DE69523525D1 - Kompakte integrierte Kondensator-Widerstand/Induktor-Struktur - Google Patents
Kompakte integrierte Kondensator-Widerstand/Induktor-StrukturInfo
- Publication number
- DE69523525D1 DE69523525D1 DE69523525T DE69523525T DE69523525D1 DE 69523525 D1 DE69523525 D1 DE 69523525D1 DE 69523525 T DE69523525 T DE 69523525T DE 69523525 T DE69523525 T DE 69523525T DE 69523525 D1 DE69523525 D1 DE 69523525D1
- Authority
- DE
- Germany
- Prior art keywords
- resistor
- inductor structure
- integrated capacitor
- compact integrated
- compact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/298,685 US5541442A (en) | 1994-08-31 | 1994-08-31 | Integrated compact capacitor-resistor/inductor configuration |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69523525D1 true DE69523525D1 (de) | 2001-12-06 |
Family
ID=23151590
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69523525T Expired - Lifetime DE69523525D1 (de) | 1994-08-31 | 1995-08-08 | Kompakte integrierte Kondensator-Widerstand/Induktor-Struktur |
Country Status (4)
Country | Link |
---|---|
US (1) | US5541442A (de) |
EP (1) | EP0700091B1 (de) |
JP (1) | JPH08107186A (de) |
DE (1) | DE69523525D1 (de) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996006459A1 (en) * | 1994-08-25 | 1996-02-29 | National Semiconductor Corporation | Component stacking in multi-chip semiconductor packages |
EP0778593B1 (de) * | 1995-12-07 | 2000-11-22 | Co.Ri.M.Me. Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno | Herstellungsverfahren für einen Magnetkreis in einem integrierten Kreis |
US6563192B1 (en) | 1995-12-22 | 2003-05-13 | Micron Technology, Inc. | Semiconductor die with integral decoupling capacitor |
US6285070B1 (en) | 1995-12-22 | 2001-09-04 | Micron Technology, Inc. | Method of forming semiconductor die with integral decoupling capacitor |
US5874770A (en) | 1996-10-10 | 1999-02-23 | General Electric Company | Flexible interconnect film including resistor and capacitor layers |
US5847442A (en) * | 1996-11-12 | 1998-12-08 | Lucent Technologies Inc. | Structure for read-only-memory |
US6177716B1 (en) * | 1997-01-02 | 2001-01-23 | Texas Instruments Incorporated | Low loss capacitor structure |
US5936299A (en) * | 1997-03-13 | 1999-08-10 | International Business Machines Corporation | Substrate contact for integrated spiral inductors |
WO1998050956A1 (en) * | 1997-05-02 | 1998-11-12 | The Board Of Trustees Of The Leland Stanford Junior University | Patterned ground shields for integrated circuit inductors |
US5893731A (en) * | 1997-05-23 | 1999-04-13 | Industrial Technology Research Institute | Method for fabricating low cost integrated resistor capacitor combinations |
US5931719A (en) * | 1997-08-25 | 1999-08-03 | Lsi Logic Corporation | Method and apparatus for using pressure differentials through a polishing pad to improve performance in chemical mechanical polishing |
US6236101B1 (en) * | 1997-11-05 | 2001-05-22 | Texas Instruments Incorporated | Metallization outside protective overcoat for improved capacitors and inductors |
KR19990055422A (ko) * | 1997-12-27 | 1999-07-15 | 정선종 | 실리콘 기판에서의 인덕터 장치 및 그 제조 방법 |
US6387753B1 (en) | 1997-12-30 | 2002-05-14 | Texas Instruments Incorporated | Low loss capacitor structure |
US6531397B1 (en) | 1998-01-09 | 2003-03-11 | Lsi Logic Corporation | Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing |
US6534842B2 (en) * | 1998-03-03 | 2003-03-18 | Matsushita Electric Industrial Co., Ltd. | Composite components and the method of manufacturing the same |
DE19810825A1 (de) * | 1998-03-12 | 1999-09-16 | Siemens Ag | Integrierte elektronische Schaltungsanordnung und Verfahren zu ihrer Herstellung |
JPH11330385A (ja) * | 1998-05-20 | 1999-11-30 | Mitsumi Electric Co Ltd | Cmosデバイス |
US6921962B1 (en) * | 1998-12-18 | 2005-07-26 | Texas Instruments Incorporated | Integrated circuit having a thin film resistor located within a multilevel dielectric between an upper and lower metal interconnect layer |
JP3177971B2 (ja) * | 1999-01-25 | 2001-06-18 | 日本電気株式会社 | 抵抗素子を有する半導体装置 |
US6037649A (en) * | 1999-04-01 | 2000-03-14 | Winbond Electronics Corp. | Three-dimension inductor structure in integrated circuit technology |
US6208009B1 (en) | 1999-04-30 | 2001-03-27 | Digital Devices, Inc. | RC-networks in semiconductor devices and method therefor |
JP2002124639A (ja) * | 2000-08-09 | 2002-04-26 | Seiko Instruments Inc | 半導体装置及びその製造方法 |
US6798257B1 (en) | 2001-03-21 | 2004-09-28 | Cisco Technology, Inc. | Method and apparatus for providing multiple clock signals on a chip using a second PLL library circuit connected to a buffered reference clock output of a first PLL library circuit |
US7498196B2 (en) | 2001-03-30 | 2009-03-03 | Megica Corporation | Structure and manufacturing method of chip scale package |
KR100382765B1 (ko) * | 2001-06-15 | 2003-05-09 | 삼성전자주식회사 | 송수신용 수동소자와 그 집적모듈 및 그 제조방법 |
US6667536B2 (en) | 2001-06-28 | 2003-12-23 | Agere Systems Inc. | Thin film multi-layer high Q transformer formed in a semiconductor substrate |
US6639298B2 (en) | 2001-06-28 | 2003-10-28 | Agere Systems Inc. | Multi-layer inductor formed in a semiconductor substrate |
US6673698B1 (en) | 2002-01-19 | 2004-01-06 | Megic Corporation | Thin film semiconductor package utilizing a glass substrate with composite polymer/metal interconnect layers |
TW584950B (en) | 2001-12-31 | 2004-04-21 | Megic Corp | Chip packaging structure and process thereof |
TW503496B (en) | 2001-12-31 | 2002-09-21 | Megic Corp | Chip packaging structure and manufacturing process of the same |
TW544882B (en) | 2001-12-31 | 2003-08-01 | Megic Corp | Chip package structure and process thereof |
WO2004102665A1 (en) * | 2003-05-14 | 2004-11-25 | Ericsson Technology Licensing Ab | High-density circuits that include inductors |
US7169661B2 (en) * | 2004-04-12 | 2007-01-30 | System General Corp. | Process of fabricating high resistance CMOS resistor |
JP2006186034A (ja) * | 2004-12-27 | 2006-07-13 | Toshiba Corp | 半導体装置 |
DE102005050484B4 (de) * | 2005-10-21 | 2010-01-28 | Atmel Automotive Gmbh | Monolithisch integrierbare Schaltungsanordnung |
US8234773B2 (en) * | 2006-06-05 | 2012-08-07 | The United States Of America As Represented By The Secretary Of The Army | Apparatus and method for forming electronic devices |
US8188535B2 (en) * | 2008-05-16 | 2012-05-29 | Semiconductor Energy Laboratory Co., Ltd. | Nonvolatile semiconductor memory device and manufacturing method thereof |
US8581317B2 (en) * | 2008-08-27 | 2013-11-12 | Texas Instruments Incorporated | SOI MuGFETs having single gate electrode level |
ITMI20130060A1 (it) * | 2013-01-17 | 2014-07-18 | St Microelectronics Srl | Dispositivo a semiconduttore a struttura impilata. |
US9449762B2 (en) | 2014-05-07 | 2016-09-20 | Qualcomm Incorporated | Embedded package substrate capacitor with configurable/controllable equivalent series resistance |
US9800134B2 (en) * | 2015-02-25 | 2017-10-24 | Rockwell Automation Technologies, Inc. | Motor drive with LCL filter inductor with built-in passive damping resistor for AFE rectifier |
US9847293B1 (en) * | 2016-08-18 | 2017-12-19 | Qualcomm Incorporated | Utilization of backside silicidation to form dual side contacted capacitor |
EP3432360A1 (de) | 2017-07-17 | 2019-01-23 | Murata Manufacturing Co., Ltd. | Verteilter rc-abschluss |
US10439565B2 (en) * | 2017-09-27 | 2019-10-08 | Qualcomm Incorporated | Low parasitic capacitance low noise amplifier |
US10972068B2 (en) * | 2018-06-29 | 2021-04-06 | Qualcomm Incorporated | Process-invariant delay cell |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3193740A (en) * | 1961-09-16 | 1965-07-06 | Nippon Electric Co | Semiconductor device |
US3644850A (en) * | 1969-06-11 | 1972-02-22 | Ibm | Integrated circuit band pass filter |
US3864817A (en) * | 1972-06-26 | 1975-02-11 | Sprague Electric Co | Method of making capacitor and resistor for monolithic integrated circuits |
US4258001A (en) * | 1978-12-27 | 1981-03-24 | Eastman Kodak Company | Element, structure and method for the analysis or transport of liquids |
