DE69626446T2 - Plasmabearbeitungsgerät - Google Patents

Plasmabearbeitungsgerät

Info

Publication number
DE69626446T2
DE69626446T2 DE69626446T DE69626446T DE69626446T2 DE 69626446 T2 DE69626446 T2 DE 69626446T2 DE 69626446 T DE69626446 T DE 69626446T DE 69626446 T DE69626446 T DE 69626446T DE 69626446 T2 DE69626446 T2 DE 69626446T2
Authority
DE
Germany
Prior art keywords
processing apparatus
plasma processing
plasma
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69626446T
Other languages
English (en)
Other versions
DE69626446D1 (de
Inventor
Takeshi Akimoto
Katsuo Katayama
Kyouichi Komachi
Kouichi Iio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Electronics Corp
Nippon Steel Corp
Original Assignee
NEC Electronics Corp
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Electronics Corp, Sumitomo Metal Industries Ltd filed Critical NEC Electronics Corp
Application granted granted Critical
Publication of DE69626446D1 publication Critical patent/DE69626446D1/de
Publication of DE69626446T2 publication Critical patent/DE69626446T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32211—Means for coupling power to the plasma
    • H01J37/32229—Waveguides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32211—Means for coupling power to the plasma
    • H01J37/32238—Windows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32266—Means for controlling power transmitted to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
DE69626446T 1995-06-15 1996-06-14 Plasmabearbeitungsgerät Expired - Fee Related DE69626446T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14847495A JP3164195B2 (ja) 1995-06-15 1995-06-15 マイクロ波プラズマ処理装置

Publications (2)

Publication Number Publication Date
DE69626446D1 DE69626446D1 (de) 2003-04-10
DE69626446T2 true DE69626446T2 (de) 2003-12-24

Family

ID=15453566

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69626446T Expired - Fee Related DE69626446T2 (de) 1995-06-15 1996-06-14 Plasmabearbeitungsgerät

Country Status (6)

Country Link
US (1) US5804923A (de)
EP (1) EP0749148B1 (de)
JP (1) JP3164195B2 (de)
KR (1) KR100218836B1 (de)
DE (1) DE69626446T2 (de)
TW (1) TW309694B (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6055927A (en) * 1997-01-14 2000-05-02 Applied Komatsu Technology, Inc. Apparatus and method for white powder reduction in silicon nitride deposition using remote plasma source cleaning technology
US6209482B1 (en) * 1997-10-01 2001-04-03 Energy Conversion Devices, Inc. Large area microwave plasma apparatus with adaptable applicator
JP4014300B2 (ja) 1998-06-19 2007-11-28 東京エレクトロン株式会社 プラズマ処理装置
JP3430053B2 (ja) * 1999-02-01 2003-07-28 東京エレクトロン株式会社 プラズマ処理装置
JP2002280196A (ja) * 2001-03-15 2002-09-27 Micro Denshi Kk マイクロ波を利用したプラズマ発生装置
KR20020080014A (ko) * 2001-04-10 2002-10-23 주식회사 에이티씨 플라즈마 처리 장치
US7584714B2 (en) * 2004-09-30 2009-09-08 Tokyo Electron Limited Method and system for improving coupling between a surface wave plasma source and a plasma space
TW200640301A (en) * 2005-05-12 2006-11-16 Shimadzu Corp Surface wave plasma processing apparatus
JP2010016225A (ja) * 2008-07-04 2010-01-21 Tokyo Electron Ltd 温度調節機構および温度調節機構を用いた半導体製造装置
JP5136574B2 (ja) * 2009-05-01 2013-02-06 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
KR101697472B1 (ko) 2015-10-16 2017-01-18 삼안산업 주식회사 정전 지그를 이용한 유리병 도장용 적재 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3738352A1 (de) * 1987-11-11 1989-05-24 Technics Plasma Gmbh Filamentloses magnetron-ionenstrahlsystem
EP0502269A1 (de) * 1991-03-06 1992-09-09 Hitachi, Ltd. Verfahren und Anordnung zum Behandeln mittels Mikrowellenplasmas
JP2570090B2 (ja) * 1992-10-08 1997-01-08 日本電気株式会社 ドライエッチング装置
JP3042208B2 (ja) * 1992-09-22 2000-05-15 住友金属工業株式会社 マイクロ波プラズマ処理装置
JP2611732B2 (ja) * 1993-12-13 1997-05-21 日本電気株式会社 プラズマ処理装置
EP0688038B1 (de) * 1994-06-14 2001-12-19 Sumitomo Metal Industries, Ltd. Mikrowellenplasma-Bearbeitungssystem
JP3171222B2 (ja) * 1994-06-14 2001-05-28 日本電気株式会社 マイクロ波プラズマ処理装置

Also Published As

Publication number Publication date
TW309694B (de) 1997-07-01
KR100218836B1 (ko) 1999-09-01
JPH097793A (ja) 1997-01-10
JP3164195B2 (ja) 2001-05-08
DE69626446D1 (de) 2003-04-10
EP0749148A2 (de) 1996-12-18
EP0749148A3 (de) 1999-01-20
KR970003443A (ko) 1997-01-28
EP0749148B1 (de) 2003-03-05
US5804923A (en) 1998-09-08

Similar Documents

Publication Publication Date Title
DE69635640D1 (de) Plasmabearbeitungsgerät
DE69635124D1 (de) Plasmabearbeitungsgerät
DE69627241D1 (de) Plasmabearbeitungsgerät
DE69500565T2 (de) Plasmabearbeitungsvorrichtung
IL118342A (en) Plasma etching apparatus
DE69635972D1 (de) Plasma-Ätz-Verfahren
NO981108D0 (no) Freseapparat
DE69318480D1 (de) Plasmabearbeitungsgerät
DE69405080T2 (de) Plasmabearbeitungsgerät
BR9607366A (pt) Aparelho transportador
TW514336U (en) Plasma processing device
SG66424A1 (en) Plasma processing apparatus
DE69626446D1 (de) Plasmabearbeitungsgerät
EP0731430A3 (de) Verkaufsdatenregistriervorrichtung
DE69413159D1 (de) Plasma-Entladungs-Bearbeitungsvorrichtung
DE69630086D1 (de) Dokumentenverarbeitungsvorrichtung
GB2302743B (en) Processing apparatus
GB9722408D0 (en) Plasma processing apparatus
DE69500830T2 (de) Plasmabearbeitungsgerät
DE9405808U1 (de) Plasma-Bearbeitungsgerät
DE69512376D1 (de) Plasma-bearbeitungsvorrichtung
KR970004385U (ko) 잔반 처리장치
GB2306017B (en) Photographic processing apparatus
EP0723197A3 (de) Photographisches Behandlungsgerät
DE69501095D1 (de) Plasmabearbeitungsgerät

Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: SUMITOMO METAL INDUSTRIES, LTD., OSAKA, JP

Owner name: NEC ELECTRONICS CORP., KAWASAKI, KANAGAWA, JP

8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee