US5847960A
(en)
*
|
1995-03-20 |
1998-12-08 |
Electro Scientific Industries, Inc. |
Multi-tool positioning system
|
DE69737991T2
(de)
*
|
1996-11-20 |
2008-04-30 |
Ibiden Co., Ltd., Ogaki |
Laserbearbeitungsvorrichtung, verfahren und vorrichtung zur herstellung einer mehrschichtigen, gedruckten leiterplatte
|
US7732732B2
(en)
*
|
1996-11-20 |
2010-06-08 |
Ibiden Co., Ltd. |
Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
|
US6025256A
(en)
*
|
1997-01-06 |
2000-02-15 |
Electro Scientific Industries, Inc. |
Laser based method and system for integrated circuit repair or reconfiguration
|
US6144118A
(en)
*
|
1998-09-18 |
2000-11-07 |
General Scanning, Inc. |
High-speed precision positioning apparatus
|
JP3561159B2
(ja)
*
|
1998-09-21 |
2004-09-02 |
三菱電機株式会社 |
レーザ加工装置
|
JP3628199B2
(ja)
|
1999-01-22 |
2005-03-09 |
ファナック株式会社 |
サーボモータの制御装置
|
US6172325B1
(en)
|
1999-02-10 |
2001-01-09 |
Electro Scientific Industries, Inc. |
Laser processing power output stabilization apparatus and method employing processing position feedback
|
EP1173302B1
(de)
|
1999-04-27 |
2005-04-20 |
GSI Lumonics Inc. |
Laserkalibrierungsvorrichtung und -verfahren
|
TW482705B
(en)
|
1999-05-28 |
2002-04-11 |
Electro Scient Ind Inc |
Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias
|
US6791060B2
(en)
*
|
1999-05-28 |
2004-09-14 |
Electro Scientific Industries, Inc. |
Beam shaping and projection imaging with solid state UV gaussian beam to form vias
|
US6281471B1
(en)
*
|
1999-12-28 |
2001-08-28 |
Gsi Lumonics, Inc. |
Energy-efficient, laser-based method and system for processing target material
|
US7723642B2
(en)
*
|
1999-12-28 |
2010-05-25 |
Gsi Group Corporation |
Laser-based system for memory link processing with picosecond lasers
|
US20040134894A1
(en)
*
|
1999-12-28 |
2004-07-15 |
Bo Gu |
Laser-based system for memory link processing with picosecond lasers
|
US7838794B2
(en)
|
1999-12-28 |
2010-11-23 |
Gsi Group Corporation |
Laser-based method and system for removing one or more target link structures
|
US20060141681A1
(en)
*
|
2000-01-10 |
2006-06-29 |
Yunlong Sun |
Processing a memory link with a set of at least two laser pulses
|
US6887804B2
(en)
|
2000-01-10 |
2005-05-03 |
Electro Scientific Industries, Inc. |
Passivation processing over a memory link
|
JP5123456B2
(ja)
*
|
2000-01-10 |
2013-01-23 |
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド |
導電性リンクのレーザ切断方法およびレーザシステム
|
US7671295B2
(en)
*
|
2000-01-10 |
2010-03-02 |
Electro Scientific Industries, Inc. |
Processing a memory link with a set of at least two laser pulses
|
US20030222324A1
(en)
*
|
2000-01-10 |
2003-12-04 |
Yunlong Sun |
Laser systems for passivation or link processing with a set of laser pulses
|
WO2001052004A1
(en)
*
|
2000-01-11 |
2001-07-19 |
Electro Scientific Industries, Inc. |
Abbe error correction system and method
|
JP2001219342A
(ja)
*
|
2000-02-07 |
2001-08-14 |
Star Micronics Co Ltd |
工作機械の駆動制御装置
|
US6313591B1
(en)
*
|
2000-02-17 |
2001-11-06 |
Siemens Aktiengesellschaft |
Delay time modeling filter for cascaded regulator structure
|
TW504425B
(en)
*
|
2000-03-30 |
2002-10-01 |
Electro Scient Ind Inc |
Laser system and method for single pass micromachining of multilayer workpieces
|
IT1320478B1
(it)
|
2000-06-30 |
2003-11-26 |
Franco Sartorio |
Macchina operatrice e dispositivo manipolatore installabile su talemacchina.
|
US6515381B1
(en)
*
|
2000-09-13 |
2003-02-04 |
Nikon Corporation |
Cantilever stage
|
US6676878B2
(en)
|
2001-01-31 |
2004-01-13 |
Electro Scientific Industries, Inc. |
Laser segmented cutting
|
WO2002024396A1
(en)
|
2000-09-20 |
2002-03-28 |
Electro Scientific Industries, Inc. |
Uv laser cutting or shape modification of brittle, high melting temperature target materials such as ceramics or glasses
|
JP2002096234A
(ja)
|
2000-09-20 |
2002-04-02 |
Mori Seiki Co Ltd |
Nc工作機械における駆動機構部の制御方法および制御装置
|
US7157038B2
(en)
*
|
2000-09-20 |
2007-01-02 |
Electro Scientific Industries, Inc. |
Ultraviolet laser ablative patterning of microstructures in semiconductors
|
KR100853827B1
(ko)
|
2001-01-31 |
2008-08-22 |
일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 |
반도체의 마이크로구조에 대한 자외선 레이저 절제 패터닝
|
US20060091126A1
(en)
*
|
2001-01-31 |
2006-05-04 |
Baird Brian W |
Ultraviolet laser ablative patterning of microstructures in semiconductors
|
TW525240B
(en)
*
|
2001-01-31 |
2003-03-21 |
Electro Scient Ind Inc |
Ultraviolet laser ablative patterning of microstructures in semiconductors
|
US6534743B2
(en)
|
2001-02-01 |
2003-03-18 |
Electro Scientific Industries, Inc. |
Resistor trimming with small uniform spot from solid-state UV laser
|
DE10296339T5
(de)
*
|
2001-02-16 |
2004-04-15 |
Electro Scientific Industries, Inc., Portland |
Fliegende Strahlpfadfehlerkorrektur für eine Speicherverbindungsbearbeitung
|
US6816294B2
(en)
|
2001-02-16 |
2004-11-09 |
Electro Scientific Industries, Inc. |
On-the-fly beam path error correction for memory link processing
|
US8497450B2
(en)
*
|
2001-02-16 |
2013-07-30 |
Electro Scientific Industries, Inc. |
On-the fly laser beam path dithering for enhancing throughput
|
US7245412B2
(en)
*
|
2001-02-16 |
2007-07-17 |
Electro Scientific Industries, Inc. |
On-the-fly laser beam path error correction for specimen target location processing
|
CA2440694A1
(en)
*
|
2001-03-12 |
2002-09-19 |
Electro Scientific Industries, Inc. |
Quasi-cw diode-pumped, solid-state uv laser system and method employing same
|
US6781090B2
(en)
*
|
2001-03-12 |
2004-08-24 |
Electro Scientific Industries, Inc. |
Quasi-CW diode-pumped, solid-state harmonic laser system and method employing same
|
US6806440B2
(en)
*
|
2001-03-12 |
2004-10-19 |
Electro Scientific Industries, Inc. |
Quasi-CW diode pumped, solid-state UV laser system and method employing same
|
US7027155B2
(en)
|
2001-03-29 |
2006-04-11 |
Gsi Lumonics Corporation |
Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure
|
ATE508398T1
(de)
*
|
2001-03-29 |
2011-05-15 |
Lasx Ind Inc |
Steuerung für einen laser mit prädiktiven modellen des bewegungssystems des laserstrahls
|
KR100450455B1
(ko)
*
|
2001-04-19 |
2004-10-01 |
도시바 기카이 가부시키가이샤 |
서보 제어 방법
|
WO2002090037A1
(en)
*
|
2001-05-09 |
2002-11-14 |
Electro Scientific Industries, Inc. |
Micromachining with high-energy, intra-cavity q-switched co2 laser pulses
|
US6380512B1
(en)
*
|
2001-10-09 |
2002-04-30 |
Chromalloy Gas Turbine Corporation |
Method for removing coating material from a cooling hole of a gas turbine engine component
|
AU2002357016A1
(en)
*
|
2001-11-28 |
2003-06-10 |
James W. Overbeck |
Scanning microscopy, fluorescence detection, and laser beam positioning
|
JP4455884B2
(ja)
*
|
2001-11-30 |
2010-04-21 |
パナソニック株式会社 |
一定のレーザーの走査経路アルゴリズムを利用するレーザーによるアブレーション加工方法。
|
US6897405B2
(en)
*
|
2001-11-30 |
2005-05-24 |
Matsushita Electric Industrial Co., Ltd. |
Method of laser milling using constant tool path algorithm
|
ITMI20012798A1
(it)
*
|
2001-12-24 |
2003-06-24 |
Lucio Vaccani |
Procedimento e dispositivo di generazione di onde particolarmente peril controllo degli assi per macchine utensili e simili
|
US6706998B2
(en)
|
2002-01-11 |
2004-03-16 |
Electro Scientific Industries, Inc. |
Simulated laser spot enlargement
|
JP4340745B2
(ja)
*
|
2002-01-11 |
2009-10-07 |
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド |
レーザースポットを拡大するワークピースのレーザー加工方法
|
US7006237B2
(en)
*
|
2002-03-26 |
2006-02-28 |
Mitsubishi Denki Kabushiki Kaisha |
Laser beam positioning device for laser processing equipment
|
US6951995B2
(en)
*
|
2002-03-27 |
2005-10-04 |
Gsi Lumonics Corp. |
Method and system for high-speed, precise micromachining an array of devices
|
US7563695B2
(en)
*
|
2002-03-27 |
2009-07-21 |
Gsi Group Corporation |
Method and system for high-speed precise laser trimming and scan lens for use therein
|
US6987240B2
(en)
*
|
2002-04-18 |
2006-01-17 |
Applied Materials, Inc. |
Thermal flux processing by scanning
|
US6835912B2
(en)
|
2002-05-28 |
2004-12-28 |
Trumpf, Inc. |
Laser cutting machine with two Y-axis drives
|
US6888289B2
(en)
*
|
2002-07-16 |
2005-05-03 |
Baldor Electric Company |
Multi-axes, sub-micron positioner
|
US6737605B1
(en)
*
|
2003-01-21 |
2004-05-18 |
Gerald L. Kern |
Single and/or dual surface automatic edge sensing trimmer
|
US6706999B1
(en)
|
2003-02-24 |
2004-03-16 |
Electro Scientific Industries, Inc. |
Laser beam tertiary positioner apparatus and method
|
US20050155955A1
(en)
*
|
2003-03-10 |
2005-07-21 |
Daskal Vadim M. |
Method for reducing glare and creating matte finish of controlled density on a silicon surface
|
US7119511B2
(en)
*
|
2003-04-11 |
2006-10-10 |
International Business Machines Corporation |
Servo system for a two-dimensional micro-electromechanical system (MEMS)-based scanner and method therefor
|
US7616669B2
(en)
*
|
2003-06-30 |
2009-11-10 |
Electro Scientific Industries, Inc. |
High energy pulse suppression method
|
US6947454B2
(en)
*
|
2003-06-30 |
2005-09-20 |
Electro Scientific Industries, Inc. |
Laser pulse picking employing controlled AOM loading
|
JP2007511367A
(ja)
*
|
2003-09-10 |
2007-05-10 |
ベクトン・ディキンソン・アンド・カンパニー |
グレアを低減しシリコン表面に制御された密度のつや消し仕上げを作る方法
|
US20050103764A1
(en)
*
|
2003-10-01 |
2005-05-19 |
Trumpf, Inc. |
Laser cutting machine with two X-axis drives
|
DE10355614B4
(de)
*
|
2003-11-28 |
2006-11-23 |
Siemens Ag |
Einrichtung und Verfahren zur Bewegungsaufteilung einer Bewegung eines Maschinenteils entlang einer Antriebsachse einer Werkzeug- oder Produktionsmaschine
|
GB2428399B
(en)
*
|
2004-06-07 |
2010-05-05 |
Electro Scient Ind Inc |
AOM modulation techniques for improving laser system performance
|
US7133187B2
(en)
*
|
2004-06-07 |
2006-11-07 |
Electro Scientific Industries, Inc. |
AOM modulation techniques employing plurality of transducers to improve laser system performance
|
US7923306B2
(en)
*
|
2004-06-18 |
2011-04-12 |
Electro Scientific Industries, Inc. |
Semiconductor structure processing using multiple laser beam spots
|
US7935941B2
(en)
*
|
2004-06-18 |
2011-05-03 |
Electro Scientific Industries, Inc. |
Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures
|
US7435927B2
(en)
*
|
2004-06-18 |
2008-10-14 |
Electron Scientific Industries, Inc. |
Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset
|
US7629234B2
(en)
*
|
2004-06-18 |
2009-12-08 |
Electro Scientific Industries, Inc. |
Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling
|
US8383982B2
(en)
*
|
2004-06-18 |
2013-02-26 |
Electro Scientific Industries, Inc. |
Methods and systems for semiconductor structure processing using multiple laser beam spots
|
US8148211B2
(en)
*
|
2004-06-18 |
2012-04-03 |
Electro Scientific Industries, Inc. |
Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously
|
US7687740B2
(en)
*
|
2004-06-18 |
2010-03-30 |
Electro Scientific Industries, Inc. |
Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows
|
US7633034B2
(en)
*
|
2004-06-18 |
2009-12-15 |
Electro Scientific Industries, Inc. |
Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure
|
US7352784B2
(en)
*
|
2004-07-20 |
2008-04-01 |
Jds Uniphase Corporation |
Laser burst boosting method and apparatus
|
US20060191884A1
(en)
*
|
2005-01-21 |
2006-08-31 |
Johnson Shepard D |
High-speed, precise, laser-based material processing method and system
|
DE102005032336B4
(de)
*
|
2005-07-08 |
2008-09-04 |
Fachhochschule Aschaffenburg |
Verfahren zur Beeinflussung einer Steuerung oder zur Steuerung einer Bewegungseinrichtung und Steuerung oder Steuerungskomponente einer Bewegungseinrichtung
|
ITTO20050578A1
(it)
*
|
2005-08-16 |
2007-02-17 |
Prima Ind Spa |
Procedimento di gestione di sistemi dotati di attuatori ridondanti
|
US7538296B2
(en)
*
|
2005-09-06 |
2009-05-26 |
Pratt & Whitney Canada Corp. |
High speed laser drilling machine and method
|
US7638731B2
(en)
|
2005-10-18 |
2009-12-29 |
Electro Scientific Industries, Inc. |
Real time target topography tracking during laser processing
|
US20070215575A1
(en)
*
|
2006-03-15 |
2007-09-20 |
Bo Gu |
Method and system for high-speed, precise, laser-based modification of one or more electrical elements
|
DE102006020680A1
(de)
*
|
2006-04-27 |
2007-10-31 |
Carl Zeiss Industrielle Messtechnik Gmbh |
Verfahren und Vorrichtung zum positionsgenauen Triggern eines wahlweise aktivierbaren Maschinenteils
|
US7605343B2
(en)
|
2006-05-24 |
2009-10-20 |
Electro Scientific Industries, Inc. |
Micromachining with short-pulsed, solid-state UV laser
|
US8198566B2
(en)
*
|
2006-05-24 |
2012-06-12 |
Electro Scientific Industries, Inc. |
Laser processing of workpieces containing low-k dielectric material
|
US8084706B2
(en)
*
|
2006-07-20 |
2011-12-27 |
Gsi Group Corporation |
System and method for laser processing at non-constant velocities
|
US7817319B2
(en)
*
|
2006-08-22 |
2010-10-19 |
Gsi Group Corporation |
System and method for employing a resonant scanner in an X-Y high speed drilling system to provide low net scanning velocity during drilling
|
US9029731B2
(en)
|
2007-01-26 |
2015-05-12 |
Electro Scientific Industries, Inc. |
Methods and systems for laser processing continuously moving sheet material
|
DE102007026356A1
(de)
|
2007-06-06 |
2009-01-08 |
Trumpf Werkzeugmaschinen Gmbh + Co. Kg |
Mess- oder Werkzeugmaschine mit redundanten translatorisch wirksamen Achsen zur kontinuierlichen Bewegung an komplexen Bahnkurven
|
DE102007027503A1
(de)
|
2007-06-14 |
2009-01-08 |
Trumpf Werkzeugmaschinen Gmbh + Co. Kg |
Verfahren zur optimierten Bewegungskoordination von Mess- oder Werkzeugmaschinen mit redundanten translatorisch wirksamen Achsen
|
DE102007028934A1
(de)
|
2007-06-22 |
2008-12-24 |
Trumpf Werkzeugmaschinen Gmbh + Co. Kg |
Verfahren zur optimierten Bewegungskoordination von Mess-oder Werkzeugmaschinen mit redundanten translatorisch wirksamen Achsen
|
DE102007034885A1
(de)
|
2007-07-14 |
2009-01-15 |
Trumpf Werkzeugmaschinen Gmbh + Co. Kg |
Einrichtung oder Verfahren einer Steuerung für Mess- und Werkzeugmaschinen mit redundanten translatorisch wirkenden Achsen
|
MX2008009641A
(es)
*
|
2007-07-25 |
2009-02-26 |
Berry Plastics Corp |
Sistema de vision y metodo del mismo.
|
DE102007040022A1
(de)
|
2007-08-24 |
2009-02-26 |
Trumpf Werkzeugmaschinen Gmbh + Co. Kg |
Verfahren zur optimierten Bewegungskoordination von Mess- oder Werkzeugmaschinen mit redundanten translatorisch wirksamen Achsen
|
US7720561B2
(en)
*
|
2007-09-21 |
2010-05-18 |
The Boeing Company |
Optimizing non-productive part motion in an automated tape laydown machine
|
US20090084486A1
(en)
*
|
2007-09-27 |
2009-04-02 |
The Boeing Company |
Optimized ordering of doubler plies in composite structures
|
SG152090A1
(en)
*
|
2007-10-23 |
2009-05-29 |
Hypertronics Pte Ltd |
Scan head calibration system and method
|
DE102007055530A1
(de)
*
|
2007-11-21 |
2009-05-28 |
Carl Zeiss Ag |
Laserstrahlbearbeitung
|
GB0724057D0
(en)
*
|
2007-12-10 |
2008-01-23 |
Gsi Group Ltd |
Laser processing
|
US8426768B2
(en)
*
|
2008-02-20 |
2013-04-23 |
Aerotech, Inc. |
Position-based laser triggering for scanner
|
US20090242529A1
(en)
*
|
2008-03-31 |
2009-10-01 |
Groll David G |
Method to cut apertures in a material
|
US8173931B2
(en)
*
|
2008-06-13 |
2012-05-08 |
Electro Scientific Industries, Inc. |
Automatic recipe management for laser processing a work piece
|
US8024060B2
(en)
*
|
2008-06-16 |
2011-09-20 |
Electro Scientific Industries, Inc. |
Method for defining safe zones in laser machining systems
|
US20090312859A1
(en)
*
|
2008-06-16 |
2009-12-17 |
Electro Scientific Industries, Inc. |
Modifying entry angles associated with circular tooling actions to improve throughput in part machining
|
EP2163906B1
(de)
*
|
2008-09-16 |
2014-02-26 |
Mitutoyo Corporation |
Verfahren zur Bewegungserkennung einer Messsonde und Messinstrument
|
US8680430B2
(en)
*
|
2008-12-08 |
2014-03-25 |
Electro Scientific Industries, Inc. |
Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features
|
JP4612733B2
(ja)
*
|
2008-12-24 |
2011-01-12 |
東芝機械株式会社 |
パルスレーザ加工装置
|
EP2211187B1
(de)
*
|
2009-01-14 |
2013-10-02 |
Mitutoyo Corporation |
Verfahren zur Betätigung eines Systems, Vorrichtung zur Modifizierung eines Steuersignals zur Betätigung eines Systems und Verfahren zum Abstimmen einer solchen Vorrichtung
|
US8350187B2
(en)
*
|
2009-03-28 |
2013-01-08 |
Electro Scientific Industries, Inc. |
Method and apparatus for laser machining
|
TWI523720B
(zh)
|
2009-05-28 |
2016-03-01 |
伊雷克托科學工業股份有限公司 |
應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
|
JP5148717B2
(ja)
*
|
2009-08-03 |
2013-02-20 |
東芝機械株式会社 |
パルスレーザ加工装置およびパルスレーザ加工方法
|
DE102009029193A1
(de)
|
2009-09-04 |
2011-03-17 |
Trumpf Werkzeugmaschinen Gmbh + Co. Kg |
Laserbearbeitungsmaschine mit redundanten Achsen
|
WO2011082065A2
(en)
*
|
2009-12-30 |
2011-07-07 |
Gsi Group Corporation |
Link processing with high speed beam deflection
|
DE102010001781A1
(de)
|
2010-02-10 |
2011-08-11 |
Siemens Aktiengesellschaft, 80333 |
Verfahren zur Bewegung eines Maschinenelements einer Maschine aus der Automatisierungstechnik und Steuereinrichtung
|
DE102010001829B4
(de)
|
2010-02-11 |
2011-09-01 |
Siemens Aktiengesellschaft |
Verfahren zur Bewegung eines Maschinenelements einer Maschine aus der Automatisierungstechnik und Antriebssystem
|
DE102010018032A1
(de)
*
|
2010-04-23 |
2011-10-27 |
Osram Opto Semiconductors Gmbh |
Verfahren und Vorrichtung zur Bearbeitung eines Werkstückes mit einem Laser
|
US8389895B2
(en)
|
2010-06-25 |
2013-03-05 |
Electro Scientifix Industries, Inc. |
Method and apparatus for reliably laser marking articles
|
JP5014471B2
(ja)
*
|
2010-06-30 |
2012-08-29 |
ファナック株式会社 |
多軸加工機用数値制御装置
|
US8392002B2
(en)
|
2010-10-14 |
2013-03-05 |
Delta Tau Data Systems, Inc. |
Hybrid machine control incorporating fast-tool servos
|
KR101973660B1
(ko)
|
2010-10-22 |
2019-04-30 |
일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 |
빔 디더링 및 스카이빙을 위한 레이저 처리 시스템 및 방법
|
TWI608886B
(zh)
|
2011-07-05 |
2017-12-21 |
電子科學工業股份有限公司 |
用於提供聲光束偏轉器與聲光調變器使用期間之溫度穩定性之系統與方法
|
US8923356B1
(en)
|
2011-10-04 |
2014-12-30 |
Kern Technologies, LLC. |
Gas laser pre-ionization optical monitoring and compensation
|
US8921734B2
(en)
*
|
2011-11-10 |
2014-12-30 |
Mitsubishi Electric Research Laboratories, Inc. |
Laser cutting machine
|
DE112012005841T5
(de)
*
|
2012-02-08 |
2014-10-23 |
Mitsubishi Electric Corporation |
Servoregelungsvorrichtung
|
DE102012101979B4
(de)
|
2012-03-08 |
2018-02-15 |
Technische Universität Dresden |
Verfahren und Vorrichtung zur Erzeugung einer Relativbewegung
|
US8912465B2
(en)
*
|
2012-09-06 |
2014-12-16 |
Legend Laser Inc. |
Laser engraving device
|
US10213871B2
(en)
|
2012-10-22 |
2019-02-26 |
Electro Scientific Industries, Inc. |
Method and apparatus for marking an article
|
KR102241193B1
(ko)
|
2013-03-15 |
2021-04-19 |
일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 |
레이저 빔 위치결정 시스템용의 위상 어레이 조향
|
CN109177153B
(zh)
|
2013-06-10 |
2021-03-30 |
瑞尼斯豪公司 |
选择性激光固化设备和方法
|
GB201310398D0
(en)
|
2013-06-11 |
2013-07-24 |
Renishaw Plc |
Additive manufacturing apparatus and method
|
JP6474810B2
(ja)
|
2013-08-16 |
2019-02-27 |
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド |
薄層の内部にマーキングするためのレーザシステム並びに方法及びこれにより作製される対象物
|
US9397587B2
(en)
*
|
2013-11-20 |
2016-07-19 |
Massachusetts Institute Of Technology |
Multi-actuator design and control for a high-speed/large-range nanopositioning system
|
US10307863B2
(en)
|
2013-12-06 |
2019-06-04 |
Mitsubishi Electric Research Laboratories, Inc. |
Control of redundant laser processing machines
|
US9737958B2
(en)
*
|
2013-12-13 |
2017-08-22 |
Universal Laser Systems, Inc. |
Laser material processing systems with beam positioning assemblies having fluidic bearing interfaces and associated apparatuses and methods
|
US9263849B2
(en)
|
2013-12-27 |
2016-02-16 |
Gerald L Kern |
Impedance matching system for slab type lasers
|
US9696709B2
(en)
*
|
2014-02-21 |
2017-07-04 |
Mitsubishi Electric Research Laboratories, Inc. |
Method and system for computing reference signals for machines with redundant positioning
|
US9269035B2
(en)
|
2014-02-28 |
2016-02-23 |
Electro Scientific Industries, Inc. |
Modified two-dimensional codes, and laser systems and methods for producing such codes
|
US9594937B2
(en)
|
2014-02-28 |
2017-03-14 |
Electro Scientific Industries, Inc. |
Optical mark reader
|
DE102014207170B4
(de)
*
|
2014-04-15 |
2016-09-22 |
Trumpf Werkzeugmaschinen Gmbh + Co. Kg |
Verfahren zum Freischneiden eines Werkstückteils mittels eines Laserstrahls und zugehörige Laserschneidmaschine
|
RU2661977C1
(ru)
*
|
2014-07-03 |
2018-07-23 |
Ниппон Стил Энд Сумитомо Метал Корпорейшн |
Устройство лазерной обработки
|
WO2016051542A1
(ja)
*
|
2014-09-30 |
2016-04-07 |
株式会社牧野フライス製作所 |
送り軸制御方法および数値制御工作機械
|
EP3241034A1
(de)
|
2014-12-29 |
2017-11-08 |
Electro Scientific Industries, Inc. |
Adaptive teileprofilerzeugung über unabhängige seitenmessung mit ausrichtungsfunktionen
|
CN107405726A
(zh)
*
|
2015-02-23 |
2017-11-28 |
伊雷克托科学工业股份有限公司 |
用于大区域修改的雷射系统及方法
|
GB201505458D0
(en)
|
2015-03-30 |
2015-05-13 |
Renishaw Plc |
Additive manufacturing apparatus and methods
|
US9744620B2
(en)
|
2015-04-06 |
2017-08-29 |
Mitsubishi Electric Research Laboratories, Inc. |
Control of processing machines with redundant actuators
|
SG11201701698VA
(en)
*
|
2015-06-22 |
2017-04-27 |
Electro Scient Ind Inc |
Multi-axis machine tool and methods of controlling the same
|
KR102623538B1
(ko)
|
2015-09-09 |
2024-01-11 |
일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 |
작업물들을 레이저 가공하기 위한 레이저 가공 장치, 방법들 및 관련된 배열들
|
WO2017161284A1
(en)
|
2016-03-17 |
2017-09-21 |
Electro Scientific Industries, Inc. |
Location of image plane in a laser processing system
|
CN105834578B
(zh)
*
|
2016-04-07 |
2017-12-01 |
武汉菲仕运动控制系统有限公司 |
一种双轴同步激光切割机控制系统
|
WO2018042414A1
(en)
*
|
2016-08-28 |
2018-03-08 |
ACS Motion Control Ltd. |
Method and system for laser machining of relatively large workpieces
|
WO2018126078A1
(en)
|
2016-12-30 |
2018-07-05 |
Electro Scientific Industries, Inc. |
Method and system for extending optics lifetime in laser processing apparatus
|
US10324446B2
(en)
|
2017-03-02 |
2019-06-18 |
Mitsubishi Electric Research Laboratories, Inc. |
System and method for controlling redundant actuators with different dynamics
|
JP6490127B2
(ja)
*
|
2017-03-15 |
2019-03-27 |
ファナック株式会社 |
機械学習装置、サーボ制御装置、サーボ制御システム、及び機械学習方法
|
CN116275467A
(zh)
|
2018-06-05 |
2023-06-23 |
伊雷克托科学工业股份有限公司 |
激光加工设备、其操作方法以及使用其加工工件的方法
|
JP6806746B2
(ja)
*
|
2018-09-21 |
2021-01-06 |
ファナック株式会社 |
モータ制御装置
|
JP6845202B2
(ja)
*
|
2018-10-11 |
2021-03-17 |
ファナック株式会社 |
数値制御方法及び処理装置
|
JP2023513442A
(ja)
|
2020-01-24 |
2023-03-31 |
ノヴァンタ コーポレーション |
大面積レーザ加工の正確度を、位置フィードフォワード補償を使用して改善するためのシステムと方法
|
EP4056309A1
(de)
|
2021-03-09 |
2022-09-14 |
Bystronic Laser AG |
Vorrichtung und verfahren zum laserschneiden eines werkstücks und erzeugen von werkstückteilen
|
CN116079329B
(zh)
*
|
2023-03-03 |
2023-09-22 |
山东沃尔鑫机械有限公司 |
一种智能化焊接变位机
|