DE69524421T2 - Kolophoniumfreies, niedrig voc, selbstreinigendes flussmittel und dessen verwendung - Google Patents
Kolophoniumfreies, niedrig voc, selbstreinigendes flussmittel und dessen verwendungInfo
- Publication number
- DE69524421T2 DE69524421T2 DE69524421T DE69524421T DE69524421T2 DE 69524421 T2 DE69524421 T2 DE 69524421T2 DE 69524421 T DE69524421 T DE 69524421T DE 69524421 T DE69524421 T DE 69524421T DE 69524421 T2 DE69524421 T2 DE 69524421T2
- Authority
- DE
- Germany
- Prior art keywords
- flux
- free
- low voc
- colophonium
- self
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004140 cleaning Methods 0.000 title abstract 2
- 239000012530 fluid Substances 0.000 title 1
- 230000004907 flux Effects 0.000 abstract 4
- 239000012190 activator Substances 0.000 abstract 2
- 230000000712 assembly Effects 0.000 abstract 2
- 238000000429 assembly Methods 0.000 abstract 2
- 238000005476 soldering Methods 0.000 abstract 2
- 150000003973 alkyl amines Chemical class 0.000 abstract 1
- -1 amine salt Chemical class 0.000 abstract 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract 1
- 238000011109 contamination Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3615—N-compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Detergent Compositions (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/303,668 US5571340A (en) | 1994-09-09 | 1994-09-09 | Rosin-free, low VOC, no-clean soldering flux and method using the same |
PCT/US1995/011413 WO1996007503A1 (en) | 1994-09-09 | 1995-09-07 | Rosin-free, low voc, no-clean soldering flux and method using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69524421D1 DE69524421D1 (de) | 2002-01-17 |
DE69524421T2 true DE69524421T2 (de) | 2002-05-23 |
Family
ID=23173147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69524421T Expired - Fee Related DE69524421T2 (de) | 1994-09-09 | 1995-09-07 | Kolophoniumfreies, niedrig voc, selbstreinigendes flussmittel und dessen verwendung |
Country Status (7)
Country | Link |
---|---|
US (1) | US5571340A (de) |
EP (1) | EP0776262B1 (de) |
JP (1) | JP3026510B2 (de) |
AT (1) | ATE209995T1 (de) |
AU (1) | AU3508695A (de) |
DE (1) | DE69524421T2 (de) |
WO (1) | WO1996007503A1 (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005053553A1 (de) * | 2005-11-08 | 2007-05-16 | Heraeus Gmbh W C | Lotpasten mit harzfreien Flussmittel |
EP1865760A2 (de) | 2006-06-08 | 2007-12-12 | centrotherm thermal solutions GmbH & Co. KG | Lötverfahren |
DE19711350B4 (de) * | 1996-03-19 | 2011-08-11 | Harima Chemicals, Inc., Hyogo | Lötflussmittel |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996037336A1 (en) * | 1995-05-24 | 1996-11-28 | Fry's Metals Inc. | Epoxy-based, voc-free soldering flux |
US5958151A (en) * | 1996-07-22 | 1999-09-28 | Ford Global Technologies, Inc. | Fluxing media for non-VOC, no-clean soldering |
US5985043A (en) * | 1997-07-21 | 1999-11-16 | Miguel Albert Capote | Polymerizable fluxing agents and fluxing adhesive compositions therefrom |
US6017634A (en) * | 1997-07-21 | 2000-01-25 | Miguel Albert Capote | Carboxyl-containing polyunsaturated fluxing agent and carboxyl-reactive neutralizing agent as adhesive |
US5985456A (en) * | 1997-07-21 | 1999-11-16 | Miguel Albert Capote | Carboxyl-containing polyunsaturated fluxing adhesive for attaching integrated circuits |
US6059894A (en) * | 1998-04-08 | 2000-05-09 | Hewlett-Packard Company | High temperature flip chip joining flux that obviates the cleaning process |
US6599372B2 (en) * | 1999-12-03 | 2003-07-29 | Fry's Metals, Inc. | Soldering flux |
US6217671B1 (en) | 1999-12-14 | 2001-04-17 | International Business Machines Corporation | Composition for increasing activity of a no-clean flux |
US6524398B2 (en) * | 2000-04-13 | 2003-02-25 | Fry's Metals, Inc. | Low-residue, low-solder-ball flux |
TW531868B (en) * | 2001-08-21 | 2003-05-11 | Au Optronics Corp | Soldering type anisotropic conductive film |
US7108755B2 (en) * | 2002-07-30 | 2006-09-19 | Motorola, Inc. | Simplification of ball attach method using super-saturated fine crystal flux |
US6796482B2 (en) * | 2002-10-31 | 2004-09-28 | Freescale Semiconductor, Inc. | Phase separated system for fluxing |
US7052558B1 (en) * | 2005-04-08 | 2006-05-30 | Chemicals And Metals Technologies, Inc. | Solder paste flux composition |
JP5183028B2 (ja) * | 2006-03-02 | 2013-04-17 | 神港精機株式会社 | 固着材およびバンプ形成方法 |
US20070284412A1 (en) * | 2006-05-31 | 2007-12-13 | Prakash Anna M | Solder flux composition |
US20080102561A1 (en) * | 2006-10-26 | 2008-05-01 | Schlumberger Technology Corporation | Methods of manufacturing printed circuit board assembly |
US8070047B1 (en) | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Flux composition and method of soldering |
US8070045B1 (en) | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Curable amine flux composition and method of soldering |
US8070046B1 (en) | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Amine flux composition and method of soldering |
US8070043B1 (en) | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Curable flux composition and method of soldering |
US8070044B1 (en) | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Polyamine flux composition and method of soldering |
US8430293B2 (en) | 2011-09-30 | 2013-04-30 | Rohm And Haas Electronic Materials Llc | Curable amine, carboxylic acid flux composition and method of soldering |
US8430295B2 (en) | 2011-09-30 | 2013-04-30 | Rohm And Haas Electronic Materials Llc | Curable flux composition and method of soldering |
US8434666B2 (en) | 2011-09-30 | 2013-05-07 | Rohm And Haas Electronic Materials Llc | Flux composition and method of soldering |
US8430294B2 (en) | 2011-09-30 | 2013-04-30 | Rohm And Haas Electronic Materials Llc | Amine, carboxylic acid flux composition and method of soldering |
US8434667B2 (en) | 2011-09-30 | 2013-05-07 | Rohm And Haas Electronic Materials Llc | Polyamine, carboxylic acid flux composition and method of soldering |
JP6259623B2 (ja) * | 2013-09-30 | 2018-01-10 | 株式会社タムラ製作所 | 低酸価アクリル樹脂含有はんだ付け用フラックスおよびはんだペースト組成物 |
CN103801860A (zh) * | 2014-02-20 | 2014-05-21 | 苏州龙腾万里化工科技有限公司 | 一种提高成膜性能的助焊剂 |
EP3308901A4 (de) * | 2015-06-12 | 2018-12-12 | Arakawa Chemical Industries, Ltd. | Flussmittel für bleifreies lot und bleifreie lotpaste |
US11425825B2 (en) | 2016-08-02 | 2022-08-23 | Koki Company Limited | Solder paste using a solder paste flux and solder powder |
JP6822440B2 (ja) * | 2017-05-26 | 2021-01-27 | 荒川化学工業株式会社 | 鉛フリーはんだフラックス用洗浄剤組成物、鉛フリーはんだフラックスの洗浄方法 |
JP6688267B2 (ja) * | 2017-09-06 | 2020-04-28 | 千住金属工業株式会社 | フラックスの製造方法 |
JP7160022B2 (ja) * | 2018-12-26 | 2022-10-25 | 荒川化学工業株式会社 | フローソルダリング用フラックス、はんだ付け方法 |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2470957A (en) * | 1945-08-27 | 1949-05-24 | Battelle Memorial Institute | Soft soldering flux |
US3099590A (en) * | 1959-06-25 | 1963-07-30 | Blackstone Corp | Solder fluxes |
US3746620A (en) * | 1971-07-13 | 1973-07-17 | Nl Industries Inc | Water soluble flux composition |
US3840411A (en) * | 1972-06-14 | 1974-10-08 | Blackstone Corp | Solder flux compositions |
JPS4926825A (de) * | 1972-07-07 | 1974-03-09 | ||
JPS4926826A (de) * | 1972-07-10 | 1974-03-09 | ||
US3925112A (en) * | 1974-02-19 | 1975-12-09 | Hercules Chemical Co Inc | Solder fluxes |
US4000016A (en) * | 1974-11-29 | 1976-12-28 | International Business Machines Corporation | Water soluble fluxes |
GB1517116A (en) * | 1976-05-27 | 1978-07-12 | Frys Metals Ltd | Soldering fluxes |
US4077815A (en) * | 1976-12-20 | 1978-03-07 | International Business Machines Corporation | Water soluble flux |
US4113524A (en) * | 1977-02-24 | 1978-09-12 | Rca Corporation | Method of assembling components on printed circuit boards |
US4140554A (en) * | 1977-09-30 | 1979-02-20 | Chevron Research Company | Water-rinsable soldering fluid containing a polyamide dispersant |
US4151015A (en) * | 1977-12-02 | 1979-04-24 | Lake Chemical Company | Flux for use in soldering |
DE2921827B2 (de) * | 1979-05-29 | 1981-06-04 | Winchester Electronics Gmbh, 7100 Heilbronn | Halogenfreies Flußmittel für die Weichlötung auf Kolophoniumbasis |
GB2107362A (en) * | 1981-10-16 | 1983-04-27 | Multicore Solders Ltd | Liquid fluxes for use in soldering |
US4428780A (en) * | 1983-02-07 | 1984-01-31 | Lake Chemical Co. | Solutions for use in bonding plates of storage batteries to connecting systems |
US4601763A (en) * | 1984-10-11 | 1986-07-22 | Lgz Landis & Gyr Zug Ag | Method for the mechanical soft-soldering of heavy metals utilizing a fluxing agent |
US4708751A (en) * | 1984-12-14 | 1987-11-24 | Alpha Grillo-Lotsysteme Gmbh | Halogen-free foam fluxes |
US4568395A (en) * | 1985-05-10 | 1986-02-04 | Nabhani Abdol R | Precleaner system and soldering flux |
JPH0773795B2 (ja) * | 1985-07-02 | 1995-08-09 | 太陽インキ製造株式会社 | はんだ付用水洗性フラツクス組成物 |
US4661173A (en) * | 1986-07-25 | 1987-04-28 | Mcdonnell Douglas Corporation | Alloy-enriched solder cream |
US4759490A (en) * | 1986-10-23 | 1988-07-26 | Fujitsu Limited | Method for soldering electronic components onto a printed wiring board using a solder paste |
US4988395A (en) * | 1989-01-31 | 1991-01-29 | Senju Metal Industry Co., Ltd. | Water-soluble soldering flux and paste solder using the flux |
US4895606A (en) * | 1989-02-23 | 1990-01-23 | Ashraf Jafri | Formulations for soldering flux |
US4940498A (en) * | 1989-08-14 | 1990-07-10 | Multicore Solders Limited | Flux composition |
FR2658746B1 (fr) * | 1990-02-23 | 1995-01-06 | Europ Accumulateurs | Flux de soudage pour accessoires de batterie d'accumulateurs au plomb. |
US5004509A (en) * | 1990-05-04 | 1991-04-02 | Delco Electronics Corporation | Low residue soldering flux |
US4994119A (en) * | 1990-05-09 | 1991-02-19 | International Business Machines Corporation | Water soluble soldering flux |
US5141568A (en) * | 1990-05-15 | 1992-08-25 | Hughes Aircraft Company | Water-soluble soldering paste |
US5085365B1 (en) * | 1990-05-15 | 1995-08-08 | Hughes Aircraft Co | Water soluble soldering flux |
US5009724A (en) * | 1990-07-02 | 1991-04-23 | At&T Bell Laboratories | Soldering flux and method of its use in fabricating and assembling circuit boards |
JPH07121468B2 (ja) * | 1990-10-03 | 1995-12-25 | メック株式会社 | はんだ付け用フラックス |
US5145531A (en) * | 1990-10-31 | 1992-09-08 | Hughes Aircraft Company | Fluxing apparatus and method |
US5069730A (en) * | 1991-01-28 | 1991-12-03 | At&T Bell Laboratories | Water-soluble soldering paste |
US5297721A (en) * | 1992-11-19 | 1994-03-29 | Fry's Metals, Inc. | No-clean soldering flux and method using the same |
US5281281A (en) * | 1993-02-05 | 1994-01-25 | Litton Systems, Inc. | No-clean, low-residue, volatile organic compound free soldering flux and method of use |
-
1994
- 1994-09-09 US US08/303,668 patent/US5571340A/en not_active Expired - Lifetime
-
1995
- 1995-09-07 AU AU35086/95A patent/AU3508695A/en not_active Abandoned
- 1995-09-07 JP JP8509687A patent/JP3026510B2/ja not_active Expired - Lifetime
- 1995-09-07 AT AT95931772T patent/ATE209995T1/de active
- 1995-09-07 EP EP95931772A patent/EP0776262B1/de not_active Expired - Lifetime
- 1995-09-07 DE DE69524421T patent/DE69524421T2/de not_active Expired - Fee Related
- 1995-09-07 WO PCT/US1995/011413 patent/WO1996007503A1/en active IP Right Grant
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19711350B4 (de) * | 1996-03-19 | 2011-08-11 | Harima Chemicals, Inc., Hyogo | Lötflussmittel |
DE102005053553A1 (de) * | 2005-11-08 | 2007-05-16 | Heraeus Gmbh W C | Lotpasten mit harzfreien Flussmittel |
US7926700B2 (en) | 2005-11-08 | 2011-04-19 | W.C. Heraeus Gmbh | Solder pastes comprising nonresinous fluxes |
EP1865760A2 (de) | 2006-06-08 | 2007-12-12 | centrotherm thermal solutions GmbH & Co. KG | Lötverfahren |
Also Published As
Publication number | Publication date |
---|---|
JPH10505006A (ja) | 1998-05-19 |
ATE209995T1 (de) | 2001-12-15 |
EP0776262B1 (de) | 2001-12-05 |
AU3508695A (en) | 1996-03-27 |
US5571340A (en) | 1996-11-05 |
JP3026510B2 (ja) | 2000-03-27 |
EP0776262A1 (de) | 1997-06-04 |
WO1996007503A1 (en) | 1996-03-14 |
DE69524421D1 (de) | 2002-01-17 |
EP0776262A4 (de) | 2000-01-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |