DE69733686D1 - Verfahren und vorrichtung zur trocknung und reinigung von gegenständen mittels aerosolen - Google Patents

Verfahren und vorrichtung zur trocknung und reinigung von gegenständen mittels aerosolen

Info

Publication number
DE69733686D1
DE69733686D1 DE69733686T DE69733686T DE69733686D1 DE 69733686 D1 DE69733686 D1 DE 69733686D1 DE 69733686 T DE69733686 T DE 69733686T DE 69733686 T DE69733686 T DE 69733686T DE 69733686 D1 DE69733686 D1 DE 69733686D1
Authority
DE
Germany
Prior art keywords
aerosols
drying
cleaning objects
cleaning
objects
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69733686T
Other languages
English (en)
Other versions
DE69733686T2 (de
Inventor
W Ferrell
D Spencer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research AG
Original Assignee
SEZ AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/616,165 external-priority patent/US5685086A/en
Application filed by SEZ AG filed Critical SEZ AG
Publication of DE69733686D1 publication Critical patent/DE69733686D1/de
Application granted granted Critical
Publication of DE69733686T2 publication Critical patent/DE69733686T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/14—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects using gases or vapours other than air or steam, e.g. inert gases
    • F26B21/145—Condensing the vapour onto the surface of the materials to be dried
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/005—Drying solid materials or objects by processes not involving the application of heat by dipping them into or mixing them with a chemical liquid, e.g. organic; chemical, e.g. organic, dewatering aids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Molecular Biology (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
DE69733686T 1996-03-14 1997-03-13 Verfahren und vorrichtung zur trocknung und reinigung von gegenständen mittels aerosolen Expired - Lifetime DE69733686T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US08/616,165 US5685086A (en) 1995-06-07 1996-03-14 Method and apparatus for drying objects using aerosols
US616165 1996-03-14
US62468996A 1996-03-25 1996-03-25
US624689 1996-03-25
PCT/US1997/003952 WO1997033702A1 (en) 1996-03-14 1997-03-13 Method and apparatus for drying and cleaning objects using aerosols

Publications (2)

Publication Number Publication Date
DE69733686D1 true DE69733686D1 (de) 2005-08-11
DE69733686T2 DE69733686T2 (de) 2006-05-04

Family

ID=27087685

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69733686T Expired - Lifetime DE69733686T2 (de) 1996-03-14 1997-03-13 Verfahren und vorrichtung zur trocknung und reinigung von gegenständen mittels aerosolen

Country Status (7)

Country Link
EP (1) EP0886548B1 (de)
JP (1) JP3955924B2 (de)
KR (1) KR100299486B1 (de)
CA (1) CA2248759A1 (de)
DE (1) DE69733686T2 (de)
IL (1) IL126189A (de)
WO (1) WO1997033702A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999026976A1 (en) * 1997-11-26 1999-06-03 Eli Lilly And Company Tnf ligand family gene
US6270584B1 (en) * 1997-12-03 2001-08-07 Gary W. Ferrell Apparatus for drying and cleaning objects using controlled aerosols and gases
WO1999062837A1 (en) * 1998-06-02 1999-12-09 Cfmt, Inc. Wet processing methods for the manufacture of electronic components using liquids of varying temperature
JP3174038B2 (ja) 1999-01-18 2001-06-11 東邦化成株式会社 基板乾燥方法およびその装置
WO2001053766A1 (fr) * 2000-01-17 2001-07-26 Toho Kasei Co., Ltd. Procede et dispositif pour secher un substrat
JP3802446B2 (ja) 2002-05-15 2006-07-26 東邦化成株式会社 基板乾燥方法およびその装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS553607B2 (de) * 1973-01-05 1980-01-25
US4310973A (en) * 1977-12-01 1982-01-19 Phillips Petroleum Co. Drying polymer solutions
US4334366A (en) * 1980-09-24 1982-06-15 Jetsonic Processes, Ltd. Sonic energy perforated drum for rotary dryers
US4561192A (en) * 1982-11-29 1985-12-31 Dairyman's Cooperative Creamery Assoc. Spray drying apparatus and method
DE68921757T2 (de) * 1989-11-23 1995-10-26 Cfm Technologies Inc Verfahren zum Trocknen von Oberflächen.
US5054210A (en) * 1990-02-23 1991-10-08 S&K Products International, Inc. Isopropyl alcohol vapor dryer system
US5000208A (en) * 1990-06-21 1991-03-19 Micron Technology, Inc. Wafer rinser/dryer
US5143103A (en) * 1991-01-04 1992-09-01 International Business Machines Corporation Apparatus for cleaning and drying workpieces
JP2639771B2 (ja) * 1991-11-14 1997-08-13 大日本スクリーン製造株式会社 基板の洗浄・乾燥処理方法並びにその処理装置
US5229171A (en) * 1991-12-23 1993-07-20 Research Triangle Institute Apparatus and method for uniformly coating a substrate in an evacuable chamber
US5226242A (en) * 1992-02-18 1993-07-13 Santa Clara Plastics, Division Of Preco, Inc. Vapor jet dryer apparatus and method
US5419351A (en) * 1993-04-02 1995-05-30 National Semiconductor Corporation Final rinse/dry system for critical cleaning applications
JP3347814B2 (ja) * 1993-05-17 2002-11-20 大日本スクリーン製造株式会社 基板の洗浄・乾燥処理方法並びにその処理装置
CH688556A5 (it) * 1993-12-09 1997-11-14 Franco Carloni Apparecchio elettrodomestico per lavare e/o asciugare utilizzante l'acqua calda dell'impianto centralizzato circolante in serpentine.
US5653045A (en) * 1995-06-07 1997-08-05 Ferrell; Gary W. Method and apparatus for drying parts and microelectronic components using sonic created mist

Also Published As

Publication number Publication date
KR100299486B1 (ko) 2001-09-06
EP0886548A4 (de) 2002-03-20
WO1997033702A1 (en) 1997-09-18
JP3955924B2 (ja) 2007-08-08
EP0886548B1 (de) 2005-07-06
DE69733686T2 (de) 2006-05-04
IL126189A (en) 2001-08-08
IL126189A0 (en) 1999-05-09
JP2000507044A (ja) 2000-06-06
EP0886548A1 (de) 1998-12-30
CA2248759A1 (en) 1997-09-18
KR19990087765A (ko) 1999-12-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: LAM RESEARCH AG, VILLACH, AT