DE69737328D1 - Niedertemperaturverfahren und zusammensetzungen zur herstellung elektischer leiter - Google Patents
Niedertemperaturverfahren und zusammensetzungen zur herstellung elektischer leiterInfo
- Publication number
- DE69737328D1 DE69737328D1 DE69737328T DE69737328T DE69737328D1 DE 69737328 D1 DE69737328 D1 DE 69737328D1 DE 69737328 T DE69737328 T DE 69737328T DE 69737328 T DE69737328 T DE 69737328T DE 69737328 D1 DE69737328 D1 DE 69737328D1
- Authority
- DE
- Germany
- Prior art keywords
- compositions
- production
- low temperature
- temperature processes
- electric ladder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000203 mixture Substances 0.000 title abstract 3
- 239000004020 conductor Substances 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 239000000843 powder Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
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- H01L2924/01—Chemical elements
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- H01L2924/01—Chemical elements
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
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- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Dispersion Chemistry (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Nanotechnology (AREA)
- Ceramic Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Organic Insulating Materials (AREA)
Applications Claiming Priority (15)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US3845397P | 1997-02-20 | 1997-02-20 | |
US3867097P | 1997-02-20 | 1997-02-20 | |
US3851497P | 1997-02-20 | 1997-02-20 | |
US3866997P | 1997-02-20 | 1997-02-20 | |
US38670P | 1997-02-20 | ||
US38514P | 1997-02-20 | ||
US38453P | 1997-02-20 | ||
US38669P | 1997-02-20 | ||
US4654197P | 1997-05-15 | 1997-05-15 | |
US4655297P | 1997-05-15 | 1997-05-15 | |
US4654097P | 1997-05-15 | 1997-05-15 | |
US46541P | 1997-05-15 | ||
US46552P | 1997-05-15 | ||
US46540P | 1997-05-15 | ||
PCT/US1997/016226 WO1998037133A1 (en) | 1997-02-20 | 1997-09-12 | Low temperature method and compositions for producing electrical conductors |
Publications (2)
Publication Number | Publication Date |
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DE69737328D1 true DE69737328D1 (de) | 2007-03-22 |
DE69737328T2 DE69737328T2 (de) | 2007-11-22 |
Family
ID=27567891
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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DE69737328T Expired - Fee Related DE69737328T2 (de) | 1997-02-20 | 1997-09-12 | Niedertemperaturverfahren und zusammensetzungen zur herstellung elektischer leiter |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0961809B1 (de) |
JP (1) | JP3585244B2 (de) |
KR (1) | KR100532734B1 (de) |
AT (1) | ATE353536T1 (de) |
AU (1) | AU4269697A (de) |
CA (1) | CA2280115C (de) |
DE (1) | DE69737328T2 (de) |
WO (1) | WO1998037133A1 (de) |
Families Citing this family (39)
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US6143356A (en) * | 1999-08-06 | 2000-11-07 | Parelec, Inc. | Diffusion barrier and adhesive for PARMOD™ application to rigid printed wiring boards |
TW511122B (en) * | 1999-12-10 | 2002-11-21 | Ebara Corp | Method for mounting semiconductor device and structure thereof |
JP5060695B2 (ja) * | 1999-12-21 | 2012-10-31 | プラスティック ロジック リミテッド | 電子素子配列から電子回路を構成する方法および該方法により形成される電子回路 |
JP4596444B2 (ja) * | 2001-03-23 | 2010-12-08 | 大日本印刷株式会社 | オフセット印刷による電極パターンの形成方法 |
JP2004534362A (ja) * | 2001-06-28 | 2004-11-11 | パレレック,インコーポレイテッド | 導電体製造のための低温方法および組成物 |
US6591496B2 (en) | 2001-08-28 | 2003-07-15 | 3M Innovative Properties Company | Method for making embedded electrical traces |
KR100884995B1 (ko) * | 2002-06-12 | 2009-02-20 | 엘지디스플레이 주식회사 | 액정표시장치의 공정라인 및 이를 이용한 제조방법 |
KR20060012545A (ko) * | 2002-07-03 | 2006-02-08 | 나노파우더스 인더스트리어스 리미티드. | 저온 소결처리한 전도성 나노 잉크 및 이것의 제조 방법 |
US20040178391A1 (en) * | 2003-01-29 | 2004-09-16 | Conaghan Brian F. | High conductivity inks with low minimum curing temperatures |
KR100545288B1 (ko) | 2003-03-28 | 2006-01-25 | 주식회사 잉크테크 | 유기은 조성물 및 그 제조방법, 그로부터 제조되는 잉크및 그 잉크를 이용한 도전배선 형성 방법 |
JP4965252B2 (ja) * | 2003-07-09 | 2012-07-04 | フライズ メタルズ インコーポレイテッド | 粒子に電荷を保持・調整せしめる方法 |
EP1665290B1 (de) * | 2003-09-02 | 2007-05-02 | Plastic Logic Limited | Herstellung elektronischer bauelemente |
GB0320491D0 (en) | 2003-09-02 | 2003-10-01 | Plastic Logic Ltd | Multi-level patterning |
GB0324561D0 (en) * | 2003-10-22 | 2003-11-26 | Koninkl Philips Electronics Nv | A method of producing a conductive layer on a substrate |
JP4549655B2 (ja) * | 2003-11-18 | 2010-09-22 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング | 機能性塗料 |
KR100872162B1 (ko) * | 2004-04-14 | 2008-12-08 | (주)석경에이.티 | 도전성 금속 나노입자 및 이를 포함하는 나노금속 잉크 |
JP4628718B2 (ja) * | 2004-07-23 | 2011-02-09 | 株式会社フジクラ | 導電性被膜の形成方法 |
US8334464B2 (en) | 2005-01-14 | 2012-12-18 | Cabot Corporation | Optimized multi-layer printing of electronics and displays |
US7824466B2 (en) | 2005-01-14 | 2010-11-02 | Cabot Corporation | Production of metal nanoparticles |
WO2006076609A2 (en) | 2005-01-14 | 2006-07-20 | Cabot Corporation | Printable electronic features on non-uniform substrate and processes for making same |
TW200642785A (en) | 2005-01-14 | 2006-12-16 | Cabot Corp | Metal nanoparticle compositions |
AU2006284245B2 (en) | 2005-08-24 | 2010-11-18 | A.M. Ramp & Co. Gmbh | Process for producing articles having an electrically conductive coating |
JP2007088221A (ja) * | 2005-09-22 | 2007-04-05 | Seiko Epson Corp | セラミックス電子部品の製造方法およびセラミックス電子部品 |
JP2007084384A (ja) * | 2005-09-22 | 2007-04-05 | Seiko Epson Corp | セラミックス電子部品の製造方法およびセラミックス電子部品 |
KR100707911B1 (ko) * | 2006-05-23 | 2007-04-13 | (주)석경에이.티 | 도전성 금속 나노입자 및 이를 포함하는 나노금속 잉크 |
JP2006229254A (ja) * | 2006-05-29 | 2006-08-31 | Morimura Chemicals Ltd | 透光体の製造方法 |
JP2006270118A (ja) * | 2006-05-29 | 2006-10-05 | Morimura Chemicals Ltd | 回路基板の製造方法 |
KR100790457B1 (ko) * | 2006-07-10 | 2008-01-02 | 삼성전기주식회사 | 금속 나노입자의 제조방법 |
KR100711505B1 (ko) | 2007-01-30 | 2007-04-27 | (주)이그잭스 | 도전막 형성을 위한 은 페이스트 |
DE102007027473A1 (de) | 2007-06-14 | 2008-12-18 | Manroland Ag | Drucktechnisch hergestellte funktionale Komponenten |
KR100889489B1 (ko) * | 2008-03-18 | 2009-03-19 | 주식회사하이퍼플렉스 | 도전성 섬유재를 갖는 연성 회로기판 및 이를 갖는전자제품 |
US9578752B2 (en) | 2009-02-05 | 2017-02-21 | Lg Chem, Ltd. | Method of forming conductive pattern and substrate having conductive pattern manufactured by the same method |
KR101132108B1 (ko) | 2009-02-18 | 2012-04-05 | 도요 보세키 가부시키가이샤 | 금속 박막 제조 방법 및 금속 박막 |
KR101276237B1 (ko) * | 2010-12-02 | 2013-06-20 | 한국기계연구원 | 저온소결 전도성 금속막 및 이의 제조방법 |
JP5598739B2 (ja) * | 2012-05-18 | 2014-10-01 | 株式会社マテリアル・コンセプト | 導電性ペースト |
US11111396B2 (en) * | 2014-10-17 | 2021-09-07 | C3 Nano, Inc. | Transparent films with control of light hue using nanoscale colorants |
US20170252804A1 (en) * | 2016-03-04 | 2017-09-07 | Lockheed Martin Corporation | Additive manufacturing processes utilizing metal nanoparticles |
DE102019124954A1 (de) * | 2019-09-17 | 2021-03-18 | Danfoss Silicon Power Gmbh | Verfahren zum Verbinden eines ersten elektronischen Bauteils mit einem zweiten elektronischen Bauteil |
KR20220028553A (ko) | 2020-08-28 | 2022-03-08 | (주)합동하이텍그라스 | 투과율 가변 필름 및 그 제조 방법 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US4122143A (en) * | 1976-05-24 | 1978-10-24 | Mitsui Toatsu Chemicals, Inc. | Process for producing cured products |
JPH0797696B2 (ja) * | 1986-07-05 | 1995-10-18 | 株式会社豊田自動織機製作所 | ハイブリツドic基板と回路パタ−ン形成方法 |
US4808274A (en) * | 1986-09-10 | 1989-02-28 | Engelhard Corporation | Metallized substrates and process for producing |
JPH0747233B2 (ja) * | 1987-09-14 | 1995-05-24 | 古河電気工業株式会社 | 半田析出用組成物および半田析出方法 |
DE3919564C2 (de) * | 1989-06-15 | 1993-10-07 | Bosch Gmbh Robert | Verfahren zum Herstellen von Leiterbahnen auf einer Polyimidfolie |
US5059242A (en) * | 1990-04-27 | 1991-10-22 | Firmstone Michael G | Seed layer compositions containing organogold and organosilver compounds |
-
1997
- 1997-09-12 CA CA002280115A patent/CA2280115C/en not_active Expired - Fee Related
- 1997-09-12 KR KR10-1999-7007608A patent/KR100532734B1/ko not_active IP Right Cessation
- 1997-09-12 AT AT97941061T patent/ATE353536T1/de not_active IP Right Cessation
- 1997-09-12 DE DE69737328T patent/DE69737328T2/de not_active Expired - Fee Related
- 1997-09-12 AU AU42696/97A patent/AU4269697A/en not_active Abandoned
- 1997-09-12 JP JP53236498A patent/JP3585244B2/ja not_active Expired - Fee Related
- 1997-09-12 WO PCT/US1997/016226 patent/WO1998037133A1/en active IP Right Grant
- 1997-09-12 EP EP97941061A patent/EP0961809B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69737328T2 (de) | 2007-11-22 |
AU4269697A (en) | 1998-09-09 |
ATE353536T1 (de) | 2007-02-15 |
JP2001515645A (ja) | 2001-09-18 |
EP0961809A4 (de) | 2004-07-21 |
EP0961809B1 (de) | 2007-02-07 |
JP3585244B2 (ja) | 2004-11-04 |
KR20000075549A (ko) | 2000-12-15 |
CA2280115A1 (en) | 1998-08-27 |
CA2280115C (en) | 2007-11-13 |
KR100532734B1 (ko) | 2005-11-30 |
WO1998037133A1 (en) | 1998-08-27 |
EP0961809A1 (de) | 1999-12-08 |
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