DE69805391D1 - Mehrschichtiger Hochfrequenzbauteil - Google Patents

Mehrschichtiger Hochfrequenzbauteil

Info

Publication number
DE69805391D1
DE69805391D1 DE69805391T DE69805391T DE69805391D1 DE 69805391 D1 DE69805391 D1 DE 69805391D1 DE 69805391 T DE69805391 T DE 69805391T DE 69805391 T DE69805391 T DE 69805391T DE 69805391 D1 DE69805391 D1 DE 69805391D1
Authority
DE
Germany
Prior art keywords
frequency component
layer high
layer
frequency
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69805391T
Other languages
English (en)
Other versions
DE69805391T2 (de
Inventor
Koji Nosaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of DE69805391D1 publication Critical patent/DE69805391D1/de
Application granted granted Critical
Publication of DE69805391T2 publication Critical patent/DE69805391T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/0026—Multilayer LC-filter
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021—Constructional details
    • H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Filters And Equalizers (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE69805391T 1997-12-19 1998-12-07 Mehrschichtiger Hochfrequenzbauteil Expired - Lifetime DE69805391T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35028397A JP3307307B2 (ja) 1997-12-19 1997-12-19 多層型高周波電子部品

Publications (2)

Publication Number Publication Date
DE69805391D1 true DE69805391D1 (de) 2002-06-20
DE69805391T2 DE69805391T2 (de) 2002-08-29

Family

ID=18409452

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69805391T Expired - Lifetime DE69805391T2 (de) 1997-12-19 1998-12-07 Mehrschichtiger Hochfrequenzbauteil

Country Status (4)

Country Link
US (1) US6115264A (de)
EP (1) EP0926933B1 (de)
JP (1) JP3307307B2 (de)
DE (1) DE69805391T2 (de)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3307307B2 (ja) * 1997-12-19 2002-07-24 株式会社村田製作所 多層型高周波電子部品
JP2002118367A (ja) * 1999-09-02 2002-04-19 Ibiden Co Ltd プリント配線板及びプリント配線板の製造方法
US6876554B1 (en) 1999-09-02 2005-04-05 Ibiden Co., Ltd. Printing wiring board and method of producing the same and capacitor to be contained in printed wiring board
EP1139705B1 (de) 1999-09-02 2006-11-22 Ibiden Co., Ltd. Leiterplatte und verfahren zu ihrer herstellung
JP2002118365A (ja) * 1999-09-02 2002-04-19 Ibiden Co Ltd プリント配線板及びプリント配線板の製造方法
JP4646370B2 (ja) * 1999-09-02 2011-03-09 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
JP3480384B2 (ja) 1999-09-10 2003-12-15 株式会社村田製作所 積層型ｌｃ共振器および積層型ｌｃフィルタ
JP2001085965A (ja) * 1999-09-10 2001-03-30 Murata Mfg Co Ltd 積層型ｌｃ共振器および積層型ｌｃフィルタ
JP2001210527A (ja) * 2000-01-27 2001-08-03 Philips Japan Ltd 電子部品及び電子部品複合体
US6441459B1 (en) * 2000-01-28 2002-08-27 Tdk Corporation Multilayer electronic device and method for producing same
JP2001332950A (ja) * 2000-05-22 2001-11-30 Murata Mfg Co Ltd 低域通過フィルタ及びそれを用いた移動体通信装置
JP2002204072A (ja) * 2000-12-28 2002-07-19 Sanyo Electric Co Ltd 複合積層セラミック基板およびその製造方法
US6710255B2 (en) * 2001-03-30 2004-03-23 Intel Corporation Printed circuit board having buried intersignal capacitance and method of making
KR20030089845A (ko) * 2002-05-20 2003-11-28 (주) 래트론 무극성의 적층 타입 칩형 노이즈 필터
TWI264969B (en) * 2003-11-28 2006-10-21 Murata Manufacturing Co Multilayer ceramic electronic component and its manufacturing method
JP4211591B2 (ja) * 2003-12-05 2009-01-21 株式会社村田製作所 積層型電子部品の製造方法および積層型電子部品
CN101053287A (zh) * 2004-10-08 2007-10-10 松下电器产业株式会社 积层陶瓷部件及其制造方法
JP4618206B2 (ja) * 2006-07-18 2011-01-26 Ｔｄｋ株式会社 Ｌｃフィルタ
JP2009111284A (ja) 2007-10-31 2009-05-21 Soshin Electric Co Ltd 電子部品及び受動部品
JP5217584B2 (ja) * 2008-04-07 2013-06-19 株式会社村田製作所 積層セラミック電子部品
DE102008020597B4 (de) * 2008-04-24 2017-11-23 Epcos Ag Schaltungsanordnung
JP2011238016A (ja) * 2010-05-10 2011-11-24 Sony Corp 非接触通信媒体、アンテナパターン配置媒体、通信装置及びアンテナ調整方法
WO2014181681A1 (ja) * 2013-05-09 2014-11-13 株式会社村田製作所 Ｌｃ並列共振素子および帯域阻止フィルタ
JP6380321B2 (ja) * 2015-09-29 2018-08-29 株式会社村田製作所 Ｌｃ並列共振器および積層帯域通過フィルタ
US9852988B2 (en) 2015-12-18 2017-12-26 Invensas Bonding Technologies, Inc. Increased contact alignment tolerance for direct bonding
KR101832608B1 (ko) 2016-05-25 2018-02-26 삼성전기주식회사 코일 전자 부품 및 그 제조방법
US10446487B2 (en) 2016-09-30 2019-10-15 Invensas Bonding Technologies, Inc. Interface structures and methods for forming same
US10580735B2 (en) 2016-10-07 2020-03-03 Xcelsis Corporation Stacked IC structure with system level wiring on multiple sides of the IC die
TWI837879B (zh) 2016-12-29 2024-04-01 美商艾德亞半導體接合科技有限公司 具有整合式被動構件的接合結構
US10629577B2 (en) 2017-03-16 2020-04-21 Invensas Corporation Direct-bonded LED arrays and applications
WO2018183739A1 (en) 2017-03-31 2018-10-04 Invensas Bonding Technologies, Inc. Interface structures and methods for forming same
FR3073662B1 (fr) * 2017-11-14 2022-01-21 Arjo Wiggins Fine Papers Ltd Inducteur multicouches
US11169326B2 (en) 2018-02-26 2021-11-09 Invensas Bonding Technologies, Inc. Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects
KR102080651B1 (ko) * 2018-05-28 2020-02-24 삼성전기주식회사 코일 부품
US11515291B2 (en) 2018-08-28 2022-11-29 Adeia Semiconductor Inc. Integrated voltage regulator and passive components
US11901281B2 (en) 2019-03-11 2024-02-13 Adeia Semiconductor Bonding Technologies Inc. Bonded structures with integrated passive component
US11762200B2 (en) 2019-12-17 2023-09-19 Adeia Semiconductor Bonding Technologies Inc. Bonded optical devices

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5126707A (en) * 1989-12-25 1992-06-30 Takeshi Ikeda Laminated lc element and method for manufacturing the same
JPH03215915A (ja) * 1990-01-19 1991-09-20 Murata Mfg Co Ltd 積層コンデンサ
JP3114323B2 (ja) * 1992-01-10 2000-12-04 株式会社村田製作所 積層チップコモンモードチョークコイル
JP2773617B2 (ja) * 1993-12-17 1998-07-09 株式会社村田製作所 バルントランス
US5610565A (en) * 1994-02-02 1997-03-11 Murata Manufacturing Co., Ltd. Composite LC device with a ground electrode not formed on the inductor parts
WO1997012440A1 (en) * 1995-09-25 1997-04-03 Alliedsignal Inc. Planar electronic network
JP3106942B2 (ja) * 1995-12-28 2000-11-06 株式会社村田製作所 Ｌｃ共振部品
US5880662A (en) * 1997-08-21 1999-03-09 Dale Electronics, Inc. High self resonant frequency multilayer inductor and method for making same
JP3307307B2 (ja) * 1997-12-19 2002-07-24 株式会社村田製作所 多層型高周波電子部品

Also Published As

Publication number Publication date
EP0926933B1 (de) 2002-05-15
EP0926933A1 (de) 1999-06-30
DE69805391T2 (de) 2002-08-29
US6115264A (en) 2000-09-05
JPH11186038A (ja) 1999-07-09
JP3307307B2 (ja) 2002-07-24

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Legal Events

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8364 No opposition during term of opposition