DE69734775D1 - Verfahren und vorrichtung zur ablagerung von einem viskosen produkt mit einer schablone - Google Patents

Verfahren und vorrichtung zur ablagerung von einem viskosen produkt mit einer schablone

Info

Publication number
DE69734775D1
DE69734775D1 DE69734775T DE69734775T DE69734775D1 DE 69734775 D1 DE69734775 D1 DE 69734775D1 DE 69734775 T DE69734775 T DE 69734775T DE 69734775 T DE69734775 T DE 69734775T DE 69734775 D1 DE69734775 D1 DE 69734775D1
Authority
DE
Germany
Prior art keywords
wipers
stencil
receptacle
pressure
towards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69734775T
Other languages
English (en)
Other versions
DE69734775T2 (de
Inventor
Francis Bourrieres
Clement Kaiser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novatec SA
Original Assignee
Novatec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR9612671A external-priority patent/FR2754473B1/fr
Application filed by Novatec SA filed Critical Novatec SA
Application granted granted Critical
Publication of DE69734775D1 publication Critical patent/DE69734775D1/de
Publication of DE69734775T2 publication Critical patent/DE69734775T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00—Screen printing machines
    • B41P2215/10—Screen printing machines characterised by their constructional features
    • B41P2215/13—Devices for increasing ink penetration
    • B41P2215/132—Devices for increasing ink penetration by increasing pressure above the screen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Confectionery (AREA)
  • Coating Apparatus (AREA)
DE69734775T 1996-10-15 1997-10-13 Verfahren und vorrichtung zur ablagerung von einem viskosen produkt mit einer schablone Expired - Lifetime DE69734775T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
FR9612671 1996-10-15
FR9612671A FR2754473B1 (fr) 1996-10-15 1996-10-15 Procede de realisation de depots de produit visqueux et/ou pateux sur un substrat a travers les ouvertures d'un pochoir et dispositif distributeur de produit
FR9701033 1997-01-28
FR9701033A FR2754474B1 (fr) 1996-10-15 1997-01-28 Dispositif pour le depot d'un produit visqueux ou pateux sur un substrat a travers les ouvertures d'un pochoir
PCT/EP1997/005761 WO1998016387A1 (en) 1996-10-15 1997-10-13 Process and apparatus for the deposition of a viscous product on a substrate via a stencil

Publications (2)

Publication Number Publication Date
DE69734775D1 true DE69734775D1 (de) 2006-01-05
DE69734775T2 DE69734775T2 (de) 2006-08-17

Family

ID=26233048

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69734775T Expired - Lifetime DE69734775T2 (de) 1996-10-15 1997-10-13 Verfahren und vorrichtung zur ablagerung von einem viskosen produkt mit einer schablone

Country Status (9)

Country Link
US (2) US6171399B1 (de)
EP (1) EP0935532B1 (de)
JP (2) JP3533422B2 (de)
AT (1) ATE311289T1 (de)
AU (1) AU5313298A (de)
CA (1) CA2268800C (de)
DE (1) DE69734775T2 (de)
FR (1) FR2754474B1 (de)
WO (1) WO1998016387A1 (de)

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FR2754474B1 (fr) 1996-10-15 1999-04-30 Novatec Dispositif pour le depot d'un produit visqueux ou pateux sur un substrat a travers les ouvertures d'un pochoir
BE1011561A5 (nl) * 1997-11-21 1999-10-05 Volder Laurent De Werkwijze en inrichting voor het vanaf een inktreservoir beinkten van een gegraveerde clicheplaat.
GB2334479B (en) 1998-02-24 2000-07-19 Dek Printing Machines Ltd Improvements relating to print heads
FR2782945B1 (fr) * 1998-09-03 2000-11-24 Francis Bourrieres Racle capillaire a injection surfacique pour la serigraphie de produits liquides
GB9903146D0 (en) * 1998-09-10 1999-04-07 Williams David G Method and apparatus for applying a viscous or paste material onto a substrate
JP3448703B2 (ja) * 1999-02-15 2003-09-22 ミナミ株式会社 スクリーン印刷機
GB2351259A (en) 1999-06-22 2000-12-27 Dek Printing Machines Ltd Blades for screen printing
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US6361606B1 (en) * 1999-07-22 2002-03-26 Visteon Global Tech., Inc. Method and apparatus for dispensing viscous material
JP3646603B2 (ja) * 2000-02-17 2005-05-11 松下電器産業株式会社 スクリーン印刷装置およびスクリーン印刷方法
GB2360014A (en) * 2000-03-08 2001-09-12 Dek Printing Machines Ltd Screen printing device with movable screen and print head
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JP4080148B2 (ja) * 2000-07-11 2008-04-23 松下電器産業株式会社 スクリーン印刷装置およびスクリーン印刷装置用のペースト貯溜容器
FR2813216B1 (fr) * 2000-08-28 2003-03-21 Novatec Dispositif de remplissage de trous debouchants dans un substrat
WO2002024340A1 (en) * 2000-09-22 2002-03-28 Regents Of The University Of Minnesota Applicator device
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GB2458313B (en) 2008-03-13 2012-05-23 Dek Int Gmbh Print head assembly, screen printing system and method
DE102008024409B4 (de) * 2008-05-20 2012-10-11 Epsys Paul Voinea E.K. Vorrichtung und Verfahren zur teilweisen Benetzung der Oberfläche eines Werkstückes mittels Maske und Zerstäuber
US8444770B2 (en) * 2009-06-29 2013-05-21 Ttm Technologies, Inc. System for cleaning components for filling holes in a printed circuit board with a fluid fill material
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JP5126170B2 (ja) * 2009-07-08 2013-01-23 パナソニック株式会社 スクリーン印刷装置およびスクリーン印刷方法
JP5126172B2 (ja) * 2009-07-13 2013-01-23 パナソニック株式会社 スクリーン印刷装置およびスクリーン印刷方法
KR20130022184A (ko) * 2011-08-25 2013-03-06 삼성전자주식회사 스퀴즈장치
US20130164448A1 (en) * 2011-09-13 2013-06-27 Heath Moore Stenciling device and method
CN103770457B (zh) * 2014-01-06 2016-03-02 弘益泰克自动化设备（惠州）有限公司 泵式刮刀头配套装置
TWI558574B (zh) * 2014-12-05 2016-11-21 Metal Ind Res & Dev Ct Slit Scraper Structure
ITUA20162113A1 (it) * 2016-03-30 2017-09-30 Prudente Group Srl Erogatore di inchiostro per stampe serigrafiche
DE102016220678A1 (de) * 2016-10-21 2018-04-26 Robert Bosch Gmbh Druckvorrichtung und Druckverfahren zum Auftragen eines viskosen oder pastösen Materials
JP7029598B2 (ja) * 2018-04-27 2022-03-04 パナソニックＩｐマネジメント株式会社 ペースト供給装置およびスクリーン印刷装置
CN109248835A (zh) * 2018-08-06 2019-01-22 张家港市双成电工设备有限公司 一种真空浸渍罐及真空浸渍设备
CN109878203A (zh) * 2019-04-13 2019-06-14 东莞市鹏利节能设备有限公司 一种活塞塞孔装置
DE102020102306A1 (de) 2020-01-30 2021-08-05 Semikron Elektronik Gmbh & Co. Kg Vorrichtung und Verfahren zum Durchdruck eines wachsartig, pastösen wärmeleitenden Materials auf eine Kühleinrichtung oder ein Leistungshalbleitermodul
CN116828727B (zh) * 2023-08-31 2023-12-05 四川英创力电子科技股份有限公司 具有宽度可调结构的电路板撕胶装置及其使用方法

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Also Published As

Publication number Publication date
CA2268800A1 (en) 1998-04-23
CA2268800C (en) 2005-09-13
EP0935532B1 (de) 2005-11-30
FR2754474B1 (fr) 1999-04-30
JP4332019B2 (ja) 2009-09-16
US6171399B1 (en) 2001-01-09
DE69734775T2 (de) 2006-08-17
EP0935532A1 (de) 1999-08-18
JP2001504049A (ja) 2001-03-27
FR2754474A1 (fr) 1998-04-17
WO1998016387A1 (en) 1998-04-23
JP2004203027A (ja) 2004-07-22
US6495199B1 (en) 2002-12-17
JP3533422B2 (ja) 2004-05-31
AU5313298A (en) 1998-05-11
ATE311289T1 (de) 2005-12-15

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8364 No opposition during term of opposition