DE69634089D1 - Verbesserung der ausrichtung von inspektionsystemen vor der bildaufnahme - Google Patents

Verbesserung der ausrichtung von inspektionsystemen vor der bildaufnahme

Info

Publication number
DE69634089D1
DE69634089D1 DE69634089T DE69634089T DE69634089D1 DE 69634089 D1 DE69634089 D1 DE 69634089D1 DE 69634089 T DE69634089 T DE 69634089T DE 69634089 T DE69634089 T DE 69634089T DE 69634089 D1 DE69634089 D1 DE 69634089D1
Authority
DE
Germany
Prior art keywords
orientation
improving
image recording
inspection systems
before image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69634089T
Other languages
English (en)
Other versions
DE69634089T2 (de
Inventor
Scott Young
Roger Kroeze
H Chadwick
Nicholas Szabo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Corp
Original Assignee
KLA Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Tencor Corp filed Critical KLA Tencor Corp
Application granted granted Critical
Publication of DE69634089D1 publication Critical patent/DE69634089D1/de
Publication of DE69634089T2 publication Critical patent/DE69634089T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
DE69634089T 1995-10-02 1996-10-02 Verbesserung der ausrichtung von inspektionsystemen vor der bildaufnahme Expired - Lifetime DE69634089T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US53813795A 1995-10-02 1995-10-02
US538137 1995-10-02
PCT/US1996/015835 WO1997013370A1 (en) 1995-10-02 1996-10-02 Alignment correction prior to image sampling in inspection systems

Publications (2)

Publication Number Publication Date
DE69634089D1 true DE69634089D1 (de) 2005-01-27
DE69634089T2 DE69634089T2 (de) 2005-12-08

Family

ID=24145667

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69634089T Expired - Lifetime DE69634089T2 (de) 1995-10-02 1996-10-02 Verbesserung der ausrichtung von inspektionsystemen vor der bildaufnahme

Country Status (4)

Country Link
US (5) US6141038A (de)
EP (1) EP0853856B1 (de)
DE (1) DE69634089T2 (de)
WO (1) WO1997013370A1 (de)

Families Citing this family (75)

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US7617474B2 (en) 1997-09-17 2009-11-10 Synopsys, Inc. System and method for providing defect printability analysis of photolithographic masks with job-based automation
US7107571B2 (en) 1997-09-17 2006-09-12 Synopsys, Inc. Visual analysis and verification system using advanced tools
US7093229B2 (en) 1997-09-17 2006-08-15 Synopsys, Inc. System and method for providing defect printability analysis of photolithographic masks with job-based automation
US6757645B2 (en) 1997-09-17 2004-06-29 Numerical Technologies, Inc. Visual inspection and verification system
US6369888B1 (en) 1999-11-17 2002-04-09 Applied Materials, Inc. Method and apparatus for article inspection including speckle reduction
JP3874996B2 (ja) * 2000-05-30 2007-01-31 ファブソリューション株式会社 デバイス検査方法および装置
JP3266602B1 (ja) * 2000-10-30 2002-03-18 洋一 奥寺 アドレス照会システム、コンピュータプログラム製品及びその方法
ATE502295T1 (de) * 2000-12-15 2011-04-15 Kla Tencor Corp Verfahren und vorrichtung zum untersuchen eines substrats
US6873720B2 (en) 2001-03-20 2005-03-29 Synopsys, Inc. System and method of providing mask defect printability analysis
US6925202B2 (en) 2001-03-20 2005-08-02 Synopsys, Inc. System and method of providing mask quality control
US6721928B2 (en) 2001-07-26 2004-04-13 Numerical Technologies, Inc. Verification utilizing instance-based hierarchy management
US6560766B2 (en) 2001-07-26 2003-05-06 Numerical Technologies, Inc. Method and apparatus for analyzing a layout using an instance-based representation
US7014955B2 (en) 2001-08-28 2006-03-21 Synopsys, Inc. System and method for indentifying dummy features on a mask layer
JP2003066341A (ja) * 2001-08-28 2003-03-05 Nec Corp レチクル検査装置
US20030081826A1 (en) * 2001-10-29 2003-05-01 Tokyo Seimitsu (Israel) Ltd. Tilted scan for Die-to-Die and Cell-to-Cell detection
US6976240B2 (en) 2001-11-14 2005-12-13 Synopsys Inc. Simulation using design geometry information
JP3913555B2 (ja) * 2002-01-17 2007-05-09 ファブソリューション株式会社 膜厚測定方法および膜厚測定装置
US7126681B1 (en) * 2002-04-23 2006-10-24 Kla-Tencor Technologies Corporation Closed region defect detection system
US7043071B2 (en) 2002-09-13 2006-05-09 Synopsys, Inc. Soft defect printability simulation and analysis for masks
US7027143B1 (en) 2002-10-15 2006-04-11 Kla-Tencor Technologies Corp. Methods and systems for inspecting reticles using aerial imaging at off-stepper wavelengths
US7379175B1 (en) 2002-10-15 2008-05-27 Kla-Tencor Technologies Corp. Methods and systems for reticle inspection and defect review using aerial imaging
US7123356B1 (en) 2002-10-15 2006-10-17 Kla-Tencor Technologies Corp. Methods and systems for inspecting reticles using aerial imaging and die-to-database detection
US7133119B1 (en) 2002-12-17 2006-11-07 Kla-Tencor Technologies Corp. Systems for simulating high NA and polarization effects in aerial images
US20040120017A1 (en) * 2002-12-20 2004-06-24 Miller Mindy Lee Method and apparatus for compensating for assembly and alignment errors in sensor assemblies
DE10307358B3 (de) * 2003-02-21 2004-10-07 Leica Microsystems Semiconductor Gmbh Verfahren und Vorrichtung zum Scannen eines Halbleiter-Wafers
US7109981B2 (en) * 2003-07-31 2006-09-19 Hewlett-Packard Development Company, L.P. Generating and displaying spatially offset sub-frames
KR101056142B1 (ko) 2004-01-29 2011-08-10 케이엘에이-텐코 코포레이션 레티클 설계 데이터의 결함을 검출하기 위한 컴퓨터로구현되는 방법
US20050225571A1 (en) * 2004-04-08 2005-10-13 Collins David C Generating and displaying spatially offset sub-frames
US20060045383A1 (en) * 2004-08-31 2006-03-02 Picciotto Carl E Displacement estimation system and method
JP4904034B2 (ja) 2004-09-14 2012-03-28 ケーエルエー−テンカー コーポレイション レチクル・レイアウト・データを評価するための方法、システム及び搬送媒体
US7769225B2 (en) 2005-08-02 2010-08-03 Kla-Tencor Technologies Corp. Methods and systems for detecting defects in a reticle design pattern
DE102005044502B8 (de) * 2005-09-16 2010-01-28 Suss Microtec Test Systems Gmbh Verfahren zur Inspektion einer Vielzahl sich wiederholender Strukturen
US7676077B2 (en) 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US7570796B2 (en) 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US8041103B2 (en) 2005-11-18 2011-10-18 Kla-Tencor Technologies Corp. Methods and systems for determining a position of inspection data in design data space
US7369236B1 (en) * 2006-10-31 2008-05-06 Negevtech, Ltd. Defect detection through image comparison using relative measures
WO2008077100A2 (en) 2006-12-19 2008-06-26 Kla-Tencor Corporation Systems and methods for creating inspection recipes
WO2008086282A2 (en) 2007-01-05 2008-07-17 Kla-Tencor Corporation Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
US7738093B2 (en) 2007-05-07 2010-06-15 Kla-Tencor Corp. Methods for detecting and classifying defects on a reticle
US7962863B2 (en) 2007-05-07 2011-06-14 Kla-Tencor Corp. Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer
US8213704B2 (en) 2007-05-09 2012-07-03 Kla-Tencor Corp. Methods and systems for detecting defects in a reticle design pattern
DE102007032958A1 (de) * 2007-07-14 2009-01-15 Carl Zeiss Sms Gmbh Verfahren zur Ermittlung lithographisch relevanter Maskendefekte
US7796804B2 (en) 2007-07-20 2010-09-14 Kla-Tencor Corp. Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
US7711514B2 (en) 2007-08-10 2010-05-04 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for generating a metrology sampling plan
CN101785009B (zh) 2007-08-20 2012-10-10 恪纳腾公司 确定实际缺陷是潜在系统性缺陷还是潜在随机缺陷的计算机实现的方法
US8139844B2 (en) 2008-04-14 2012-03-20 Kla-Tencor Corp. Methods and systems for determining a defect criticality index for defects on wafers
KR101841897B1 (ko) 2008-07-28 2018-03-23 케이엘에이-텐코어 코오포레이션 웨이퍼 상의 메모리 디바이스 영역에서 검출된 결함들을 분류하기 위한 컴퓨터-구현 방법들, 컴퓨터-판독 가능 매체, 및 시스템들
US8775101B2 (en) 2009-02-13 2014-07-08 Kla-Tencor Corp. Detecting defects on a wafer
US8204297B1 (en) 2009-02-27 2012-06-19 Kla-Tencor Corp. Methods and systems for classifying defects detected on a reticle
US8112241B2 (en) 2009-03-13 2012-02-07 Kla-Tencor Corp. Methods and systems for generating an inspection process for a wafer
US8781781B2 (en) 2010-07-30 2014-07-15 Kla-Tencor Corp. Dynamic care areas
US9170211B2 (en) 2011-03-25 2015-10-27 Kla-Tencor Corp. Design-based inspection using repeating structures
US9087367B2 (en) 2011-09-13 2015-07-21 Kla-Tencor Corp. Determining design coordinates for wafer defects
US8831334B2 (en) 2012-01-20 2014-09-09 Kla-Tencor Corp. Segmentation for wafer inspection
US8826200B2 (en) 2012-05-25 2014-09-02 Kla-Tencor Corp. Alteration for wafer inspection
US9189844B2 (en) 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
DE102012111835A1 (de) * 2012-12-05 2014-06-05 Hseb Dresden Gmbh Inspektionsvorrichtung
US9053527B2 (en) 2013-01-02 2015-06-09 Kla-Tencor Corp. Detecting defects on a wafer
US9134254B2 (en) 2013-01-07 2015-09-15 Kla-Tencor Corp. Determining a position of inspection system output in design data space
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
KR102019534B1 (ko) 2013-02-01 2019-09-09 케이엘에이 코포레이션 결함 특유의, 다중 채널 정보를 이용한 웨이퍼 상의 결함 검출
US9865512B2 (en) 2013-04-08 2018-01-09 Kla-Tencor Corp. Dynamic design attributes for wafer inspection
US9310320B2 (en) 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects
WO2015027198A1 (en) 2013-08-23 2015-02-26 Kla-Tencor Corporation Block-to-block reticle inspection
JP6293023B2 (ja) * 2014-09-04 2018-03-14 株式会社ニューフレアテクノロジー 検査方法
US9864173B2 (en) * 2015-04-21 2018-01-09 Kla-Tencor Corporation Systems and methods for run-time alignment of a spot scanning wafer inspection system
US11225061B2 (en) 2015-05-29 2022-01-18 Cryovac, Llc Oxygen scavenging films
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US11049745B2 (en) 2018-10-19 2021-06-29 Kla Corporation Defect-location determination using correction loop for pixel alignment
US11113827B2 (en) * 2019-09-23 2021-09-07 Kla Corporation Pattern-to-design alignment for one-dimensional unique structures
US11120546B2 (en) * 2019-09-24 2021-09-14 Kla Corporation Unsupervised learning-based reference selection for enhanced defect inspection sensitivity
JP7409988B2 (ja) 2020-07-29 2024-01-09 株式会社ニューフレアテクノロジー パターン検査装置及び輪郭線同士のアライメント量取得方法

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Also Published As

Publication number Publication date
WO1997013370A1 (en) 1997-04-10
US20020075385A1 (en) 2002-06-20
DE69634089T2 (de) 2005-12-08
EP0853856A1 (de) 1998-07-22
US6141038A (en) 2000-10-31
EP0853856A4 (de) 1998-12-16
US20080304734A1 (en) 2008-12-11
US20030063190A1 (en) 2003-04-03
US20050254698A1 (en) 2005-11-17
EP0853856B1 (de) 2004-12-22

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