DE69632107D1 - Reinigungslösung für Halbleiteranordnung und Reinigungsmethode - Google Patents

Reinigungslösung für Halbleiteranordnung und Reinigungsmethode

Info

Publication number
DE69632107D1
DE69632107D1 DE69632107T DE69632107T DE69632107D1 DE 69632107 D1 DE69632107 D1 DE 69632107D1 DE 69632107 T DE69632107 T DE 69632107T DE 69632107 T DE69632107 T DE 69632107T DE 69632107 D1 DE69632107 D1 DE 69632107D1
Authority
DE
Germany
Prior art keywords
cleaning
semiconductor device
cleaning solution
cleaning method
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69632107T
Other languages
English (en)
Other versions
DE69632107T2 (de
Inventor
Jae-Woo Nam
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of DE69632107D1 publication Critical patent/DE69632107D1/de
Publication of DE69632107T2 publication Critical patent/DE69632107T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02Inorganic compounds
    • C11D7/04Water-soluble compounds
    • C11D7/08Acids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02057Cleaning during device manufacture
    • H01L21/02068Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02071Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/26Organic compounds containing oxygen
    • C11D7/261Alcohols; Phenols
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02043Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052Wet cleaning only
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02057Cleaning during device manufacture
    • H01L21/0206Cleaning during device manufacture during, before or after processing of insulating layers
    • H01L21/02063Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10Objects to be cleaned
    • C11D2111/14Hard surfaces
    • C11D2111/22Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Inorganic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
DE69632107T 1995-08-18 1996-07-30 Reinigungslösung für Halbleiteranordnung und Reinigungsmethode Expired - Lifetime DE69632107T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR9525459 1995-08-18
KR1019950025459A KR0147659B1 (ko) 1995-08-18 1995-08-18 반도체 장치의 세정에 사용되는 세정액 및 이를 이용한 세정방법

Publications (2)

Publication Number Publication Date
DE69632107D1 true DE69632107D1 (de) 2004-05-13
DE69632107T2 DE69632107T2 (de) 2005-03-03

Family

ID=19423750

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69632107T Expired - Lifetime DE69632107T2 (de) 1995-08-18 1996-07-30 Reinigungslösung für Halbleiteranordnung und Reinigungsmethode

Country Status (6)

Country Link
US (1) US5876509A (de)
EP (1) EP0762488B1 (de)
JP (1) JP3759789B2 (de)
KR (1) KR0147659B1 (de)
DE (1) DE69632107T2 (de)
TW (1) TW304901B (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100252223B1 (ko) * 1997-08-30 2000-04-15 윤종용 반도체장치의 콘택홀 세정방법
US6440647B1 (en) 1998-02-26 2002-08-27 Alpha Metals, Inc. Resist stripping process
JP3161521B2 (ja) * 1998-03-13 2001-04-25 日本電気株式会社 半導体装置の製造方法および洗浄装置
US6248704B1 (en) 1999-05-03 2001-06-19 Ekc Technology, Inc. Compositions for cleaning organic and plasma etched residues for semiconductors devices
KR102506031B1 (ko) 2018-07-13 2023-03-03 동우 화인켐 주식회사 반도체 기판 세정액 및 이를 이용한 반도체 기판 세정 방법
KR102506026B1 (ko) 2018-07-18 2023-03-03 동우 화인켐 주식회사 반도체 기판 세정액 및 이를 이용한 반도체 기판 세정 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4215005A (en) * 1978-01-30 1980-07-29 Allied Chemical Corporation Organic stripping compositions and method for using same
US4343677A (en) * 1981-03-23 1982-08-10 Bell Telephone Laboratories, Incorporated Method for patterning films using reactive ion etching thereof
US4778532A (en) * 1985-06-24 1988-10-18 Cfm Technologies Limited Partnership Process and apparatus for treating wafers with process fluids
JPS63114128A (ja) * 1986-10-31 1988-05-19 Showa Denko Kk 表面処理液
JPH069195B2 (ja) * 1989-05-06 1994-02-02 大日本スクリーン製造株式会社 基板の表面処理方法
JP2852355B2 (ja) * 1989-06-26 1999-02-03 ステラケミファ株式会社 微細加工表面処理剤
JP2553946B2 (ja) * 1990-02-20 1996-11-13 信淳 渡辺 基板表面処理用ガスの供給方法
JP2866161B2 (ja) * 1990-07-23 1999-03-08 株式会社ピュアレックス 洗浄液用添加剤
JP3064060B2 (ja) * 1991-09-20 2000-07-12 ステラケミファ株式会社 微粒子の含有量の少ない微細加工表面処理剤
JP3264405B2 (ja) * 1994-01-07 2002-03-11 三菱瓦斯化学株式会社 半導体装置洗浄剤および半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0959685A (ja) 1997-03-04
DE69632107T2 (de) 2005-03-03
KR0147659B1 (ko) 1998-08-17
EP0762488B1 (de) 2004-04-07
EP0762488A3 (de) 1997-09-10
KR970010936A (ko) 1997-03-27
TW304901B (de) 1997-05-11
US5876509A (en) 1999-03-02
EP0762488A2 (de) 1997-03-12
JP3759789B2 (ja) 2006-03-29

Similar Documents

Publication Publication Date Title
DE69522600D1 (de) Halbleiteranordnung und Herstellungsverfahren für diese Halbleiteranordnung
DE69518046D1 (de) Sprühmethode für Geschirrspüler und Vorrichtung für deren Durchführung
DE69615603D1 (de) Vorrichtung und Verfahren zum Reinigen von Halbleiterplättchen
DE69527330T2 (de) Halbleiteranordnung und Herstellungsverfahren
DE69534700D1 (de) Halbleiteranordnungen und verfahren
DE69721411D1 (de) Halbleiteranordnung und Herstellungsverfahren dafür
DE69517913T2 (de) Fixiervorrichtung und Fixierverfahren
DE69821022D1 (de) Auswringverfahren und auswringeinrichtung für fussbodenwischgerät
DE69804551T2 (de) Spannkluppenreinigungs- Verfahren und Vorrichtung
KR970702105A (ko) 세정방법 및 세정장치(washing method and washing device)
DE69625132D1 (de) Halbleitervorrichtung und Verfahren für ihre Herstellung
DE69630556D1 (de) Halbleiteranordnung und Verdrahtungsverfahren
DE69614214D1 (de) Reinigungsvorrichtung für Walzen
DE69632107D1 (de) Reinigungslösung für Halbleiteranordnung und Reinigungsmethode
DE59508757D1 (de) Verfahren und Vorrichtung zum Reinigen von Siliziumscheiben
DE69620944T2 (de) Halbleiter-Prüfmethode
KR960012414A (ko) 웨이퍼 검사장치
DE69529386D1 (de) Verbesserungen für Halbleiteranordnungen
KR970003247U (ko) 웨이퍼 검사장치
DE69735032D1 (de) Halbleiteranordnung und Verfahren zum Zusammensetzen derselben
KR970003752A (ko) 반도체장치와 그 검사방법
KR960032734U (ko) 웨이퍼 세정장치
KR970015302U (ko) 반도체 웨이퍼 세정장치
ATA241094A (de) Tragvorrichtung für kleinkinder
KR970059836U (ko) 반도체세정액 분석장치

Legal Events

Date Code Title Description
8364 No opposition during term of opposition