DE69707735T2 - Vorrichtung zum Verdampfen einer Flüssigkeit und Gasausstosseinrichtung - Google Patents

Vorrichtung zum Verdampfen einer Flüssigkeit und Gasausstosseinrichtung

Info

Publication number
DE69707735T2
DE69707735T2 DE69707735T DE69707735T DE69707735T2 DE 69707735 T2 DE69707735 T2 DE 69707735T2 DE 69707735 T DE69707735 T DE 69707735T DE 69707735 T DE69707735 T DE 69707735T DE 69707735 T2 DE69707735 T2 DE 69707735T2
Authority
DE
Germany
Prior art keywords
gas
gas ejection
feed
ejection device
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69707735T
Other languages
German (de)
English (en)
Other versions
DE69707735D1 (de
Inventor
Yukio Fukunaga
Akihisa Hongo
Takeshi Murakami
Naoaki Ogure
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of DE69707735D1 publication Critical patent/DE69707735D1/de
Publication of DE69707735T2 publication Critical patent/DE69707735T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563—Gas nozzles
    • C23C16/4557—Heated nozzles
    • H10P14/20—
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/4486—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by producing an aerosol and subsequent evaporation of the droplets or particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563—Gas nozzles
    • C23C16/45565—Shower nozzles

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
DE69707735T 1996-04-05 1997-04-04 Vorrichtung zum Verdampfen einer Flüssigkeit und Gasausstosseinrichtung Expired - Fee Related DE69707735T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11028296 1996-04-05

Publications (2)

Publication Number Publication Date
DE69707735D1 DE69707735D1 (de) 2001-12-06
DE69707735T2 true DE69707735T2 (de) 2002-08-01

Family

ID=14531747

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69707735T Expired - Fee Related DE69707735T2 (de) 1996-04-05 1997-04-04 Vorrichtung zum Verdampfen einer Flüssigkeit und Gasausstosseinrichtung

Country Status (5)

Country Link
US (1) US6036783A (enExample)
EP (1) EP0799907B1 (enExample)
KR (1) KR970072043A (enExample)
DE (1) DE69707735T2 (enExample)
TW (1) TW322602B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20307913U1 (de) 2003-05-19 2003-09-04 Martin Christ Gefriertrocknungsanlagen GmbH, 37520 Osterode Vorrichtung zur Konzentration von Stoffgemischen
DE102009049839A1 (de) * 2009-10-16 2011-12-15 Calyxo Gmbh Gasverdampfer für Beschichtungsanlagen

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6409839B1 (en) * 1997-06-02 2002-06-25 Msp Corporation Method and apparatus for vapor generation and film deposition
JPH11312649A (ja) * 1998-04-30 1999-11-09 Nippon Asm Kk Ｃｖｄ装置
US6210485B1 (en) * 1998-07-21 2001-04-03 Applied Materials, Inc. Chemical vapor deposition vaporizer
US6358323B1 (en) 1998-07-21 2002-03-19 Applied Materials, Inc. Method and apparatus for improved control of process and purge material in a substrate processing system
US20030101938A1 (en) * 1998-10-27 2003-06-05 Applied Materials, Inc. Apparatus for the deposition of high dielectric constant films
JP3470055B2 (ja) * 1999-01-22 2003-11-25 株式会社渡邊商行 Ｍｏｃｖｄ用気化器及び原料溶液の気化方法
US6267820B1 (en) * 1999-02-12 2001-07-31 Applied Materials, Inc. Clog resistant injection valve
DE19921744B4 (de) * 1999-05-11 2008-04-30 Applied Materials Gmbh & Co. Kg Verfahren zum Transport von mindestens einer dampfförmigen Substanz durch die Wand einer Vakuumkammer in die Vakuumkammer sowie Vorrichtung zur Durchführung des Verfahrens und deren Verwendung
US6548112B1 (en) * 1999-11-18 2003-04-15 Tokyo Electron Limited Apparatus and method for delivery of precursor vapor from low vapor pressure liquid sources to a CVD chamber
US6596085B1 (en) * 2000-02-01 2003-07-22 Applied Materials, Inc. Methods and apparatus for improved vaporization of deposition material in a substrate processing system
US6572706B1 (en) * 2000-06-19 2003-06-03 Simplus Systems Corporation Integrated precursor delivery system
US6299692B1 (en) * 2000-07-21 2001-10-09 Applied Materials, Inc. Head for vaporizing and flowing various precursor materials onto semiconductor wafers during chemical vapor deposition
US6302965B1 (en) * 2000-08-15 2001-10-16 Applied Materials, Inc. Dispersion plate for flowing vaporizes compounds used in chemical vapor deposition of films onto semiconductor surfaces
JPWO2002058141A1 (ja) * 2001-01-18 2004-05-27 株式会社渡邊商行 気化器及びそれを用いた各種装置並びに気化方法
WO2002069065A2 (en) * 2001-02-28 2002-09-06 Porter Instrument Company, Inc. Flow controller
US6827974B2 (en) * 2002-03-29 2004-12-07 Pilkington North America, Inc. Method and apparatus for preparing vaporized reactants for chemical vapor deposition
JP4202856B2 (ja) * 2003-07-25 2008-12-24 東京エレクトロン株式会社 ガス反応装置
CA2566944C (en) * 2004-05-20 2016-10-11 Nam Hung Tran Bubbler for constant vapor delivery of a solid chemical
US20070194470A1 (en) * 2006-02-17 2007-08-23 Aviza Technology, Inc. Direct liquid injector device
WO2007122203A2 (en) * 2006-04-20 2007-11-01 Shell Erneuerbare Energien Gmbh Thermal evaporation apparatus, use and method of depositing a material
CN101802254B (zh) * 2007-10-11 2013-11-27 瓦伦斯处理设备公司 化学气相沉积反应器
JP2009246168A (ja) * 2008-03-31 2009-10-22 Tokyo Electron Ltd 液体原料気化器及びそれを用いた成膜装置
JP5603065B2 (ja) * 2009-01-30 2014-10-08 パナソニックヘルスケア株式会社 滅菌物質供給装置およびアイソレータ
JP5614935B2 (ja) 2009-02-03 2014-10-29 株式会社渡辺商行 気化器、この気化器を用いたｍｏｃｖｄ用気化器、これら気化器若しくはｍｏｃｖｄ用気化器に用いられるセンターロッド、及びキャリアガスの分
JP4673449B1 (ja) * 2009-09-30 2011-04-20 シーケーディ株式会社 液体気化システム
US20120276291A1 (en) * 2011-04-28 2012-11-01 Bird Chester D Methods and Apparatuses for Reducing Gelation of Glass Precursor Materials During Vaporization
US9574268B1 (en) * 2011-10-28 2017-02-21 Asm America, Inc. Pulsed valve manifold for atomic layer deposition
US9388492B2 (en) 2011-12-27 2016-07-12 Asm America, Inc. Vapor flow control apparatus for atomic layer deposition
US10113232B2 (en) 2014-07-31 2018-10-30 Lam Research Corporation Azimuthal mixer
US9951421B2 (en) * 2014-12-10 2018-04-24 Lam Research Corporation Inlet for effective mixing and purging
US9877514B2 (en) 2015-09-21 2018-01-30 Cloud V Enterprises Vaporizer with electronically heated nail
US10662527B2 (en) 2016-06-01 2020-05-26 Asm Ip Holding B.V. Manifolds for uniform vapor deposition
TWI616555B (zh) * 2017-01-17 2018-03-01 漢民科技股份有限公司 應用於半導體設備之噴氣裝置
US12516414B2 (en) 2019-03-19 2026-01-06 Asm Ip Holding B.V. Reactor manifolds
US11492701B2 (en) 2019-03-19 2022-11-08 Asm Ip Holding B.V. Reactor manifolds
US11788190B2 (en) 2019-07-05 2023-10-17 Asm Ip Holding B.V. Liquid vaporizer
US11946136B2 (en) 2019-09-20 2024-04-02 Asm Ip Holding B.V. Semiconductor processing device
KR20210048408A (ko) 2019-10-22 2021-05-03 에이에스엠 아이피 홀딩 비.브이. 반도체 증착 반응기 매니폴드
USD1080812S1 (en) 2022-08-29 2025-06-24 Applied Materials, Inc. Gas mixer
CN116904970B (zh) * 2023-07-31 2025-03-25 重庆理工大学 一种半导体处理设备

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4847469A (en) * 1987-07-15 1989-07-11 The Boc Group, Inc. Controlled flow vaporizer
JP2796975B2 (ja) * 1988-11-28 1998-09-10 株式会社高純度化学研究所 液体原料気化装置
US5316796A (en) * 1990-03-09 1994-05-31 Nippon Telegraph And Telephone Corporation Process for growing a thin metallic film
US5252134A (en) * 1991-05-31 1993-10-12 Stauffer Craig M Integrated delivery system for chemical vapor from non-gaseous sources for semiconductor processing
DE4124018C1 (enExample) * 1991-07-19 1992-11-19 Leybold Ag, 6450 Hanau, De
JPH0582507A (ja) * 1991-09-18 1993-04-02 Applied Materials Japan Kk 液体気化バルブ
JPH06291040A (ja) * 1992-03-03 1994-10-18 Rintetsuku:Kk 液体気化供給方法と液体気化供給器
JP3118493B2 (ja) * 1993-04-27 2000-12-18 菱電セミコンダクタシステムエンジニアリング株式会社 液体原料用ｃｖｄ装置
US5435850A (en) * 1993-09-17 1995-07-25 Fei Company Gas injection system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20307913U1 (de) 2003-05-19 2003-09-04 Martin Christ Gefriertrocknungsanlagen GmbH, 37520 Osterode Vorrichtung zur Konzentration von Stoffgemischen
DE102009049839A1 (de) * 2009-10-16 2011-12-15 Calyxo Gmbh Gasverdampfer für Beschichtungsanlagen
DE102009049839B4 (de) * 2009-10-16 2012-12-06 Calyxo Gmbh Gasverdampfer für Beschichtungsanlagen sowie Verfahren zu dessen Betreiben

Also Published As

Publication number Publication date
TW322602B (enExample) 1997-12-11
KR970072043A (ko) 1997-11-07
EP0799907B1 (en) 2001-10-31
EP0799907A1 (en) 1997-10-08
US6036783A (en) 2000-03-14
DE69707735D1 (de) 2001-12-06

Similar Documents

Publication Publication Date Title
DE69707735T2 (de) Vorrichtung zum Verdampfen einer Flüssigkeit und Gasausstosseinrichtung
DE69722359T2 (de) Vorrichtung zum Verdampfen von Flüssigkeiten und Gaseinspritzeinrichtung
DE69706936T2 (de) Duse für Reaktionsgase
US5951923A (en) Vaporizer apparatus and film deposition apparatus therewith
DE68902250T2 (de) Verfahren und vorrichtung zur tiefkuehlung von produkten.
EP1252363B1 (de) Vorrichtung und verfahren zum abscheiden einer oder mehrerer schichten auf ein substrat
DE69826559T2 (de) Dampferzeugungsverfahren und Vorrichtung zur Durchführung dieses Verfahren
DE3686242T2 (de) Entwickelvorrichtung fuer photolacke.
EP1162680B1 (de) Vorrichtung und Verfahren zum Befeuchten eines Gasstroms sowie Verwendung der Vorrichtung
DE112011100462T5 (de) Feintröpfchen-Zerstäuber für die Flüssigprekursor-Verdampfung
DE69902141T2 (de) Rotationsscheibenverdampfer
DE2703169C2 (de) Verfahren zur Herstellung von Metallpulver und Vorrichtung zum Durchführen des Verfahrens
DE2719956A1 (de) Mehrphasenstroemungsrohr zum mischen, reagieren und ausdampfen
DE2403913A1 (de) Verfahren und vorrichtung zum schnellen abkuehlen von behaeltern in einem heizraum
EP1094911B1 (de) Verfahren und vorrichtung zum herstellen von weichlotpulver
EP2367678A1 (de) Verfahren zur temperierung einer heiss isostatischen presse und ein heiss isostatische presse
EP0933445B1 (de) Verfahren und Vorrichtung zur Gasphasenbeschichtung von Werkstücken
DE102018119194A1 (de) Vorrichtung zum herstellen von metallpulver und herstellungsverfahren dafür
DE19743922C1 (de) Verfahren zur CVD-Oberflächenbeschichtung und CVD-Reaktorsystem
DE69835310T2 (de) System zur Versorgung mit Dampf
DE19755643A1 (de) Vorrichtung zum Verdampfen von Flüssigkeit und zum Herstellen von Gas/Dampf-Gemischen
DE20015744U1 (de) Pumpe mit Wassereinspeisung
DE102018216250B4 (de) Reaktor zur Entgasung einer Polymerschmelze und Polykondensation
DE69709270T2 (de) Verfahren zur Verdampfung flüssiger Beschickungen und Verdampfer dafür
WO2009090089A1 (de) Temperieren der düsenplatte eines unterwassergranulators

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee