DE69604623D1 - Positiv arbeitende Photoresistzusammensetzung - Google Patents

Positiv arbeitende Photoresistzusammensetzung

Info

Publication number
DE69604623D1
DE69604623D1 DE69604623T DE69604623T DE69604623D1 DE 69604623 D1 DE69604623 D1 DE 69604623D1 DE 69604623 T DE69604623 T DE 69604623T DE 69604623 T DE69604623 T DE 69604623T DE 69604623 D1 DE69604623 D1 DE 69604623D1
Authority
DE
Germany
Prior art keywords
photoresist composition
positive working
working photoresist
positive
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69604623T
Other languages
English (en)
Other versions
DE69604623T2 (de
Inventor
Shiro Tan
Yasumasa Kawabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of DE69604623D1 publication Critical patent/DE69604623D1/de
Application granted granted Critical
Publication of DE69604623T2 publication Critical patent/DE69604623T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
DE69604623T 1995-07-13 1996-07-12 Positiv arbeitende Photoresistzusammensetzung Expired - Lifetime DE69604623T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17765595 1995-07-13

Publications (2)

Publication Number Publication Date
DE69604623D1 true DE69604623D1 (de) 1999-11-18
DE69604623T2 DE69604623T2 (de) 2000-01-27

Family

ID=16034791

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69604623T Expired - Lifetime DE69604623T2 (de) 1995-07-13 1996-07-12 Positiv arbeitende Photoresistzusammensetzung

Country Status (3)

Country Link
US (1) US5709977A (de)
EP (1) EP0753795B1 (de)
DE (1) DE69604623T2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100234532B1 (ko) * 1996-09-21 1999-12-15 윤종용 반도체 제조공정의 포토레지스트 세정용 시너 조성물 및 그를 이용한 반도체장치의 제조방법
JP3594788B2 (ja) * 1997-06-16 2004-12-02 日東電工株式会社 印刷シート
US6127087A (en) * 1997-06-18 2000-10-03 Tokyo Ohka Kogyo Co., Ltd. Positive photoresist compositions and multilayer resist materials using same
KR100265766B1 (ko) * 1997-09-04 2000-09-15 윤종용 반도체장치 제조용 웨이퍼의 리워크방법 및 반도체장치의 제조방법
US6506831B2 (en) 1998-12-20 2003-01-14 Honeywell International Inc. Novolac polymer planarization films with high temperature stability
JP2001033957A (ja) * 1999-07-19 2001-02-09 Tokyo Ohka Kogyo Co Ltd ポジ型ホトレジスト組成物
FR2813886B1 (fr) * 2000-09-08 2005-04-15 Ceca Sa Resines novolaques, leur procede de preparation et leurs utilisations
US20050014093A1 (en) * 2003-07-17 2005-01-20 Fuji Photo Film Co., Ltd. Planographic printing plate precursor
KR20060090519A (ko) * 2005-02-07 2006-08-11 삼성전자주식회사 포토레지스트 조성물, 상기 포토레지스트 조성물을 이용한층상 부재 형성 방법 및 박막 트랜지스터 표시판의 제조방법
KR101324645B1 (ko) * 2006-05-08 2013-11-01 주식회사 동진쎄미켐 포토레지스트 조성물
KR20080070573A (ko) * 2007-01-26 2008-07-30 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. 노볼락 수지 블렌드를 포함하는 포토레지스트
KR101392291B1 (ko) * 2007-04-13 2014-05-07 주식회사 동진쎄미켐 포토레지스트 조성물 및 이를 이용한 박막트랜지스터기판의 제조방법
EP2639636B1 (de) * 2010-11-10 2021-05-19 DIC Corporation Positiv wirkende photolackzusammensetzung
CN103384850B (zh) * 2011-04-12 2015-02-04 Dic株式会社 正型光致抗蚀剂组合物、其涂膜及酚醛清漆型酚醛树脂
US10047186B2 (en) * 2014-11-25 2018-08-14 Dic Corporation Novolac phenol resin, manufacturing method therefor, photosensitive composition, resist material and coating film

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61223735A (ja) * 1985-03-28 1986-10-04 Japan Synthetic Rubber Co Ltd ポジ型感放射線樹脂組成物
US5266440A (en) * 1986-12-23 1993-11-30 Shipley Company Inc. Photoresist composition with aromatic novolak binder having a weight-average molecular weight in excess of 1500 Daltons
NO891063L (no) * 1988-03-31 1989-10-02 Thiokol Morton Inc Novolakharpikser av blandede aldehyder og positive fotoresistmaterialer fremstilt fra slike harpikser.
JPH02300751A (ja) * 1989-05-16 1990-12-12 Mitsubishi Petrochem Co Ltd ポジ型フォトレジスト組成物
US5208138A (en) * 1990-02-05 1993-05-04 Morton International, Inc. High contrast high thermal stability positive photoresists having novolak resins of lowered hydroxyl content
US5302490A (en) * 1991-10-21 1994-04-12 Shipley Company Inc. Radiation sensitive compositions comprising blends of an aliphatic novolak resin and an aromatic novolak resin
JP3182823B2 (ja) * 1991-12-27 2001-07-03 住友化学工業株式会社 ポジ型レジスト組成物
JP3424341B2 (ja) * 1994-04-11 2003-07-07 住友化学工業株式会社 感光性樹脂組成物

Also Published As

Publication number Publication date
EP0753795B1 (de) 1999-10-13
DE69604623T2 (de) 2000-01-27
EP0753795A1 (de) 1997-01-15
US5709977A (en) 1998-01-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: FUJIFILM CORP., TOKIO/TOKYO, JP