DE69727967D1 - Verfahren zur herstellung eines aufgehängten elementes in einer mikromechanischen struktur - Google Patents

Verfahren zur herstellung eines aufgehängten elementes in einer mikromechanischen struktur

Info

Publication number
DE69727967D1
DE69727967D1 DE69727967T DE69727967T DE69727967D1 DE 69727967 D1 DE69727967 D1 DE 69727967D1 DE 69727967 T DE69727967 T DE 69727967T DE 69727967 T DE69727967 T DE 69727967T DE 69727967 D1 DE69727967 D1 DE 69727967D1
Authority
DE
Germany
Prior art keywords
hanged
producing
micromechanical structure
micromechanical
hanged element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69727967T
Other languages
English (en)
Other versions
DE69727967T2 (de
Inventor
Philippe Robert
France Michel
Hubert Grange
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of DE69727967D1 publication Critical patent/DE69727967D1/de
Application granted granted Critical
Publication of DE69727967T2 publication Critical patent/DE69727967T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
DE69727967T 1996-12-30 1997-12-29 Verfahren zur herstellung eines aufgehängten elementes in einer mikromechanischen struktur Expired - Lifetime DE69727967T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9616198 1996-12-30
FR9616198A FR2757941B1 (fr) 1996-12-30 1996-12-30 Procede de realisation d'un element suspendu dans une structure micro-usinee
PCT/FR1997/002437 WO1998029720A1 (fr) 1996-12-30 1997-12-29 Procede de realisation d'un element suspendu dans une structure micro-usinee

Publications (2)

Publication Number Publication Date
DE69727967D1 true DE69727967D1 (de) 2004-04-08
DE69727967T2 DE69727967T2 (de) 2005-02-10

Family

ID=9499286

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69727967T Expired - Lifetime DE69727967T2 (de) 1996-12-30 1997-12-29 Verfahren zur herstellung eines aufgehängten elementes in einer mikromechanischen struktur

Country Status (6)

Country Link
US (1) US6365056B1 (de)
EP (1) EP0950172B1 (de)
JP (1) JP2001507289A (de)
DE (1) DE69727967T2 (de)
FR (1) FR2757941B1 (de)
WO (1) WO1998029720A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4501307B2 (ja) * 2001-04-16 2010-07-14 ソニー株式会社 ３次元構造物の形成方法
JP4306149B2 (ja) * 2001-05-28 2009-07-29 株式会社デンソー 半導体装置の製造方法
JP2003273369A (ja) * 2002-03-18 2003-09-26 Denso Corp 半導体装置の製造方法
JP4117450B2 (ja) * 2002-03-18 2008-07-16 株式会社デンソー 半導体装置の製造方法
DE10333995B4 (de) 2003-07-25 2018-10-25 Robert Bosch Gmbh Verfahren zum Ätzen eines Halbleitermaterials
DE102004043233B4 (de) * 2003-09-10 2014-02-13 Denso Corporation Verfahren zum Herstellen eines beweglichen Abschnitts einer Halbleitervorrichtung
JP4161857B2 (ja) * 2003-09-10 2008-10-08 株式会社デンソー 半導体装置の製造方法
US7803178B2 (en) 2004-01-30 2010-09-28 Trivascular, Inc. Inflatable porous implants and methods for drug delivery
KR100727185B1 (ko) 2005-07-28 2007-06-13 현대자동차주식회사 Ｓｏｉ 기판상에서 실리콘 부양구조물의 제조방법
KR100748741B1 (ko) 2005-07-28 2007-08-13 현대자동차주식회사 교차 접합된 ｓｏｉ 웨이퍼를 이용한 실리콘 부양구조물의제조방법
US7939355B2 (en) * 2005-10-13 2011-05-10 The Regents Of The University Of California Single-mask fabrication process for linear and angular piezoresistive accelerometers

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4472239A (en) * 1981-10-09 1984-09-18 Honeywell, Inc. Method of making semiconductor device
JPS5889859A (ja) * 1981-11-24 1983-05-28 Oki Electric Ind Co Ltd シリコンウエ−ハ上へのマイクロ片持ち梁の作製法
US4457820A (en) * 1981-12-24 1984-07-03 International Business Machines Corporation Two step plasma etching
US4600934A (en) * 1984-01-06 1986-07-15 Harry E. Aine Method of undercut anisotropic etching of semiconductor material
US4685198A (en) * 1985-07-25 1987-08-11 Matsushita Electric Industrial Co., Ltd. Method of manufacturing isolated semiconductor devices
US5198390A (en) * 1992-01-16 1993-03-30 Cornell Research Foundation, Inc. RIE process for fabricating submicron, silicon electromechanical structures
KR970000538B1 (ko) * 1993-04-27 1997-01-13 엘지전자 주식회사 게이트 리세스 구조를 갖는 전계효과트랜지스터의 제조방법
US5427975A (en) * 1993-05-10 1995-06-27 Delco Electronics Corporation Method of micromachining an integrated sensor on the surface of a silicon wafer
US6020272A (en) * 1998-10-08 2000-02-01 Sandia Corporation Method for forming suspended micromechanical structures

Also Published As

Publication number Publication date
FR2757941A1 (fr) 1998-07-03
WO1998029720A1 (fr) 1998-07-09
EP0950172A1 (de) 1999-10-20
FR2757941B1 (fr) 1999-01-22
JP2001507289A (ja) 2001-06-05
EP0950172B1 (de) 2004-03-03
US6365056B1 (en) 2002-04-02
DE69727967T2 (de) 2005-02-10

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