DE69634168D1 - Methode zum montieren von bauteilen - Google Patents

Methode zum montieren von bauteilen

Info

Publication number
DE69634168D1
DE69634168D1 DE69634168T DE69634168T DE69634168D1 DE 69634168 D1 DE69634168 D1 DE 69634168D1 DE 69634168 T DE69634168 T DE 69634168T DE 69634168 T DE69634168 T DE 69634168T DE 69634168 D1 DE69634168 D1 DE 69634168D1
Authority
DE
Germany
Prior art keywords
mounting components
mounting
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69634168T
Other languages
English (en)
Other versions
DE69634168T2 (de
Inventor
Kazuo Nagae
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69634168D1 publication Critical patent/DE69634168D1/de
Publication of DE69634168T2 publication Critical patent/DE69634168T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/086—Supply management, e.g. supply of components or of substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49137—Different components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE69634168T 1995-09-13 1996-09-12 Methode zum montieren von bauteilen Expired - Lifetime DE69634168T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP23507795 1995-09-13
JP23507795A JP3552806B2 (ja) 1995-09-13 1995-09-13 部品実装方法
PCT/JP1996/002602 WO1997010694A1 (fr) 1995-09-13 1996-09-12 Procede de montage de composants

Publications (2)

Publication Number Publication Date
DE69634168D1 true DE69634168D1 (de) 2005-02-17
DE69634168T2 DE69634168T2 (de) 2005-06-23

Family

ID=16980727

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69634168T Expired - Lifetime DE69634168T2 (de) 1995-09-13 1996-09-12 Methode zum montieren von bauteilen

Country Status (5)

Country Link
US (1) US6189207B1 (de)
EP (1) EP0797382B1 (de)
JP (1) JP3552806B2 (de)
DE (1) DE69634168T2 (de)
WO (1) WO1997010694A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69835697T2 (de) * 1997-11-10 2007-03-29 Matsushita Electric Industrial Co., Ltd., Kadoma Bauteile-bestückungsvorrichtung und bauteilezufuhrvorrichtung
JP3978910B2 (ja) * 1998-12-07 2007-09-19 松下電器産業株式会社 電子部品の実装装置
US6571462B1 (en) * 1999-04-27 2003-06-03 Matsushita Electric Industrial Co., Ltd Electronic component mounting apparatus using duplicate sources of components
DE19919916C2 (de) * 1999-04-30 2001-07-05 Siemens Ag Verfahren zur zeitoptimierten Bestückung von Leiterplatten

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0821798B2 (ja) * 1989-09-05 1996-03-04 富士機械製造株式会社 電子部品供給装置
US5193268A (en) * 1989-11-07 1993-03-16 Sanyo Electric Co., Ltd. Parts feeding system utilizing an unmanned conveying machine
US5170554A (en) * 1990-09-28 1992-12-15 Hewlett-Packard Company High mix printed circuit assembly technique
US5400497A (en) * 1990-10-29 1995-03-28 Matsushita Electric Industrial Co., Ltd. Electronic parts mounting apparatus having memory equipped parts supply device
JP2969955B2 (ja) * 1990-12-19 1999-11-02 松下電器産業株式会社 部品実装方法
JP3245199B2 (ja) * 1991-11-01 2002-01-07 松下電器産業株式会社 部品実装機における部品代替データ作成方法および部品実装方法、部品実装機
JP3176691B2 (ja) * 1992-02-14 2001-06-18 シチズン時計株式会社 電子部品実装装置における電子部品供給方法
JP2591634Y2 (ja) * 1993-04-27 1999-03-10 三洋電機株式会社 電子部品自動装着装置
JP3841448B2 (ja) * 1993-12-13 2006-11-01 松下電器産業株式会社 部品実装方法および部品実装機
JPH0846388A (ja) * 1994-08-03 1996-02-16 Matsushita Electric Ind Co Ltd 部品実装装置

Also Published As

Publication number Publication date
DE69634168T2 (de) 2005-06-23
US6189207B1 (en) 2001-02-20
EP0797382B1 (de) 2005-01-12
JP3552806B2 (ja) 2004-08-11
EP0797382A1 (de) 1997-09-24
JPH0983194A (ja) 1997-03-28
WO1997010694A1 (fr) 1997-03-20
EP0797382A4 (de) 1999-12-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)