DE68921757T2 - Verfahren zum Trocknen von Oberflächen. - Google Patents

Verfahren zum Trocknen von Oberflächen.

Info

Publication number
DE68921757T2
DE68921757T2 DE1989621757 DE68921757T DE68921757T2 DE 68921757 T2 DE68921757 T2 DE 68921757T2 DE 1989621757 DE1989621757 DE 1989621757 DE 68921757 T DE68921757 T DE 68921757T DE 68921757 T2 DE68921757 T2 DE 68921757T2
Authority
DE
Germany
Prior art keywords
drying surfaces
drying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE1989621757
Other languages
English (en)
Other versions
DE68921757D1 (de
Inventor
Christopher F Mcconnell
Alan E Walter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CFM Technologies Inc
Original Assignee
CFM Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=8202157&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE68921757(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by CFM Technologies Inc filed Critical CFM Technologies Inc
Application granted granted Critical
Publication of DE68921757D1 publication Critical patent/DE68921757D1/de
Publication of DE68921757T2 publication Critical patent/DE68921757T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/14—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects using gases or vapours other than air or steam, e.g. inert gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
DE1989621757 1989-11-23 1989-11-23 Verfahren zum Trocknen von Oberflächen. Expired - Lifetime DE68921757T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP19890121671 EP0428784B1 (de) 1989-11-23 1989-11-23 Verfahren zum Trocknen von Oberflächen

Publications (2)

Publication Number Publication Date
DE68921757D1 DE68921757D1 (de) 1995-04-20
DE68921757T2 true DE68921757T2 (de) 1995-10-26

Family

ID=8202157

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1989621757 Expired - Lifetime DE68921757T2 (de) 1989-11-23 1989-11-23 Verfahren zum Trocknen von Oberflächen.

Country Status (2)

Country Link
EP (1) EP0428784B1 (de)
DE (1) DE68921757T2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5352328A (en) * 1992-12-15 1994-10-04 At&T Bell Laboratories Control of time-dependent haze in the manufacture of integrated circuits
WO1997033702A1 (en) * 1996-03-14 1997-09-18 All In One Microservice, Inc. Method and apparatus for drying and cleaning objects using aerosols
JPH1126423A (ja) * 1997-07-09 1999-01-29 Sugai:Kk 半導体ウエハ等の処理方法並びにその処理装置
US5983907A (en) * 1997-08-05 1999-11-16 Seh America, Inc. Method of drying semiconductor wafers using hot deionized water and infrared drying
US5884640A (en) * 1997-08-07 1999-03-23 Applied Materials, Inc. Method and apparatus for drying substrates
US6558964B2 (en) * 2000-12-27 2003-05-06 Lam Research Corporation Method and apparatus for monitoring a semiconductor wafer during a spin drying operation
DE102004026565B4 (de) * 2004-05-29 2008-07-31 Khs Ag Verfahren zum Reinigen von Flaschen o.dgl. Behälter sowie Reinigungsmaschine
CN111578680B (zh) * 2019-02-15 2022-01-11 北京北方华创微电子装备有限公司 一种晶圆的干燥方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4778532A (en) * 1985-06-24 1988-10-18 Cfm Technologies Limited Partnership Process and apparatus for treating wafers with process fluids
EP0233184B1 (de) * 1985-06-24 1992-04-01 Cfm Technologies, Inc. Behandlung von halbleiterscheiben mit einer flüssigkeitsströmung
JPH01210092A (ja) * 1988-02-18 1989-08-23 Sonitsuku Fueroo Kk 精密洗浄の乾燥方法

Also Published As

Publication number Publication date
EP0428784A1 (de) 1991-05-29
EP0428784B1 (de) 1995-03-15
DE68921757D1 (de) 1995-04-20

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8365 Fully valid after opposition proceedings