-01 | Shin-Etsu Chemical Co., Ltd. | Resist composition and patterning process |
US20100081085A1 (en) * | 2008-09-29 | 2010-04-01 | Sumitomo Chemical Company, Limited | Polymer and Resist Composition Comprising the Same |
JP5593180B2 (ja) | 2009-09-16 | 2014-09-17 | 富士フイルム株式会社 | 感活性光線性又は感放射線性樹脂組成物、及びそれを用いたパターン形成方法 |
US8852848B2 (en) | 2010-07-28 | 2014-10-07 | Z Electronic Materials USA Corp. | Composition for coating over a photoresist pattern |
JP5527236B2 (ja) | 2011-01-31 | 2014-06-18 | 信越化学工業株式会社 | ポジ型化学増幅レジスト材料、パターン形成方法及び酸分解性ケトエステル化合物 |
US8871425B2 (en) | 2012-02-09 | 2014-10-28 | Az Electronic Materials (Luxembourg) S.A.R.L. | Low dielectric photoimageable compositions and electronic devices made therefrom |
TWI717543B (zh) | 2016-08-09 | 2021-02-01 | 德商馬克專利公司 | 光阻組合物及其用途 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63149640A (ja) | 1986-12-12 | 1988-06-22 | Konica Corp | 感光性組成物および感光性平版印刷版 |
CA2000855A1 (en) * | 1988-11-17 | 1990-05-17 | Mohammad Z. Ali | Triazine photoinitiators in a ternary system for addition polymerization |
JP3010607B2 (ja) | 1992-02-25 | 2000-02-21 | ジェイエスアール株式会社 | 感放射線性樹脂組成物 |
JPH05289322A (ja) | 1992-04-10 | 1993-11-05 | Hitachi Ltd | パタン形成材料及びそれを用いたパタン形成方法 |
JP3293940B2 (ja) | 1993-03-12 | 2002-06-17 | 株式会社東芝 | 感光性組成物及びそれを用いたパターン形成方法 |
JPH0792678A (ja) | 1993-06-29 | 1995-04-07 | Nippon Zeon Co Ltd | レジスト組成物 |
JPH07120929A (ja) | 1993-09-01 | 1995-05-12 | Toshiba Corp | 感光性組成物 |
JP3297199B2 (ja) | 1993-09-14 | 2002-07-02 | 株式会社東芝 | レジスト組成物 |
JPH07128859A (ja) | 1993-11-04 | 1995-05-19 | Wako Pure Chem Ind Ltd | レジスト組成物 |
JP3203995B2 (ja) | 1993-12-24 | 2001-09-04 | ジェイエスアール株式会社 | 感放射線性樹脂組成物 |
EP0780732B1 (de) * | 1995-12-21 | 2003-07-09 | Wako Pure Chemical Industries Ltd | Polymerzusammensetzung und Rezistmaterial |
TW574629B (en) * | 1997-02-28 | 2004-02-01 | Shinetsu Chemical Co | Polystyrene derivative chemically amplified positive resist compositions, and patterning method |
US6048661A (en) * | 1997-03-05 | 2000-04-11 | Shin-Etsu Chemical Co., Ltd. | Polymeric compounds, chemically amplified positive type resist materials and process for pattern formation |
-
1998
- 1998-06-25 TW TW087110416A patent/TW526390B/zh active
- 1998-06-26 DE DE69807602T patent/DE69807602T2/de not_active Expired - Lifetime
- 1998-06-26 US US09/105,003 patent/US6274286B1/en not_active Expired - Lifetime
- 1998-06-26 EP EP98305072A patent/EP0887705B1/de not_active Expired - Lifetime
- 1998-06-26 KR KR1019980024358A patent/KR100539641B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0887705B1 (de) | 2002-09-04 |
TW526390B (en) | 2003-04-01 |
EP0887705A1 (de) | 1998-12-30 |
KR19990007372A (ko) | 1999-01-25 |
DE69807602T2 (de) | 2003-06-05 |
KR100539641B1 (ko) | 2006-04-21 |
US6274286B1 (en) | 2001-08-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |