DE69721153D1 - Verpackung eines optoelektronischen Bauelements - Google Patents
Verpackung eines optoelektronischen BauelementsInfo
- Publication number
- DE69721153D1 DE69721153D1 DE69721153T DE69721153T DE69721153D1 DE 69721153 D1 DE69721153 D1 DE 69721153D1 DE 69721153 T DE69721153 T DE 69721153T DE 69721153 T DE69721153 T DE 69721153T DE 69721153 D1 DE69721153 D1 DE 69721153D1
- Authority
- DE
- Germany
- Prior art keywords
- packaging
- optoelectronic component
- optoelectronic
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005693 optoelectronics Effects 0.000 title 1
- 238000004806 packaging method and process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Light Receiving Elements (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21921896 | 1996-07-31 | ||
JP21921896A JP3436009B2 (ja) | 1996-07-31 | 1996-07-31 | 光半導体素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69721153D1 true DE69721153D1 (de) | 2003-05-28 |
DE69721153T2 DE69721153T2 (de) | 2004-02-19 |
Family
ID=16732060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69721153T Expired - Fee Related DE69721153T2 (de) | 1996-07-31 | 1997-07-28 | Verpackung eines optoelektronischen Bauelements |
Country Status (5)
Country | Link |
---|---|
US (1) | US6034424A (de) |
EP (1) | EP0825653B1 (de) |
JP (1) | JP3436009B2 (de) |
KR (1) | KR100265456B1 (de) |
DE (1) | DE69721153T2 (de) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000275277A (ja) * | 1999-03-24 | 2000-10-06 | Ando Electric Co Ltd | 電気光学サンプリングプローバ |
US6866923B2 (en) * | 2000-11-15 | 2005-03-15 | Atlas Roofing Corporation | Thermosetting plastic foams and methods of production thereof using adhesion additives |
US7023022B2 (en) | 2000-11-16 | 2006-04-04 | Emcore Corporation | Microelectronic package having improved light extraction |
US6555903B2 (en) * | 2000-12-19 | 2003-04-29 | Truelight Corporation | Package structure of hybrid device in optical signal transmitter |
US6536958B2 (en) | 2000-12-20 | 2003-03-25 | Triquint Technology Holding Co. | Optical device package with hermetically bonded fibers |
US7019335B2 (en) * | 2001-04-17 | 2006-03-28 | Nichia Corporation | Light-emitting apparatus |
DE10159544A1 (de) * | 2001-12-05 | 2003-06-26 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Verfahren zur Herstellung eines optoelektronischen Halbleiter-Bauelementes und damit hergestelltes Bauelement |
US6936495B1 (en) | 2002-01-09 | 2005-08-30 | Bridge Semiconductor Corporation | Method of making an optoelectronic semiconductor package device |
US6891276B1 (en) | 2002-01-09 | 2005-05-10 | Bridge Semiconductor Corporation | Semiconductor package device |
JP2003258272A (ja) * | 2002-02-27 | 2003-09-12 | Sumitomo Electric Ind Ltd | 光受信モジュール |
US6806547B2 (en) * | 2002-03-28 | 2004-10-19 | Sumitomo Electric Industries, Ltd. | Light-receiving module |
US20030185522A1 (en) * | 2002-04-02 | 2003-10-02 | Young Craig A. | Bend limiter |
TW540816U (en) * | 2002-05-30 | 2003-07-01 | Hon Hai Prec Ind Co Ltd | Semiconductor package |
JP3989350B2 (ja) * | 2002-09-30 | 2007-10-10 | 新光電気工業株式会社 | ガラス端子 |
US20040076383A1 (en) * | 2002-10-17 | 2004-04-22 | Huei Peng | Self-aligned metal base/window cap and methods of aligning a laser diode chip to a window cap for high speed semiconductor laser package |
DE10255462B4 (de) * | 2002-11-25 | 2005-07-07 | Infineon Technologies Ag | Elektrische Anordnung und Verfahren zum Herstellen einer elektrischen Anordnung |
US7038900B2 (en) * | 2003-02-27 | 2006-05-02 | Greatbatch-Sierra, Inc. | EMI filter terminal assembly with wire bond pads for human implant applications |
KR100464342B1 (ko) | 2003-04-14 | 2005-01-03 | 삼성전자주식회사 | 티오-캔 구조의 광 모듈 |
US7406268B2 (en) * | 2003-08-27 | 2008-07-29 | Avago Technologies Limited | Optical receiver circuit |
JP4470583B2 (ja) | 2004-05-21 | 2010-06-02 | 住友電気工業株式会社 | 光半導体装置 |
US20070096132A1 (en) * | 2005-11-01 | 2007-05-03 | Jiahn-Chang Wu | Coaxial LED lighting board |
JP2007201213A (ja) | 2006-01-27 | 2007-08-09 | Opnext Japan Inc | 光受信モジュール |
JP4970924B2 (ja) * | 2006-03-28 | 2012-07-11 | 三菱電機株式会社 | 光素子用パッケージとこれを用いた光半導体装置 |
JP2010034287A (ja) * | 2008-07-29 | 2010-02-12 | Sumitomo Electric Ind Ltd | キャップ及び光モジュール |
US20100252856A1 (en) * | 2009-01-28 | 2010-10-07 | Coretek Opto Corp. | Header structure of opto-electronic element and opto-electronic element using the same |
DE102011013278B4 (de) * | 2011-03-07 | 2020-06-18 | Schott Ag | Gehäuse für Hochleistungsleuchtdioden - "1-Lagen-System" |
KR101778303B1 (ko) * | 2011-04-13 | 2017-09-13 | 한국전자통신연구원 | 고속 신호 전송을 위한 to-can(티오-캔) 구조의 광모듈 |
FR3001578B1 (fr) * | 2013-01-31 | 2015-04-03 | New Imaging Technologies Sas | Matrice de photodiode a zone dopee absorbant les charges |
JP6239970B2 (ja) * | 2013-12-25 | 2017-11-29 | 京セラ株式会社 | To−can型パッケージ用ヘッダーおよび半導体装置 |
WO2017033860A1 (ja) * | 2015-08-24 | 2017-03-02 | 京セラ株式会社 | 電子部品搭載用パッケージおよびそれを用いた電子装置 |
CN109075527B (zh) * | 2016-04-26 | 2021-06-29 | 京瓷株式会社 | 半导体封装件及使用其的半导体装置 |
USD877707S1 (en) * | 2017-03-30 | 2020-03-10 | Mitsubishi Electric Corporation | Semiconductor package |
JP6408661B2 (ja) * | 2017-07-21 | 2018-10-17 | 京セラ株式会社 | To−can型パッケージ用ヘッダーおよび半導体装置 |
TWI657237B (zh) * | 2018-02-21 | 2019-04-21 | 茂達電子股份有限公司 | 光學偵測裝置及光學封裝結構 |
CN114696209A (zh) * | 2020-12-28 | 2022-07-01 | 新光电气工业株式会社 | 半导体封装用管座 |
KR102455733B1 (ko) * | 2022-02-11 | 2022-10-18 | 주식회사 지오스테크놀러지 | 트랜지스터 아웃라인 패키지 제조 장치 및 이의 제조 방법 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3805347A (en) * | 1969-12-29 | 1974-04-23 | Gen Electric | Solid state lamp construction |
DE2509047C3 (de) * | 1975-03-01 | 1980-07-10 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Kunststoffgehäuse für eine Lumineszenzdiode |
JPS6177347A (ja) * | 1984-09-21 | 1986-04-19 | Rohm Co Ltd | 半導体製造方法 |
JPS62112389A (ja) * | 1985-11-12 | 1987-05-23 | Hitachi Ltd | 半導体レ−ザモジユ−ル |
EP0372742B1 (de) * | 1988-12-06 | 1995-08-16 | Ortel Corporation | Optischer Breitbandempfänger |
US5179461A (en) * | 1988-12-06 | 1993-01-12 | Ortel Corporation | Broadband optical receiver with passiner tuning network |
JPH02230206A (ja) * | 1989-03-03 | 1990-09-12 | Fujikura Ltd | 光ファイバ融着接続機 |
JPH0442953A (ja) * | 1990-06-06 | 1992-02-13 | Hosiden Corp | バーコードリーダ用受光素子 |
JPH0448784A (ja) * | 1990-06-15 | 1992-02-18 | Sumitomo Electric Ind Ltd | 受光素子パッケージ |
JPH04111477A (ja) * | 1990-08-31 | 1992-04-13 | Sumitomo Electric Ind Ltd | 受光素子 |
JPH05243604A (ja) * | 1992-02-27 | 1993-09-21 | Eastman Kodak Japan Kk | 発光素子 |
KR100309623B1 (ko) * | 1994-02-28 | 2002-04-24 | 사토 게니치로 | 발광다이오드램프및이를이용한매트릭스표시기 |
JP3047735B2 (ja) * | 1994-05-16 | 2000-06-05 | 住友電気工業株式会社 | 光受信モジュ−ルとその製造方法 |
JPH08276719A (ja) * | 1995-04-07 | 1996-10-22 | Matsushita Electric Ind Co Ltd | 自動車用空調装置の日射センサ |
US5798536A (en) * | 1996-01-25 | 1998-08-25 | Rohm Co., Ltd. | Light-emitting semiconductor device and method for manufacturing the same |
-
1996
- 1996-07-31 JP JP21921896A patent/JP3436009B2/ja not_active Expired - Fee Related
-
1997
- 1997-07-28 DE DE69721153T patent/DE69721153T2/de not_active Expired - Fee Related
- 1997-07-28 EP EP97305675A patent/EP0825653B1/de not_active Expired - Lifetime
- 1997-07-29 US US08/902,580 patent/US6034424A/en not_active Expired - Lifetime
- 1997-07-31 KR KR1019970036435A patent/KR100265456B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US6034424A (en) | 2000-03-07 |
EP0825653A3 (de) | 1998-04-08 |
EP0825653A2 (de) | 1998-02-25 |
DE69721153T2 (de) | 2004-02-19 |
EP0825653B1 (de) | 2003-04-23 |
JP3436009B2 (ja) | 2003-08-11 |
KR980012310A (ko) | 1998-04-30 |
KR100265456B1 (ko) | 2000-10-02 |
JPH1051024A (ja) | 1998-02-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |