DE69632107D1 - Reinigungslösung für Halbleiteranordnung und Reinigungsmethode - Google Patents
Reinigungslösung für Halbleiteranordnung und ReinigungsmethodeInfo
- Publication number
- DE69632107D1 DE69632107D1 DE69632107T DE69632107T DE69632107D1 DE 69632107 D1 DE69632107 D1 DE 69632107D1 DE 69632107 T DE69632107 T DE 69632107T DE 69632107 T DE69632107 T DE 69632107T DE 69632107 D1 DE69632107 D1 DE 69632107D1
- Authority
- DE
- Germany
- Prior art keywords
- cleaning
- semiconductor device
- cleaning solution
- cleaning method
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004140 cleaning Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/08—Acids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
- H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Inorganic Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR9525459 | 1995-08-18 | ||
KR1019950025459A KR0147659B1 (ko) | 1995-08-18 | 1995-08-18 | 반도체 장치의 세정에 사용되는 세정액 및 이를 이용한 세정방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69632107D1 true DE69632107D1 (de) | 2004-05-13 |
DE69632107T2 DE69632107T2 (de) | 2005-03-03 |
Family
ID=19423750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69632107T Expired - Lifetime DE69632107T2 (de) | 1995-08-18 | 1996-07-30 | Reinigungslösung für Halbleiteranordnung und Reinigungsmethode |
Country Status (6)
Country | Link |
---|---|
US (1) | US5876509A (de) |
EP (1) | EP0762488B1 (de) |
JP (1) | JP3759789B2 (de) |
KR (1) | KR0147659B1 (de) |
DE (1) | DE69632107T2 (de) |
TW (1) | TW304901B (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100252223B1 (ko) * | 1997-08-30 | 2000-04-15 | 윤종용 | 반도체장치의 콘택홀 세정방법 |
US6440647B1 (en) | 1998-02-26 | 2002-08-27 | Alpha Metals, Inc. | Resist stripping process |
JP3161521B2 (ja) * | 1998-03-13 | 2001-04-25 | 日本電気株式会社 | 半導体装置の製造方法および洗浄装置 |
US6248704B1 (en) | 1999-05-03 | 2001-06-19 | Ekc Technology, Inc. | Compositions for cleaning organic and plasma etched residues for semiconductors devices |
KR102506031B1 (ko) | 2018-07-13 | 2023-03-03 | 동우 화인켐 주식회사 | 반도체 기판 세정액 및 이를 이용한 반도체 기판 세정 방법 |
KR102506026B1 (ko) | 2018-07-18 | 2023-03-03 | 동우 화인켐 주식회사 | 반도체 기판 세정액 및 이를 이용한 반도체 기판 세정 방법 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4215005A (en) * | 1978-01-30 | 1980-07-29 | Allied Chemical Corporation | Organic stripping compositions and method for using same |
US4343677A (en) * | 1981-03-23 | 1982-08-10 | Bell Telephone Laboratories, Incorporated | Method for patterning films using reactive ion etching thereof |
US4778532A (en) * | 1985-06-24 | 1988-10-18 | Cfm Technologies Limited Partnership | Process and apparatus for treating wafers with process fluids |
JPS63114128A (ja) * | 1986-10-31 | 1988-05-19 | Showa Denko Kk | 表面処理液 |
JPH069195B2 (ja) * | 1989-05-06 | 1994-02-02 | 大日本スクリーン製造株式会社 | 基板の表面処理方法 |
JP2852355B2 (ja) * | 1989-06-26 | 1999-02-03 | ステラケミファ株式会社 | 微細加工表面処理剤 |
JP2553946B2 (ja) * | 1990-02-20 | 1996-11-13 | 信淳 渡辺 | 基板表面処理用ガスの供給方法 |
JP2866161B2 (ja) * | 1990-07-23 | 1999-03-08 | 株式会社ピュアレックス | 洗浄液用添加剤 |
JP3064060B2 (ja) * | 1991-09-20 | 2000-07-12 | ステラケミファ株式会社 | 微粒子の含有量の少ない微細加工表面処理剤 |
JP3264405B2 (ja) * | 1994-01-07 | 2002-03-11 | 三菱瓦斯化学株式会社 | 半導体装置洗浄剤および半導体装置の製造方法 |
-
1995
- 1995-08-18 KR KR1019950025459A patent/KR0147659B1/ko not_active IP Right Cessation
-
1996
- 1996-07-30 DE DE69632107T patent/DE69632107T2/de not_active Expired - Lifetime
- 1996-07-30 EP EP96305578A patent/EP0762488B1/de not_active Expired - Lifetime
- 1996-08-15 US US08/698,368 patent/US5876509A/en not_active Expired - Lifetime
- 1996-08-16 TW TW085110022A patent/TW304901B/zh not_active IP Right Cessation
- 1996-08-19 JP JP23590096A patent/JP3759789B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0959685A (ja) | 1997-03-04 |
TW304901B (de) | 1997-05-11 |
EP0762488A2 (de) | 1997-03-12 |
US5876509A (en) | 1999-03-02 |
EP0762488A3 (de) | 1997-09-10 |
KR0147659B1 (ko) | 1998-08-17 |
KR970010936A (ko) | 1997-03-27 |
DE69632107T2 (de) | 2005-03-03 |
JP3759789B2 (ja) | 2006-03-29 |
EP0762488B1 (de) | 2004-04-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |