WO2001068567A3 - Photostrukturiere paste - Google Patents

Photostrukturiere paste Download PDF

Info

Publication number
WO2001068567A3
WO2001068567A3 PCT/DE2001/000867 DE0100867W WO0168567A3 WO 2001068567 A3 WO2001068567 A3 WO 2001068567A3 DE 0100867 W DE0100867 W DE 0100867W WO 0168567 A3 WO0168567 A3 WO 0168567A3
Authority
WO
WIPO (PCT)
Prior art keywords
paste
platinum
photostructured
powder
filler
Prior art date
Application number
PCT/DE2001/000867
Other languages
English (en)
French (fr)
Other versions
WO2001068567A2 (de
Inventor
La Prieta Claudio De
Thomas Schulte
Uwe Glanz
Petra Kuschel
Original Assignee
Bosch Gmbh Robert
La Prieta Claudio De
Thomas Schulte
Uwe Glanz
Petra Kuschel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert, La Prieta Claudio De, Thomas Schulte, Uwe Glanz, Petra Kuschel filed Critical Bosch Gmbh Robert
Priority to EP01921161A priority Critical patent/EP1296913A2/de
Priority to JP2001567668A priority patent/JP2003531456A/ja
Publication of WO2001068567A2 publication Critical patent/WO2001068567A2/de
Publication of WO2001068567A3 publication Critical patent/WO2001068567A3/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5122—Pd or Pt
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
    • H01C17/0654—Oxides of the platinum group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/06553—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of a combination of metals and oxides
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Es wird eine photostrukturierbare Paste vorgeschlagen, die insbesondere zur Herstellung von strukturierten Widerstandsschichten oder Leiterbahnen auf keramischen Grünfolien geeignet ist. Die Paste weist dabei einen lichtempfindlichen organschien Binder und einen Füllstoff auf, wobei der Binder ein Polymer, einen Photoinitiator, einen Inhibitor für eine thermische Polarisation, ein organisches Disulfid und ein organsiches Lösungsmittel aufweist. Der Füllstoff ist ein Platinpulver, eine Platinverbindung oder eine Mischung eines Platinpulvers oder einer Platinverbindung mit einem keramischen Pulver oder einer keramischen Precursorverbindung.
PCT/DE2001/000867 2000-03-14 2001-03-08 Photostrukturiere paste WO2001068567A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP01921161A EP1296913A2 (de) 2000-03-14 2001-03-08 Photostrukturiere paste
JP2001567668A JP2003531456A (ja) 2000-03-14 2001-03-08 光構造化可能なペースト

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10015502A DE10015502A1 (de) 2000-03-14 2000-03-14 Photostrukturierbare Paste
DE10015502.2 2000-03-14

Publications (2)

Publication Number Publication Date
WO2001068567A2 WO2001068567A2 (de) 2001-09-20
WO2001068567A3 true WO2001068567A3 (de) 2003-01-09

Family

ID=7636773

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2001/000867 WO2001068567A2 (de) 2000-03-14 2001-03-08 Photostrukturiere paste

Country Status (6)

Country Link
US (1) US20030152863A1 (de)
EP (1) EP1296913A2 (de)
JP (1) JP2003531456A (de)
KR (1) KR20030051415A (de)
DE (1) DE10015502A1 (de)
WO (1) WO2001068567A2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104956213B (zh) * 2013-01-28 2017-04-12 田中贵金属工业株式会社 用于形成气体传感器电极的金属膏

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7864322B2 (en) 2006-03-23 2011-01-04 The Research Foundation Of State University Of New York Optical methods and systems for detecting a constituent in a gas containing oxygen in harsh environments
DE102009029490B4 (de) * 2009-09-16 2023-09-28 Endress+Hauser SE+Co. KG Füllstandsmessgerät
JP4834170B1 (ja) * 2010-07-12 2011-12-14 田中貴金属工業株式会社 電極形成用の導電微粒子及び金属ペースト並びに電極
CN115356873A (zh) * 2018-07-05 2022-11-18 东丽株式会社 树脂组合物、遮光膜、遮光膜的制造方法及带隔壁的基板
CA3134212A1 (en) * 2019-06-10 2020-12-17 Ferro Corporation High adhesion resistive composition
DE102022115912A1 (de) 2022-06-27 2023-12-28 Universität Stuttgart, Körperschaft Des Öffentlichen Rechts Verfahren zum Herstellen eines elektrischen Bauteils mittels sukzessivem Aufdrucken und Sintern von partikelhaltiger Tinte

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4304841A (en) * 1979-11-07 1981-12-08 Hoechst Aktiengesellschaft Photopolymerizable mixture and photopolymerizable copying material produced therewith
EP0809150A1 (de) * 1996-05-21 1997-11-26 E.I. Du Pont De Nemours And Company Lichtempfindliche, wässerig entwickelbare Dickschichtzusammensetzung unter Verwendung von Polyvinylpyrrolidon
JPH1131416A (ja) * 1992-01-24 1999-02-02 Toray Ind Inc 感光性導電ペースト

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4304841A (en) * 1979-11-07 1981-12-08 Hoechst Aktiengesellschaft Photopolymerizable mixture and photopolymerizable copying material produced therewith
JPH1131416A (ja) * 1992-01-24 1999-02-02 Toray Ind Inc 感光性導電ペースト
EP0809150A1 (de) * 1996-05-21 1997-11-26 E.I. Du Pont De Nemours And Company Lichtempfindliche, wässerig entwickelbare Dickschichtzusammensetzung unter Verwendung von Polyvinylpyrrolidon

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Section Ch Week 199915, Derwent World Patents Index; Class A85, AN 1999-177280, XP002208320 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104956213B (zh) * 2013-01-28 2017-04-12 田中贵金属工业株式会社 用于形成气体传感器电极的金属膏

Also Published As

Publication number Publication date
JP2003531456A (ja) 2003-10-21
KR20030051415A (ko) 2003-06-25
WO2001068567A2 (de) 2001-09-20
DE10015502A1 (de) 2001-09-27
US20030152863A1 (en) 2003-08-14
EP1296913A2 (de) 2003-04-02

Similar Documents

Publication Publication Date Title
DE69737328D1 (de) Niedertemperaturverfahren und zusammensetzungen zur herstellung elektischer leiter
WO2001054203A3 (en) Direct printing of thin-film conductors using metal-chelate inks
WO2006060589A3 (en) Thermal paper
WO2001068567A3 (de) Photostrukturiere paste
KR960031987A (ko) 가스(gas) 센싱소자의 구조 및 제조방법
TW200516602A (en) Thick-film conductor paste for automotive glass
WO2003023865A1 (fr) Dispositif a semi-conducteurs et son procede de fabrication
EP1058492A3 (de) Verfahren zur Herstellung verzerrungsfreier Schaltungen
KR850007531A (ko) 방전표시장치의 제조방법
EP1191005A3 (de) Gaserzeugende Zusammensetzungen
TW200503066A (en) Process for reworking semiconductor patterned photoresist layer
WO2002047148A3 (en) Electrically isolated via in a multilayer ceramic package
EP1195255A4 (de) Thermodruckkopf und herstellungsverfahren
DE59510819D1 (de) Edelmetallhaltige Resinatpaste zur Herstellung von keramischen Vielschichtkondensatoren
SE0001504L (sv) Elektronisk komponent och radioterminal där denna andvänds
TR199800298T1 (xx) Seramik sırlarının ve bu sırlarda kullanılan tozların imalatı için sistem.
GB1282023A (en) Electrical resistor material
DE60134737D1 (de) Herstellung eines hochdichten dicken keramikfilms durch siebdruck
TW370687B (en) Manufacturing method for forming an opening with deep ultra-violet photoresist
GB2375433A (en) Semiconductive ceramic positive temperature coefficient thermistor for degaussing degaussing circuit and method for manufacturing semiconductive ceramic
KR101226246B1 (ko) 복합재 조성물, 및 이를 포함하는 전자 장치용 도막 및 전자 장치
JPS55154451A (en) Production of substrate for gas sensor
JPS5643547A (en) Gas detecting element
JPS5643550A (en) Gas detecting element
ATE363127T1 (de) Elektrisches bauelement und verfahren zu dessen herstellung

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): JP KR US

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 2001921161

Country of ref document: EP

ENP Entry into the national phase

Ref country code: JP

Ref document number: 2001 567668

Kind code of ref document: A

Format of ref document f/p: F

WWE Wipo information: entry into national phase

Ref document number: 1020027012001

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 10221995

Country of ref document: US

WWP Wipo information: published in national office

Ref document number: 2001921161

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1020027012001

Country of ref document: KR

WWW Wipo information: withdrawn in national office

Ref document number: 2001921161

Country of ref document: EP

WWW Wipo information: withdrawn in national office

Ref document number: 1020027012001

Country of ref document: KR