DE69602432T2 - Fabrikationsfehleranalysator mit verbesserter fehlererfassung - Google Patents

Fabrikationsfehleranalysator mit verbesserter fehlererfassung

Info

Publication number
DE69602432T2
DE69602432T2 DE69602432T DE69602432T DE69602432T2 DE 69602432 T2 DE69602432 T2 DE 69602432T2 DE 69602432 T DE69602432 T DE 69602432T DE 69602432 T DE69602432 T DE 69602432T DE 69602432 T2 DE69602432 T2 DE 69602432T2
Authority
DE
Germany
Prior art keywords
error
analyzer
factory
improved
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69602432T
Other languages
English (en)
Other versions
DE69602432D1 (de
Inventor
Timothy Sheen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teradyne Inc
Original Assignee
Teradyne Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teradyne Inc filed Critical Teradyne Inc
Publication of DE69602432D1 publication Critical patent/DE69602432D1/de
Application granted granted Critical
Publication of DE69602432T2 publication Critical patent/DE69602432T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/304—Contactless testing of printed or hybrid circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/315—Contactless testing by inductive methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/312—Contactless testing by capacitive methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/70—Testing of connections between components and printed circuit boards

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Stereo-Broadcasting Methods (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Investigating Or Analyzing Materials By The Use Of Magnetic Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE69602432T 1995-03-16 1996-02-02 Fabrikationsfehleranalysator mit verbesserter fehlererfassung Expired - Fee Related DE69602432T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/405,478 US5578930A (en) 1995-03-16 1995-03-16 Manufacturing defect analyzer with improved fault coverage
PCT/US1996/001287 WO1996029610A2 (en) 1995-03-16 1996-02-02 Manufacturing defect analyzer with improved fault coverage

Publications (2)

Publication Number Publication Date
DE69602432D1 DE69602432D1 (de) 1999-06-17
DE69602432T2 true DE69602432T2 (de) 1999-11-11

Family

ID=23603869

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69602432T Expired - Fee Related DE69602432T2 (de) 1995-03-16 1996-02-02 Fabrikationsfehleranalysator mit verbesserter fehlererfassung

Country Status (8)

Country Link
US (1) US5578930A (de)
EP (1) EP0815460B1 (de)
JP (1) JP3784412B2 (de)
KR (1) KR100363753B1 (de)
CN (1) CN1072362C (de)
AT (1) ATE180065T1 (de)
DE (1) DE69602432T2 (de)
WO (1) WO1996029610A2 (de)

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US5821759A (en) * 1997-02-27 1998-10-13 International Business Machines Corporation Method and apparatus for detecting shorts in a multi-layer electronic package
US6242923B1 (en) * 1997-02-27 2001-06-05 International Business Machines Corporation Method for detecting power plane-to-power plane shorts and I/O net-to power plane shorts in modules and printed circuit boards
US6118279A (en) 1997-07-30 2000-09-12 Candescent Technologies Corporation Magnetic detection of short circuit defects in plate structure
US6107806A (en) * 1997-07-30 2000-08-22 Candescent Technologies Corporation Device for magnetically sensing current in plate structure
DE19837169A1 (de) * 1998-08-17 2000-02-24 Reinhold Wein Verfahren und Vorrichtung zum Prüfen von bestückten und unbestückten Leiterplatten
JP2000171504A (ja) * 1998-12-04 2000-06-23 Nec Corp 半導体評価装置
US6316949B1 (en) * 1999-01-19 2001-11-13 Nidec-Read Corporation Apparatus and method for testing electric conductivity of circuit path ways on circuit board
JP3285568B2 (ja) * 1999-05-24 2002-05-27 日本電産リード株式会社 基板の配線検査装置および配線検査方法
DE10004649A1 (de) * 2000-02-03 2001-08-09 Infineon Technologies Ag Verfahren und Vorrichtung zur Anpassung/Abstimmung von Signallaufzeiten auf Leitungssystemen oder Netzen zwischen integrierten Schaltungen
JP4620848B2 (ja) * 2000-09-12 2011-01-26 イビデン株式会社 プリント配線板の電気検査装置及び電気検査方法
US6844747B2 (en) * 2001-03-19 2005-01-18 International Business Machines Corporation Wafer level system for producing burn-in/screen, and reliability evaluations to be performed on all chips simultaneously without any wafer contacting
US6734681B2 (en) * 2001-08-10 2004-05-11 James Sabey Apparatus and methods for testing circuit boards
JP2005055422A (ja) * 2003-07-23 2005-03-03 Fuji Xerox Co Ltd 故障診断用検知信号取得装置、故障診断装置、および支持基板
US6964205B2 (en) * 2003-12-30 2005-11-15 Tekscan Incorporated Sensor with plurality of sensor elements arranged with respect to a substrate
KR101038014B1 (ko) * 2004-02-11 2011-05-30 (주)제너시스템즈 그룹 관리 기능을 이용한 다자간 동시 통화 방법 및 시스템
JP4726606B2 (ja) 2005-10-26 2011-07-20 ヤマハファインテック株式会社 プリント基板の電気検査装置、検査治具および検査治具の固定確認方法
CN101226222B (zh) * 2008-02-02 2013-03-20 上海盈龙电子科技有限公司 Pcb多功能测试系统及实现方法
DE102008029679B4 (de) * 2008-06-23 2016-01-21 Eaton Industries Gmbh System, Verfahren und elektronische Schaltung für mindestens eine elektronische Schaltungseinheit
WO2010056343A2 (en) * 2008-11-14 2010-05-20 Teradyne, Inc. Fast open circuit detection for open power and ground pins
US8643539B2 (en) * 2008-11-19 2014-02-04 Nokomis, Inc. Advance manufacturing monitoring and diagnostic tool
JP5350885B2 (ja) * 2009-05-19 2013-11-27 株式会社エヌエフ回路設計ブロック 電極の分離状態検査方法、その装置及び電子デバイスの製造方法
US9157954B2 (en) * 2011-06-03 2015-10-13 Apple Inc. Test system with temporary test structures
JP2014235119A (ja) * 2013-06-04 2014-12-15 日本電産リード株式会社 基板検査装置、基板検査方法および基板検査用治具
US9523729B2 (en) * 2013-09-13 2016-12-20 Infineon Technologies Ag Apparatus and method for testing electric conductors
CN103592596A (zh) * 2013-10-22 2014-02-19 徐州市恒源电器有限公司 一种输出隔离式电源pcb连板测试电路
US11262396B2 (en) * 2017-02-10 2022-03-01 Checksum, Llc Functional tester for printed circuit boards, and associated systems and methods
US10448864B1 (en) 2017-02-24 2019-10-22 Nokomis, Inc. Apparatus and method to identify and measure gas concentrations
US10612992B2 (en) 2017-11-03 2020-04-07 Lockheed Martin Corporation Strain gauge detection and orientation system
US11489847B1 (en) 2018-02-14 2022-11-01 Nokomis, Inc. System and method for physically detecting, identifying, and diagnosing medical electronic devices connectable to a network
US11169203B1 (en) 2018-09-26 2021-11-09 Teradyne, Inc. Determining a configuration of a test system
US11461222B2 (en) 2020-04-16 2022-10-04 Teradyne, Inc. Determining the complexity of a test program
CN112131826B (zh) * 2020-08-28 2023-08-15 上海望友信息科技有限公司 Pcb检测评审方法、评审装置、电子设备及存储介质

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3719883A (en) * 1970-09-28 1973-03-06 North American Rockwell Magnetic core circuit for testing electrical short circuits between leads of a multi-lead circuit package
US3925784A (en) * 1971-10-27 1975-12-09 Radiation Inc Antenna arrays of internally phased elements
US3906514A (en) * 1971-10-27 1975-09-16 Harris Intertype Corp Dual polarization spiral antenna
US3949407A (en) * 1972-12-25 1976-04-06 Harris Corporation Direct fed spiral antenna
US4517511A (en) * 1981-10-16 1985-05-14 Fairchild Camera And Instrument Corporation Current probe signal processing circuit employing sample and hold technique to locate circuit faults
GB2143954A (en) * 1983-07-22 1985-02-20 Sharetree Ltd A capacitive method and apparatus for checking connections of a printed circuit board
US5124660A (en) * 1990-12-20 1992-06-23 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
US5254953A (en) * 1990-12-20 1993-10-19 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
US5365163A (en) * 1992-09-29 1994-11-15 Minnesota Mining And Manufacturing Company Sensor array for circuit tracer
US5420500A (en) * 1992-11-25 1995-05-30 Hewlett-Packard Company Pacitive electrode system for detecting open solder joints in printed circuit assemblies
US5406209A (en) * 1993-02-04 1995-04-11 Northern Telecom Limited Methods and apparatus for testing circuit boards
US5426372A (en) * 1993-07-30 1995-06-20 Genrad, Inc. Probe for capacitive open-circuit tests
US5391993A (en) * 1994-01-27 1995-02-21 Genrad, Inc. Capacitive open-circuit test employing threshold determination

Also Published As

Publication number Publication date
KR19980702943A (ko) 1998-09-05
KR100363753B1 (ko) 2003-01-24
JP3784412B2 (ja) 2006-06-14
CN1072362C (zh) 2001-10-03
WO1996029610A3 (en) 1996-12-05
JPH11502309A (ja) 1999-02-23
EP0815460B1 (de) 1999-05-12
ATE180065T1 (de) 1999-05-15
WO1996029610A2 (en) 1996-09-26
CN1178582A (zh) 1998-04-08
DE69602432D1 (de) 1999-06-17
US5578930A (en) 1996-11-26
EP0815460A2 (de) 1998-01-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee