DE69721420T2 - Akustische Oberfächenwellenanordnung mit einem Tor - Google Patents

Akustische Oberfächenwellenanordnung mit einem Tor

Info

Publication number
DE69721420T2
DE69721420T2 DE69721420T DE69721420T DE69721420T2 DE 69721420 T2 DE69721420 T2 DE 69721420T2 DE 69721420 T DE69721420 T DE 69721420T DE 69721420 T DE69721420 T DE 69721420T DE 69721420 T2 DE69721420 T2 DE 69721420T2
Authority
DE
Germany
Prior art keywords
gate
surface wave
acoustic surface
wave arrangement
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69721420T
Other languages
English (en)
Other versions
DE69721420D1 (de
Inventor
Koji Nakashima
Hideya Morishita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Application granted granted Critical
Publication of DE69721420D1 publication Critical patent/DE69721420D1/de
Publication of DE69721420T2 publication Critical patent/DE69721420T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
    • H03H9/72—Networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
DE69721420T 1996-09-19 1997-09-17 Akustische Oberfächenwellenanordnung mit einem Tor Expired - Fee Related DE69721420T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP24803196 1996-09-19
JP9088132A JPH10150341A (ja) 1996-09-19 1997-04-07 １ポート型弾性表面波装置

Publications (2)

Publication Number Publication Date
DE69721420D1 DE69721420D1 (de) 2003-06-05
DE69721420T2 true DE69721420T2 (de) 2003-11-13

Family

ID=26429576

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69721420T Expired - Fee Related DE69721420T2 (de) 1996-09-19 1997-09-17 Akustische Oberfächenwellenanordnung mit einem Tor

Country Status (5)

Country Link
US (1) US6166476A (de)
EP (1) EP0831585B1 (de)
JP (1) JPH10150341A (de)
KR (1) KR100287816B1 (de)
DE (1) DE69721420T2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000033455A1 (fr) * 1998-12-02 2000-06-08 Seiko Epson Corporation Dispositif piezo-electrique et son procédé de fabrication
US20030038356A1 (en) * 2001-08-24 2003-02-27 Derderian James M Semiconductor devices including stacking spacers thereon, assemblies including the semiconductor devices, and methods
JP4180982B2 (ja) * 2003-06-16 2008-11-12 富士通メディアデバイス株式会社 弾性表面波デバイス、そのパッケージ及びその製造方法
JP2006311183A (ja) * 2005-04-28 2006-11-09 Sony Corp 半導体装置およびその製造方法
JP2008278149A (ja) * 2007-04-27 2008-11-13 Toppan Printing Co Ltd 弾性表面波装置
JP6472945B2 (ja) * 2013-06-13 2019-02-20 太陽誘電株式会社 弾性波デバイス
JP6653647B2 (ja) * 2016-12-21 2020-02-26 太陽誘電株式会社 弾性波デバイス

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3038261A1 (de) * 1980-10-10 1982-04-29 Standard Elektrik Lorenz Ag, 7000 Stuttgart Baueinheit mit piezoelektrischen resonatoren
DE3485015D1 (de) * 1983-12-15 1991-10-10 Toshiba Kawasaki Kk Akustischer oberflaechenwellenresonator.
JPS62173814A (ja) * 1986-01-28 1987-07-30 Alps Electric Co Ltd 弾性表面波素子搭載ユニツト
JP2673993B2 (ja) * 1990-07-02 1997-11-05 日本無線株式会社 表面弾性波装置
JPH04170811A (ja) * 1990-11-05 1992-06-18 Fujitsu Ltd 弾性表面波デバイス
US5459368A (en) * 1993-08-06 1995-10-17 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device mounted module
US5400950A (en) * 1994-02-22 1995-03-28 Delco Electronics Corporation Method for controlling solder bump height for flip chip integrated circuit devices
JPH07303022A (ja) * 1994-05-09 1995-11-14 Murata Mfg Co Ltd 弾性表面波装置
JP3301262B2 (ja) * 1995-03-28 2002-07-15 松下電器産業株式会社 弾性表面波装置
JP3194849B2 (ja) * 1995-05-30 2001-08-06 日本無線株式会社 弾性表面波デバイス製造方法

Also Published As

Publication number Publication date
US6166476A (en) 2000-12-26
KR100287816B1 (ko) 2001-04-16
EP0831585A3 (de) 1999-05-19
EP0831585A2 (de) 1998-03-25
KR19980024756A (ko) 1998-07-06
EP0831585B1 (de) 2003-05-02
JPH10150341A (ja) 1998-06-02
DE69721420D1 (de) 2003-06-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee