DE69721148D1 - Säulengitter-Verbindungen - Google Patents

Säulengitter-Verbindungen

Info

Publication number
DE69721148D1
DE69721148D1 DE69721148T DE69721148T DE69721148D1 DE 69721148 D1 DE69721148 D1 DE 69721148D1 DE 69721148 T DE69721148 T DE 69721148T DE 69721148 T DE69721148 T DE 69721148T DE 69721148 D1 DE69721148 D1 DE 69721148D1
Authority
DE
Germany
Prior art keywords
grid connections
columns grid
columns
connections
grid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69721148T
Other languages
English (en)
Other versions
DE69721148T2 (de
Inventor
Robert Charles Dockerty
Ronald Maurice Fraga
Ciro Neal Ramirez
Sudipta Kumar Ray
Gordon Jay Robbins
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE69721148D1 publication Critical patent/DE69721148D1/de
Application granted granted Critical
Publication of DE69721148T2 publication Critical patent/DE69721148T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0465—Shape of solder, e.g. differing from spherical shape, different shapes due to different solder pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
DE69721148T 1996-07-29 1997-07-09 Säulengitter-Verbindungen Expired - Fee Related DE69721148T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/688,073 US6395991B1 (en) 1996-07-29 1996-07-29 Column grid array substrate attachment with heat sink stress relief

Publications (2)

Publication Number Publication Date
DE69721148D1 true DE69721148D1 (de) 2003-05-28
DE69721148T2 DE69721148T2 (de) 2003-12-11

Family

ID=24763007

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69721148T Expired - Fee Related DE69721148T2 (de) 1996-07-29 1997-07-09 Säulengitter-Verbindungen

Country Status (5)

Country Link
US (1) US6395991B1 (de)
EP (1) EP0822738B1 (de)
JP (1) JP3368177B2 (de)
KR (1) KR100264638B1 (de)
DE (1) DE69721148T2 (de)

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JP4311774B2 (ja) * 1998-03-11 2009-08-12 富士通株式会社 電子部品パッケージおよびプリント配線板
AU5305799A (en) * 1998-09-02 2000-03-27 Ibiden Co. Ltd. Electronic part module mounted on socket
US6927491B1 (en) * 1998-12-04 2005-08-09 Nec Corporation Back electrode type electronic part and electronic assembly with the same mounted on printed circuit board
KR100598329B1 (ko) * 1999-06-12 2006-07-10 주식회사 하이닉스반도체 반도체 패키지 및 그의 제작방법
US20010042910A1 (en) * 2000-01-06 2001-11-22 Eng Klan Teng Vertical ball grid array integrated circuit package
US6672370B2 (en) * 2000-03-14 2004-01-06 Intel Corporation Apparatus and method for passive phase change thermal management
US6710264B2 (en) * 2001-11-16 2004-03-23 Hewlett-Packard Development Company, L.P. Method and apparatus for supporting a circuit component having solder column interconnects using external support
US20040134680A1 (en) * 2003-01-09 2004-07-15 Xiang Dai Use of perimeter stops to support solder interconnects between integrated circuit assembly components
KR100468783B1 (ko) * 2003-02-11 2005-01-29 삼성전자주식회사 반도체 모듈로부터 발생되는 열을 소산시키는 집게형 장치
US7480143B2 (en) * 2003-04-21 2009-01-20 Hewlett-Packard Development Company, L.P. Variable-gap thermal-interface device
US6798663B1 (en) * 2003-04-21 2004-09-28 Hewlett Packard Development Company, L.P. Heat sink hold-down with fan-module attach location
US20040226688A1 (en) * 2003-04-30 2004-11-18 Arthur Fong Application specific apparatus for dissipating heat from multiple electronic components
US7224071B2 (en) * 2003-05-22 2007-05-29 Texas Instruments Incorporated System and method to increase die stand-off height
US6956762B2 (en) * 2003-05-23 2005-10-18 Hewlett-Packard Development Company, L.P. Method and system for data communication on a chip
US7732918B2 (en) * 2003-08-25 2010-06-08 Nanoconduction, Inc. Vapor chamber heat sink having a carbon nanotube fluid interface
US20070114658A1 (en) * 2004-08-24 2007-05-24 Carlos Dangelo Integrated Circuit Micro-Cooler with Double-Sided Tubes of a CNT Array
US7109581B2 (en) * 2003-08-25 2006-09-19 Nanoconduction, Inc. System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
US7538422B2 (en) * 2003-08-25 2009-05-26 Nanoconduction Inc. Integrated circuit micro-cooler having multi-layers of tubes of a CNT array
US7477527B2 (en) * 2005-03-21 2009-01-13 Nanoconduction, Inc. Apparatus for attaching a cooling structure to an integrated circuit
US8048688B2 (en) * 2006-10-24 2011-11-01 Samsung Electronics Co., Ltd. Method and apparatus for evaluation and improvement of mechanical and thermal properties of CNT/CNF arrays
US7209354B2 (en) * 2003-12-02 2007-04-24 Silicon Intergrated Systems Corp. Ball grid array package with heat sink device
JP4154397B2 (ja) * 2005-02-25 2008-09-24 富士通株式会社 電子装置及びスタンドオフ部材及び電子装置の製造方法
US8026583B2 (en) * 2005-09-14 2011-09-27 Htc Beteiligungs Gmbh Flip-chip module and method for the production thereof
DE102005043910A1 (de) * 2005-09-14 2007-03-15 Weissbach, Ernst-A. Flip-Chip-Modul und Verfahren zum Erzeugen eines Flip-Chip-Moduls
KR100938867B1 (ko) 2007-09-07 2010-01-27 이상수 음식 쓰레기 건조 처리기용 히트 싱크 및 발열체 어셈블리및 이의 제조 방법
JP2009135150A (ja) * 2007-11-28 2009-06-18 Toshiba Corp プリント回路板、プリント回路板の製造方法および電子機器
JP2012004165A (ja) * 2010-06-14 2012-01-05 Fujitsu Ltd 実装構造、配線基板組立体及び固定方法
US8415792B2 (en) 2010-08-04 2013-04-09 International Business Machines Corporation Electrical contact alignment posts
CN102148215B (zh) * 2011-01-21 2012-06-06 哈尔滨理工大学 提高ccga 器件软钎焊焊点可靠性的互连结构及实现方法
US10104772B2 (en) * 2014-08-19 2018-10-16 International Business Machines Incorporated Metallized particle interconnect with solder components
CN107139313B (zh) * 2017-06-09 2019-03-22 长安大学 一种智能压片机
CN110176437B (zh) * 2019-05-31 2020-11-03 合肥圣达电子科技实业有限公司 一种窄间距陶瓷接线柱及其制备方法

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Also Published As

Publication number Publication date
KR100264638B1 (ko) 2000-09-01
EP0822738B1 (de) 2003-04-23
EP0822738A3 (de) 1999-08-11
JP3368177B2 (ja) 2003-01-20
DE69721148T2 (de) 2003-12-11
EP0822738A2 (de) 1998-02-04
KR980013574A (ko) 1998-04-30
JPH1092983A (ja) 1998-04-10
US6395991B1 (en) 2002-05-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee