DE69705848T2 - Verfahren zum erzielen von mehreren integrierten optischen köpfe - Google Patents
Verfahren zum erzielen von mehreren integrierten optischen köpfeInfo
- Publication number
- DE69705848T2 DE69705848T2 DE69705848T DE69705848T DE69705848T2 DE 69705848 T2 DE69705848 T2 DE 69705848T2 DE 69705848 T DE69705848 T DE 69705848T DE 69705848 T DE69705848 T DE 69705848T DE 69705848 T2 DE69705848 T2 DE 69705848T2
- Authority
- DE
- Germany
- Prior art keywords
- optical
- wafer
- substrate
- alignment
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 125
- 238000000034 method Methods 0.000 title claims description 20
- 239000000758 substrate Substances 0.000 claims abstract description 73
- 229910000679 solder Inorganic materials 0.000 claims abstract description 11
- 235000012431 wafers Nutrition 0.000 claims description 41
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000000206 photolithography Methods 0.000 claims description 6
- 238000013500 data storage Methods 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 238000001465 metallisation Methods 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000005549 size reduction Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000001427 coherent effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/135—Means for guiding the beam from the source to the record carrier or from the record carrier to the detector
- G11B7/1372—Lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
- G02B6/4231—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment with intermediate elements, e.g. rods and balls, between the elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/123—Integrated head arrangements, e.g. with source and detectors mounted on the same substrate
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/135—Means for guiding the beam from the source to the record carrier or from the record carrier to the detector
- G11B7/1353—Diffractive elements, e.g. holograms or gratings
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/135—Means for guiding the beam from the source to the record carrier or from the record carrier to the detector
- G11B7/1372—Lenses
- G11B7/1374—Objective lenses
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/22—Apparatus or processes for the manufacture of optical heads, e.g. assembly
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12102—Lens
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12107—Grating
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
- G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
- G02B6/4224—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera using visual alignment markings, e.g. index methods
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4238—Soldering
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Optical Head (AREA)
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
- Led Device Packages (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/727,837 US5771218A (en) | 1996-09-27 | 1996-09-27 | Passively aligned integrated optical head including light source, detector, and optical element and methods of forming same |
| PCT/US1997/017279 WO1998013825A2 (en) | 1996-09-27 | 1997-09-26 | Integrated optical head apparatus and associated methods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69705848D1 DE69705848D1 (de) | 2001-08-30 |
| DE69705848T2 true DE69705848T2 (de) | 2002-04-04 |
Family
ID=24924279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69705848T Expired - Fee Related DE69705848T2 (de) | 1996-09-27 | 1997-09-26 | Verfahren zum erzielen von mehreren integrierten optischen köpfe |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US5771218A (enExample) |
| EP (1) | EP0928481B1 (enExample) |
| JP (2) | JP2001501351A (enExample) |
| AT (1) | ATE203620T1 (enExample) |
| AU (1) | AU4738497A (enExample) |
| DE (1) | DE69705848T2 (enExample) |
| WO (1) | WO1998013825A2 (enExample) |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8153957B2 (en) * | 1996-09-27 | 2012-04-10 | Digitaloptics Corporation East | Integrated optical imaging systems including an interior space between opposing substrates and associated methods |
| US5771218A (en) * | 1996-09-27 | 1998-06-23 | Digital Optics Corporation | Passively aligned integrated optical head including light source, detector, and optical element and methods of forming same |
| US6235141B1 (en) | 1996-09-27 | 2001-05-22 | Digital Optics Corporation | Method of mass producing and packaging integrated optical subsystems |
| US6096155A (en) | 1996-09-27 | 2000-08-01 | Digital Optics Corporation | Method of dicing wafer level integrated multiple optical elements |
| US20080136955A1 (en) * | 1996-09-27 | 2008-06-12 | Tessera North America. | Integrated camera and associated methods |
| US5886971A (en) * | 1996-09-27 | 1999-03-23 | Digital Optics Corporation | Optical head structures including support substrates adjacent transparent substrates and related methods |
| US5912872A (en) * | 1996-09-27 | 1999-06-15 | Digital Optics Corporation | Integrated optical apparatus providing separated beams on a detector and associated methods |
| US6121603A (en) * | 1997-12-01 | 2000-09-19 | Hang; Zhijiang | Optical confocal device having a common light directing means |
| US6426829B1 (en) | 1998-03-26 | 2002-07-30 | Digital Optics Corp. | Integrated micro-optical systems |
| US20080128844A1 (en) * | 2002-11-18 | 2008-06-05 | Tessera North America | Integrated micro-optical systems and cameras including the same |
| DE69908325T2 (de) | 1998-03-26 | 2004-04-01 | Digital Optics Corp. | Integrierte mikrooptische systeme |
| US6188062B1 (en) * | 1998-04-08 | 2001-02-13 | Hoetron, Inc. | Laser/detector hybrid with integrated mirror and diffracted returned beam |
| US20010026399A1 (en) * | 1998-09-24 | 2001-10-04 | Masaaki Nakabayashi | Diffractive optical element and method of manufacture of the same |
| JP3290631B2 (ja) * | 1998-10-02 | 2002-06-10 | キヤノン株式会社 | 光学ユニット、光学ユニットの製造方法、光学ユニットを用いた光学系、光学ユニットを用いた露光装置及びこの露光装置を用いたデバイスの製造方法 |
| US6243508B1 (en) | 1999-06-01 | 2001-06-05 | Picolight Incorporated | Electro-opto-mechanical assembly for coupling a light source or receiver to an optical waveguide |
| US20040041081A1 (en) * | 2002-08-30 | 2004-03-04 | Feldman Michael R. | Integrated optical transceiver and related methods |
| US20070181781A1 (en) * | 2001-03-06 | 2007-08-09 | Digital Optics Corporation | Integrated optical transceiver |
| US6351443B1 (en) * | 1999-11-04 | 2002-02-26 | Industrial Technology Research Institute | Diffractive stack pickup head for optical disk drives and method to fabricate the pickup head |
| JP2003526909A (ja) * | 2000-03-06 | 2003-09-09 | ディジタル・オプティックス・コーポレイション | 集積化された光トランシーバおよび関連方法 |
| US7842914B2 (en) * | 2000-03-06 | 2010-11-30 | Tessera North America, Inc. | Optoelectronic package, camera including the same and related methods |
| JP2002062417A (ja) | 2000-06-07 | 2002-02-28 | Canon Inc | 回折光学素子、該回折光学素子を有する光学系及び光学機器、回折光学素子の製造方法、回折光学素子製造用の金型 |
| US6701038B2 (en) * | 2001-03-05 | 2004-03-02 | The Microoptical Corporation | Micro-electromechanical optical switch assembly for optical data networks |
| US6892002B2 (en) * | 2001-03-29 | 2005-05-10 | Ibsen Photonics A/S | Stacked planar integrated optics and tool for fabricating same |
| US20020163865A1 (en) * | 2001-05-01 | 2002-11-07 | Zimmer Erik J. | Optical pickup unit assembly process |
| US6910812B2 (en) | 2001-05-15 | 2005-06-28 | Peregrine Semiconductor Corporation | Small-scale optoelectronic package |
| JP2003008127A (ja) * | 2001-06-19 | 2003-01-10 | Mitsumi Electric Co Ltd | レーザダイオード固定方法 |
| US7212599B2 (en) * | 2002-01-25 | 2007-05-01 | Applied Micro Circuits Corporation | Jitter and wander reduction apparatus |
| KR20050007459A (ko) * | 2002-04-16 | 2005-01-18 | 엑스룸 포토닉스 리미티드 | 통합 커넥터를 구비한 전자 광학 회로 및 그 제조 방법 |
| US20040021214A1 (en) * | 2002-04-16 | 2004-02-05 | Avner Badehi | Electro-optic integrated circuits with connectors and methods for the production thereof |
| US8059345B2 (en) * | 2002-07-29 | 2011-11-15 | Digitaloptics Corporation East | Integrated micro-optical systems |
| JP3804834B2 (ja) * | 2003-03-25 | 2006-08-02 | 住友電気工業株式会社 | 光送受信モジュール |
| US20070110361A1 (en) * | 2003-08-26 | 2007-05-17 | Digital Optics Corporation | Wafer level integration of multiple optical elements |
| WO2005026919A2 (en) * | 2003-09-11 | 2005-03-24 | Bradford Addison Clough | Acquisition and analysis of time location-specific image data |
| US7538358B2 (en) | 2003-10-15 | 2009-05-26 | Xloom Communications, Ltd. | Electro-optical circuitry having integrated connector and methods for the production thereof |
| US7165896B2 (en) * | 2004-02-12 | 2007-01-23 | Hymite A/S | Light transmitting modules with optical power monitoring |
| US20090093137A1 (en) * | 2007-10-08 | 2009-04-09 | Xloom Communications, (Israel) Ltd. | Optical communications module |
| CN103050502A (zh) * | 2012-12-28 | 2013-04-17 | 格科微电子(上海)有限公司 | 晶圆级镜头模组阵列、阵列组合及两者的制作方法 |
| JP2015079830A (ja) * | 2013-10-16 | 2015-04-23 | 三菱電機株式会社 | 光半導体装置、光半導体装置の製造方法、及び光モジュールの製造方法 |
| US10234695B2 (en) * | 2015-02-16 | 2019-03-19 | Apple Inc. | Low-temperature hermetic sealing for diffractive optical element stacks |
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| JPH07287883A (ja) * | 1994-04-19 | 1995-10-31 | Victor Co Of Japan Ltd | 光集積回路 |
| JPH07296441A (ja) * | 1994-04-28 | 1995-11-10 | Sony Corp | 光学装置 |
| JP2806293B2 (ja) * | 1994-10-06 | 1998-09-30 | 松下電器産業株式会社 | 光ピックアップ及びその製造方法 |
| JPH09251663A (ja) * | 1996-03-15 | 1997-09-22 | Toshiba Corp | 光学素子ユニットおよびその製造方法 |
| US5771218A (en) * | 1996-09-27 | 1998-06-23 | Digital Optics Corporation | Passively aligned integrated optical head including light source, detector, and optical element and methods of forming same |
-
1996
- 1996-09-27 US US08/727,837 patent/US5771218A/en not_active Expired - Lifetime
-
1997
- 1997-09-26 WO PCT/US1997/017279 patent/WO1998013825A2/en not_active Ceased
- 1997-09-26 JP JP10515930A patent/JP2001501351A/ja not_active Ceased
- 1997-09-26 DE DE69705848T patent/DE69705848T2/de not_active Expired - Fee Related
- 1997-09-26 AT AT97909876T patent/ATE203620T1/de not_active IP Right Cessation
- 1997-09-26 AU AU47384/97A patent/AU4738497A/en not_active Abandoned
- 1997-09-26 EP EP97909876A patent/EP0928481B1/en not_active Expired - Lifetime
- 1997-12-19 US US08/994,205 patent/US5872762A/en not_active Expired - Lifetime
-
2009
- 2009-07-13 JP JP2009164638A patent/JP5053336B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP0928481A2 (en) | 1999-07-14 |
| JP2001501351A (ja) | 2001-01-30 |
| US5771218A (en) | 1998-06-23 |
| US5872762A (en) | 1999-02-16 |
| ATE203620T1 (de) | 2001-08-15 |
| WO1998013825A2 (en) | 1998-04-02 |
| EP0928481B1 (en) | 2001-07-25 |
| AU4738497A (en) | 1998-04-17 |
| JP5053336B2 (ja) | 2012-10-17 |
| JP2009238365A (ja) | 2009-10-15 |
| WO1998013825A3 (en) | 1998-08-06 |
| DE69705848D1 (de) | 2001-08-30 |
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| 8339 | Ceased/non-payment of the annual fee |