US4251326A (en) * | 1978-12-28 | 1981-02-17 | Western Electric Company, Inc. | Fabricating an RC network utilizing alpha tantalum |
JPS57169267A (en) * | 1981-04-10 | 1982-10-18 | Toshiba Corp | Semiconductor device and manufacture thereof |
US4489478A (en) * | 1981-09-29 | 1984-12-25 | Fujitsu Limited | Process for producing a three-dimensional semiconductor device |
US4419812A (en) * | 1982-08-23 | 1983-12-13 | Ncr Corporation | Method of fabricating an integrated circuit voltage multiplier containing a parallel plate capacitor |
US4458295A (en) * | 1982-11-09 | 1984-07-03 | Raytheon Company | Lumped passive components and method of manufacture |
GB2136235B (en) * | 1983-02-22 | 1986-07-09 | Philips Electronic Associated | Rc active filter device |
JPS61194868A (ja) * | 1985-02-25 | 1986-08-29 | Hitachi Ltd | 半導体集積回路装置 |
US4853759A (en) * | 1986-09-29 | 1989-08-01 | American Microsystems, Inc. | Integrated circuit filter with reduced die area |
US4910516A (en) * | 1987-03-25 | 1990-03-20 | Texas Instruments Incorporated | Integrated dual-slope analog to digital converter with R/C variance compensation |
DE3714672A1 (de) * | 1987-05-02 | 1988-11-17 | Telefunken Electronic Gmbh | Rc-leitung |
JPH01278771A (ja) * | 1988-05-02 | 1989-11-09 | Nec Corp | 半導体集積回路の入力保護装置 |
US4969032A (en) * | 1988-07-18 | 1990-11-06 | Motorola Inc. | Monolithic microwave integrated circuit having vertically stacked components |
SE466078B (sv) * | 1990-04-20 | 1991-12-09 | Ericsson Telefon Ab L M | Anordning vid en skaerm hos en integrerad krets och foerfarande foer framstaellning av anordningen |
CA2023172A1 (en) * | 1990-08-13 | 1992-02-14 | Francois L. Cordeau | Method to manufacture double-poly capacitors |
JPH04147671A (ja) * | 1990-10-09 | 1992-05-21 | Mitsubishi Electric Corp | 半導体装置 |
US5254493A (en) * | 1990-10-30 | 1993-10-19 | Microelectronics And Computer Technology Corporation | Method of fabricating integrated resistors in high density substrates |
JPH0582736A (ja) * | 1991-07-15 | 1993-04-02 | Matsushita Electric Ind Co Ltd | インダクタ |
US5189593A (en) * | 1991-11-04 | 1993-02-23 | Motorola, Inc. | Integrated distributed resistive-capacitive network |
US5283462A (en) * | 1991-11-04 | 1994-02-01 | Motorola, Inc. | Integrated distributed inductive-capacitive network |
US5416356A (en) * | 1993-09-03 | 1995-05-16 | Motorola, Inc. | Integrated circuit having passive circuit elements |
-
1994
- 1994-08-31 US US08/298,685 patent/US5541442A/en not_active Expired - Fee Related
-
1995
- 1995-08-08 EP EP95480111A patent/EP0700091B1/de not_active Expired - Lifetime
- 1995-08-08 DE DE69523525T patent/DE69523525D1/de not_active Expired - Lifetime
- 1995-08-21 JP JP7212125A patent/JPH08107186A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
US5541442A (en) | 1996-07-30 |
EP0700091A2 (de) | 1996-03-06 |
EP0700091B1 (de) | 2001-10-31 |
JPH08107186A (ja) | 1996-04-23 |
EP0700091A3 (de) | 1997-05-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69523525D1 (de) | Kompakte integrierte Kondensator-Widerstand/Induktor-Struktur | |
DE69534796D1 (de) | Kommunikationseinrichtung | |
DE69429069T2 (de) | Falzpresse | |
FR2726903B1 (fr) | Ecartometre integre | |
DE59507840D1 (de) | Planare Induktivität | |
DE69518181T2 (de) | Chip-Induktivität | |
DE9419979U1 (de) | Matratze | |
FR2722401B1 (fr) | Civiere pliante parachutable | |
DE59510936D1 (de) | Chip-Induktivität | |
DE69407953D1 (de) | Verbesserter integrierter magnetischer Abwärtskonverter | |
DE9407406U1 (de) | Oberbett | |
KR970703036A (ko) | 하이 q 집적 인덕터(high q integrated inductor) | |
KR960016173U (ko) | 콤팩트 케이스 | |
KR960016174U (ko) | 콤팩트 케이스 | |
KR960019798U (ko) | 콤팩트 케이스 | |
KR950029341U (ko) | 콤팩트형 매트리스 | |
KR950024505U (ko) | 휴대용 소변용구 | |
KR950029275U (ko) | 콤팩트의 고형분 덮개 | |
KR960003847U (ko) | 온돌 침대 | |
LV11450A (lv) | Saliekamais velomobilis | |
FI942946A0 (fi) | Patja | |
KR960019800U (ko) | 화장용 콤팩트 케이스 | |
FI1633U1 (fi) | Hurts | |
KR960012685U (ko) | 씨모오스 구조 | |
EE00015U1 (et) | Nagi |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de |