DE69704252T2 - Kontinuierlich geformte Plastikteile oder Zusammensätze - Google Patents

Kontinuierlich geformte Plastikteile oder Zusammensätze

Info

Publication number
DE69704252T2
DE69704252T2 DE69704252T DE69704252T DE69704252T2 DE 69704252 T2 DE69704252 T2 DE 69704252T2 DE 69704252 T DE69704252 T DE 69704252T DE 69704252 T DE69704252 T DE 69704252T DE 69704252 T2 DE69704252 T2 DE 69704252T2
Authority
DE
Germany
Prior art keywords
assemblies
plastic parts
shaped plastic
continuously shaped
continuously
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69704252T
Other languages
English (en)
Other versions
DE69704252D1 (de
Inventor
Giuseppe Bianca
Robert M Bogursky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Autosplice Inc
Original Assignee
Autosplice Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Autosplice Inc filed Critical Autosplice Inc
Publication of DE69704252D1 publication Critical patent/DE69704252D1/de
Application granted granted Critical
Publication of DE69704252T2 publication Critical patent/DE69704252T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0003—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor of successively moulded portions rigidly joined to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24—Assembling by moulding on contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/22—Bases, e.g. strip, block, panel
    • H01R9/24—Terminal blocks
    • H01R9/2408—Modular blocks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00—Electrical connectors
    • Y10S439/933—Special insulation
    • Y10S439/937—Plural insulators in strip form

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE69704252T 1996-12-09 1997-12-08 Kontinuierlich geformte Plastikteile oder Zusammensätze Expired - Fee Related DE69704252T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/761,899 US5957725A (en) 1995-07-05 1996-12-09 Continuous molded plastic components or assemblies

Publications (2)

Publication Number Publication Date
DE69704252D1 DE69704252D1 (de) 2001-04-19
DE69704252T2 true DE69704252T2 (de) 2001-08-09

Family

ID=25063554

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69704252T Expired - Fee Related DE69704252T2 (de) 1996-12-09 1997-12-08 Kontinuierlich geformte Plastikteile oder Zusammensätze

Country Status (4)

Country Link
US (2) US5957725A (de)
EP (1) EP0847112B1 (de)
JP (1) JPH10199650A (de)
DE (1) DE69704252T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
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DE10128301A1 (de) * 2001-06-12 2003-01-16 Siemens Ag Verfahren zur Herstellung einer gasdichten Durchführung eines Kontaktes durch eine Wandung und Einrichtuung zur Durchführung eines elektrischen Kontaktes duch eine Wandung

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US5992639A (en) * 1997-04-02 1999-11-30 Fujitsu Limited Carrier tape with reinforced pockets and method for fabricating carrier tape
US5935136A (en) 1997-05-09 1999-08-10 Pristech, Inc. Obstetrical vacuum extractor cup with soft molded lip
EP0993739A1 (de) * 1997-05-21 2000-04-19 E.S.P. Communications, Inc. System, verfahren und einrichtung für einzig vom anrufer eingeleite schnurlose kommunikation mit anrufererzeugten vergebührung
JP2000323216A (ja) * 1999-05-07 2000-11-24 Kyoshin Kogyo Co Ltd 接続用端子及びテーピング接続用端子
US6595788B2 (en) * 1999-10-14 2003-07-22 Berg Technology, Inc. Electrical connector with continuous strip contacts
US6379600B1 (en) * 2000-01-24 2002-04-30 Daniel G. Sanders Method for injection molding a trough
JP3469187B2 (ja) * 2000-09-29 2003-11-25 タイコエレクトロニクスアンプ株式会社 Ｉｃソケット
US6827615B2 (en) 2001-06-01 2004-12-07 Panduit Corp. Terminal carrier cut-off design
DE20117319U1 (de) * 2001-10-23 2003-02-27 Bosch Gmbh Robert Elektrischer Mikrosteckverbinder mit einer vergrößerten Funktionsfläche für eine Verriegelung
AU2002951734A0 (en) * 2002-09-30 2002-10-17 Cochlear Limited Feedthrough with conductive pathways of varing configurations
US6914194B2 (en) * 2003-10-29 2005-07-05 Ben Fan Flexible LED cable light
JP2007510904A (ja) 2003-10-30 2007-04-26 バイエル・ヘルスケア・エルエルシー プラットフォーム・ウェル構造を有する光学キュベット
ES2322855T3 (es) * 2003-10-30 2009-06-30 Bayer Healthcare Llc Formatos para analisis optico y procedimientos para fabricar los mismos.
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US7556759B2 (en) * 2004-01-29 2009-07-07 Hiemstra David L Auto-indexing visor core
KR100493451B1 (ko) * 2004-06-12 2005-06-07 주식회사 엠오에이 표면실장용 전자부품 급송테이프 연결용 클립 리본 및연결 장치
US7598855B2 (en) 2005-02-01 2009-10-06 Location Based Technologies, Inc. Apparatus and method for locating individuals and objects using tracking devices
US20070197922A1 (en) * 2006-02-17 2007-08-23 Honeywell International Inc. Disposable pressure sensor systems and packages therefor
US8044502B2 (en) 2006-03-20 2011-10-25 Gryphics, Inc. Composite contact for fine pitch electrical interconnect assembly
US8336200B2 (en) * 2006-05-26 2012-12-25 Sg Design Technologies Apparatus, system, and method for maintaining part orientation during manufacturing
US7875228B2 (en) * 2006-05-26 2011-01-25 Sg Design Technologies Apparatus, system, and method for maintaining part orientation during manufacturing
US8497774B2 (en) 2007-04-05 2013-07-30 Location Based Technologies Inc. Apparatus and method for adjusting refresh rate of location coordinates of a tracking device
US8774827B2 (en) 2007-04-05 2014-07-08 Location Based Technologies, Inc. Apparatus and method for generating position fix of a tracking device in accordance with a subscriber service usage profile to conserve tracking device power
US8224355B2 (en) 2007-11-06 2012-07-17 Location Based Technologies Inc. System and method for improved communication bandwidth utilization when monitoring location information
US8102256B2 (en) 2008-01-06 2012-01-24 Location Based Technologies Inc. Apparatus and method for determining location and tracking coordinates of a tracking device
US9111189B2 (en) 2007-10-31 2015-08-18 Location Based Technologies, Inc. Apparatus and method for manufacturing an electronic package
US8244468B2 (en) 2007-11-06 2012-08-14 Location Based Technology Inc. System and method for creating and managing a personalized web interface for monitoring location information on individuals and objects using tracking devices
WO2009009827A1 (en) * 2007-07-17 2009-01-22 Cochlear Limited Method and apparatus for forming an electrically insulating structure having holes for feedthroughs
US8654974B2 (en) 2007-10-18 2014-02-18 Location Based Technologies, Inc. Apparatus and method to provide secure communication over an insecure communication channel for location information using tracking devices
EP2209520B1 (de) * 2007-11-16 2013-10-02 Cochlear Americas Elektrodenanordnung und verfahren zur bildung einer elektrodenanordnung
US7581993B1 (en) * 2008-04-24 2009-09-01 Cheng Uei Precision Industry Co., Ltd. Socket connector
US8133075B2 (en) 2009-03-25 2012-03-13 Fci Americas Technology Llc Electrical connector and method of manufacture
CN101854000B (zh) * 2009-03-31 2012-07-18 泰科电子(上海)有限公司 电连接器及电连接器制造方法
JP5494381B2 (ja) * 2010-09-14 2014-05-14 住友電装株式会社 コネクタ
JP2013258044A (ja) * 2012-06-12 2013-12-26 Molex Inc コネクタ
CN202997137U (zh) * 2012-11-02 2013-06-12 富士康(昆山)电脑接插件有限公司 电连接器
DE102014104406A1 (de) * 2014-03-28 2015-10-01 Harting Electric Gmbh & Co. Kg Gurtband für Kontaktelemente
US9362638B2 (en) 2014-09-03 2016-06-07 Amphenol Corporation Overmolded contact wafer and connector
CN106217937A (zh) * 2016-09-19 2016-12-14 天津帅通科技发展有限公司 一种利于排废的组合模具
CN106182884A (zh) * 2016-09-19 2016-12-07 天津帅通科技发展有限公司 一种用于生产电线支架的组合模具
CN106584757A (zh) * 2017-01-11 2017-04-26 捷讯精密橡胶（苏州）有限公司 一种不规则硅胶产品连续射出成型设备
KR101901375B1 (ko) * 2017-05-31 2018-10-05 주식회사 코아비스 연료펌프용 조립식 터미널 및 이를 이용한 연료펌프용 플랜지 제조 방법
US10770839B2 (en) * 2018-08-22 2020-09-08 Amphenol Corporation Assembly method for a printed circuit board electrical connector
US11545803B1 (en) * 2021-07-29 2023-01-03 Te Connectivity Solutions Gmbh Connector loading assembly for electrical connector assembling machine
CN115416238B (zh) * 2022-11-04 2023-01-24 赫比(成都)精密塑胶制品有限公司 一种用于分离式料带的模具及其开模方法

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US3471900A (en) * 1967-05-24 1969-10-14 Trw Inc Mold for encapsulating electrical components
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US4686766A (en) * 1982-12-27 1987-08-18 Amp Incorporated Method of forming a flexible strip of encapsulated contact members
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US4655517A (en) * 1985-02-15 1987-04-07 Crane Electronics, Inc. Electrical connector
US4832622A (en) * 1987-01-23 1989-05-23 Autosplice, Inc. Endless electrical connector
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10128301A1 (de) * 2001-06-12 2003-01-16 Siemens Ag Verfahren zur Herstellung einer gasdichten Durchführung eines Kontaktes durch eine Wandung und Einrichtuung zur Durchführung eines elektrischen Kontaktes duch eine Wandung
US6994589B2 (en) 2001-06-12 2006-02-07 Siemens Aktiengesellschaft Method for production of a gas-tight ducting for a contact through a wall and device for ducting an electrical contact through a wall

Also Published As

Publication number Publication date
DE69704252D1 (de) 2001-04-19
US5957725A (en) 1999-09-28
US5967841A (en) 1999-10-19
EP0847112B1 (de) 2001-03-14
EP0847112A1 (de) 1998-06-10
JPH10199650A (ja) 1998-07-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee