DE69729590D1 - Verfahren und Vorrichtung zum Abrichten eines Poliertuches - Google Patents
Verfahren und Vorrichtung zum Abrichten eines PoliertuchesInfo
- Publication number
- DE69729590D1 DE69729590D1 DE69729590T DE69729590T DE69729590D1 DE 69729590 D1 DE69729590 D1 DE 69729590D1 DE 69729590 T DE69729590 T DE 69729590T DE 69729590 T DE69729590 T DE 69729590T DE 69729590 D1 DE69729590 D1 DE 69729590D1
- Authority
- DE
- Germany
- Prior art keywords
- dressing
- polishing cloth
- polishing
- cloth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004744 fabric Substances 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18401296 | 1996-06-25 | ||
JP18401296 | 1996-06-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69729590D1 true DE69729590D1 (de) | 2004-07-22 |
DE69729590T2 DE69729590T2 (de) | 2005-06-09 |
Family
ID=16145796
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69715321T Expired - Fee Related DE69715321T2 (de) | 1996-06-25 | 1997-06-25 | Verfahren und Vorrichtung zum Abrichten eines Poliertuches |
DE69729590T Expired - Fee Related DE69729590T2 (de) | 1996-06-25 | 1997-06-25 | Verfahren und Vorrichtung zum Abrichten eines Poliertuches |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69715321T Expired - Fee Related DE69715321T2 (de) | 1996-06-25 | 1997-06-25 | Verfahren und Vorrichtung zum Abrichten eines Poliertuches |
Country Status (4)
Country | Link |
---|---|
US (2) | US6364752B1 (de) |
EP (3) | EP1439031A1 (de) |
KR (1) | KR100524510B1 (de) |
DE (2) | DE69715321T2 (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW375556B (en) | 1997-07-02 | 1999-12-01 | Matsushita Electric Ind Co Ltd | Method of polishing the wafer and finishing the polishing pad |
US5951370A (en) * | 1997-10-02 | 1999-09-14 | Speedfam-Ipec Corp. | Method and apparatus for monitoring and controlling the flatness of a polishing pad |
JP3615931B2 (ja) * | 1998-03-26 | 2005-02-02 | 株式会社荏原製作所 | ポリッシング装置および該ポリッシング装置におけるコンディショニング方法 |
EP1075898A3 (de) * | 1999-08-13 | 2003-11-05 | Mitsubishi Materials Corporation | Abrichtwerkzeug und Vorrichtung |
JP2001129755A (ja) * | 1999-08-20 | 2001-05-15 | Ebara Corp | 研磨装置及びドレッシング方法 |
JP2001212750A (ja) * | 1999-11-25 | 2001-08-07 | Fujikoshi Mach Corp | ポリシングマシンの洗浄装置およびポリシングマシン |
JP3862911B2 (ja) | 2000-02-07 | 2006-12-27 | 株式会社荏原製作所 | 研磨装置 |
US6969305B2 (en) | 2000-02-07 | 2005-11-29 | Ebara Corporation | Polishing apparatus |
TW495416B (en) | 2000-10-24 | 2002-07-21 | Ebara Corp | Polishing apparatus |
JP3768399B2 (ja) * | 2000-11-17 | 2006-04-19 | 株式会社荏原製作所 | ドレッシング装置及びポリッシング装置 |
KR20020067789A (ko) * | 2001-02-19 | 2002-08-24 | 삼성전자 주식회사 | 다이아몬드 디스크 드레싱 설비 |
KR100462868B1 (ko) * | 2001-06-29 | 2004-12-17 | 삼성전자주식회사 | 반도체 폴리싱 장치의 패드 컨디셔너 |
US20070212983A1 (en) * | 2006-03-13 | 2007-09-13 | Applied Materials, Inc. | Apparatus and methods for conditioning a polishing pad |
CN100500377C (zh) * | 2006-04-03 | 2009-06-17 | 深圳南玻显示器件科技有限公司 | 透明导电膜层抛光装置及其抛光方法 |
KR100831019B1 (ko) | 2006-12-28 | 2008-05-20 | 주식회사 실트론 | 웨이퍼 연삭휠 및 이 연삭휠을 이용한 웨이퍼 연삭방법 |
JP5415735B2 (ja) * | 2008-09-26 | 2014-02-12 | 株式会社荏原製作所 | ドレッシング方法、ドレッシング条件の決定方法、ドレッシング条件決定プログラム、および研磨装置 |
JP5504901B2 (ja) | 2010-01-13 | 2014-05-28 | 株式会社Sumco | 研磨パッドの形状修正方法 |
JP5896625B2 (ja) * | 2011-06-02 | 2016-03-30 | 株式会社荏原製作所 | 研磨装置に使用される研磨パッドの研磨面を監視する方法および装置 |
US20130196572A1 (en) * | 2012-01-27 | 2013-08-01 | Sen-Hou Ko | Conditioning a pad in a cleaning module |
JP5964262B2 (ja) * | 2013-02-25 | 2016-08-03 | 株式会社荏原製作所 | 研磨装置に使用される研磨部材のプロファイル調整方法、および研磨装置 |
JP6474209B2 (ja) * | 2014-07-23 | 2019-02-27 | ファナック株式会社 | スポット溶接ガンの電極の研磨システム |
DE102015220090B4 (de) | 2015-01-14 | 2021-02-18 | Siltronic Ag | Verfahren zum Abrichten von Poliertüchern |
DE102016211709B3 (de) * | 2016-06-29 | 2017-11-02 | Siltronic Ag | Vorrichtung und Verfahren zum Abrichten von Poliertüchern |
DE102016222144A1 (de) | 2016-11-11 | 2018-05-17 | Siltronic Ag | Vorrichtung und Verfahren zum Abrichten von Poliertüchern |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3031806A (en) | 1960-04-12 | 1962-05-01 | Crane Packing Co | Automatic lap plate contour control |
JPH0775825B2 (ja) | 1986-01-07 | 1995-08-16 | 東芝機械株式会社 | 片面研磨装置 |
US4984390A (en) * | 1989-11-09 | 1991-01-15 | Nippei Toyama Corporation | Grinding disc dressing apparatus |
DE69317838T2 (de) * | 1992-09-24 | 1998-11-12 | Ebara Corp | Poliergerät |
US5456627A (en) * | 1993-12-20 | 1995-10-10 | Westech Systems, Inc. | Conditioner for a polishing pad and method therefor |
US5486131A (en) * | 1994-01-04 | 1996-01-23 | Speedfam Corporation | Device for conditioning polishing pads |
JP2914166B2 (ja) * | 1994-03-16 | 1999-06-28 | 日本電気株式会社 | 研磨布の表面処理方法および研磨装置 |
US5698455A (en) * | 1995-02-09 | 1997-12-16 | Micron Technologies, Inc. | Method for predicting process characteristics of polyurethane pads |
US5708506A (en) * | 1995-07-03 | 1998-01-13 | Applied Materials, Inc. | Apparatus and method for detecting surface roughness in a chemical polishing pad conditioning process |
US5609718A (en) * | 1995-09-29 | 1997-03-11 | Micron Technology, Inc. | Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafers |
US5875559A (en) | 1995-10-27 | 1999-03-02 | Applied Materials, Inc. | Apparatus for measuring the profile of a polishing pad in a chemical mechanical polishing system |
US5743784A (en) * | 1995-12-19 | 1998-04-28 | Applied Materials, Inc. | Apparatus and method to determine the coefficient of friction of a chemical mechanical polishing pad during a pad conditioning process and to use it to control the process |
US5618447A (en) | 1996-02-13 | 1997-04-08 | Micron Technology, Inc. | Polishing pad counter meter and method for real-time control of the polishing rate in chemical-mechanical polishing of semiconductor wafers |
TW355153B (en) * | 1996-05-21 | 1999-04-01 | Toshiba Machine Co Ltd | A method for leveling abrasive cloth and device for the same |
US5954570A (en) | 1996-05-31 | 1999-09-21 | Kabushiki Kaisha Toshiba | Conditioner for a polishing tool |
US5975994A (en) * | 1997-06-11 | 1999-11-02 | Micron Technology, Inc. | Method and apparatus for selectively conditioning a polished pad used in planarizng substrates |
US6045434A (en) * | 1997-11-10 | 2000-04-04 | International Business Machines Corporation | Method and apparatus of monitoring polishing pad wear during processing |
US6343974B1 (en) * | 2000-06-26 | 2002-02-05 | International Business Machines Corporation | Real-time method for profiling and conditioning chemical-mechanical polishing pads |
-
1997
- 1997-06-24 KR KR1019970026641A patent/KR100524510B1/ko not_active IP Right Cessation
- 1997-06-25 DE DE69715321T patent/DE69715321T2/de not_active Expired - Fee Related
- 1997-06-25 EP EP04007817A patent/EP1439031A1/de not_active Withdrawn
- 1997-06-25 EP EP00113403A patent/EP1053828B1/de not_active Expired - Lifetime
- 1997-06-25 US US08/881,616 patent/US6364752B1/en not_active Expired - Fee Related
- 1997-06-25 DE DE69729590T patent/DE69729590T2/de not_active Expired - Fee Related
- 1997-06-25 EP EP97110400A patent/EP0816017B1/de not_active Expired - Lifetime
-
2002
- 2002-02-01 US US10/060,366 patent/US6905400B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR100524510B1 (ko) | 2006-01-12 |
EP0816017A1 (de) | 1998-01-07 |
DE69715321D1 (de) | 2002-10-17 |
EP1053828B1 (de) | 2004-06-16 |
US20020072300A1 (en) | 2002-06-13 |
EP1439031A1 (de) | 2004-07-21 |
US6364752B1 (en) | 2002-04-02 |
EP0816017B1 (de) | 2002-09-11 |
US6905400B2 (en) | 2005-06-14 |
EP1053828A2 (de) | 2000-11-22 |
EP1053828A3 (de) | 2001-12-19 |
DE69729590T2 (de) | 2005-06-09 |
DE69715321T2 (de) | 2003-07-31 |
KR980005776A (ko) | 1998-03-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |