DE69522920D1 - Integrierte Leistungsschaltung - Google Patents

Integrierte Leistungsschaltung

Info

Publication number
DE69522920D1
DE69522920D1 DE69522920T DE69522920T DE69522920D1 DE 69522920 D1 DE69522920 D1 DE 69522920D1 DE 69522920 T DE69522920 T DE 69522920T DE 69522920 T DE69522920 T DE 69522920T DE 69522920 D1 DE69522920 D1 DE 69522920D1
Authority
DE
Germany
Prior art keywords
power circuit
integrated power
metallisation
rear face
active layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69522920T
Other languages
English (en)
Other versions
DE69522920T2 (de
Inventor
Robert Pezzani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Publication of DE69522920D1 publication Critical patent/DE69522920D1/de
Application granted granted Critical
Publication of DE69522920T2 publication Critical patent/DE69522920T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/761—PN junctions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/0814—Diodes only
DE69522920T 1994-12-30 1995-12-27 Integrierte Leistungsschaltung Expired - Fee Related DE69522920T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9416011A FR2729008B1 (fr) 1994-12-30 1994-12-30 Circuit integre de puissance

Publications (2)

Publication Number Publication Date
DE69522920D1 true DE69522920D1 (de) 2001-10-31
DE69522920T2 DE69522920T2 (de) 2002-06-13

Family

ID=9470525

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69522920T Expired - Fee Related DE69522920T2 (de) 1994-12-30 1995-12-27 Integrierte Leistungsschaltung

Country Status (12)

Country Link
US (3) US6075277A (de)
EP (1) EP0721218B1 (de)
JP (1) JP2671886B2 (de)
KR (1) KR100197912B1 (de)
CN (1) CN1051643C (de)
AT (1) ATE206246T1 (de)
CA (1) CA2166228C (de)
CZ (1) CZ290986B6 (de)
DE (1) DE69522920T2 (de)
FR (1) FR2729008B1 (de)
PL (1) PL177994B1 (de)
TW (1) TW290714B (de)

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US6411155B2 (en) 1994-12-30 2002-06-25 Sgs-Thomson Microelectronics S.A. Power integrated circuit
FR2729008B1 (fr) 1994-12-30 1997-03-21 Sgs Thomson Microelectronics Circuit integre de puissance
FR2753006B1 (fr) * 1996-08-27 1998-11-27 Sgs Thomson Microelectronics Pont redresseur protege monolithique
FR2764112B1 (fr) * 1997-05-28 1999-08-13 Sgs Thomson Microelectronics Mur d'isolement entre composants de puissance
DE19842882A1 (de) * 1998-09-18 2000-03-30 Siemens Ag Verfahren zum Herstellen eines Dotierungsgebiets
FR2773265B1 (fr) 1997-12-30 2000-03-10 Sgs Thomson Microelectronics Circuit de protection d'interface d'abonnes
US6104045A (en) * 1998-05-13 2000-08-15 Micron Technology, Inc. High density planar SRAM cell using bipolar latch-up and gated diode breakdown
FR2783353A1 (fr) * 1998-09-16 2000-03-17 St Microelectronics Sa Mur d'isolement entre composants de puissance
FR2800513B1 (fr) 1999-11-03 2002-03-29 St Microelectronics Sa Detecteur d'etat de composant de puissance
FR2808621B1 (fr) * 2000-05-05 2002-07-19 St Microelectronics Sa Composant monolithique a commande unique pour un pont mixte
FR2818805B1 (fr) * 2000-12-21 2003-04-04 St Microelectronics Sa Commutateur statique bidirectionnel sensible
FR2818806B1 (fr) 2000-12-21 2003-03-21 St Microelectronics Sa Commutateur electronique bidirectionnel bistable a commande par implusions
FR2819102B1 (fr) * 2000-12-29 2003-04-04 St Microelectronics Sa Commutateur electronique bidirectionnel bistable a commande par impulsions
CN1321457C (zh) * 2001-11-07 2007-06-13 新电元件工业株式会社 浪涌保护半导体装置
FR2834128B1 (fr) * 2001-12-21 2005-03-04 St Microelectronics Sa Dispositif de protection bidirectionnel a faible capacite
FR2834385A1 (fr) * 2001-12-28 2003-07-04 St Microelectronics Sa Commutateur statique bidirectionnel sensible dans les quadrants q4 et q1
US6849492B2 (en) * 2002-07-08 2005-02-01 Micron Technology, Inc. Method for forming standard voltage threshold and low voltage threshold MOSFET devices
US7622753B2 (en) * 2005-08-31 2009-11-24 Stmicroelectronics S.A. Ignition circuit
US7489488B2 (en) 2005-10-19 2009-02-10 Littelfuse, Inc. Integrated circuit providing overvoltage protection for low voltage lines
US20080012099A1 (en) * 2006-07-11 2008-01-17 Shing Yeh Electronic assembly and manufacturing method having a reduced need for wire bonds
AT506361B1 (de) * 2008-02-07 2012-06-15 Siemens Ag Thyristorbrückenschaltung
US7907381B2 (en) * 2008-03-12 2011-03-15 Zarlink Semiconductor (Us) Inc. Protection circuit for a subscriber line interface circuit
US8513722B2 (en) 2010-03-02 2013-08-20 Micron Technology, Inc. Floating body cell structures, devices including same, and methods for forming same
US9608119B2 (en) 2010-03-02 2017-03-28 Micron Technology, Inc. Semiconductor-metal-on-insulator structures, methods of forming such structures, and semiconductor devices including such structures
US8507966B2 (en) 2010-03-02 2013-08-13 Micron Technology, Inc. Semiconductor cells, arrays, devices and systems having a buried conductive line and methods for forming the same
US8288795B2 (en) 2010-03-02 2012-10-16 Micron Technology, Inc. Thyristor based memory cells, devices and systems including the same and methods for forming the same
US9646869B2 (en) 2010-03-02 2017-05-09 Micron Technology, Inc. Semiconductor devices including a diode structure over a conductive strap and methods of forming such semiconductor devices
US8598621B2 (en) 2011-02-11 2013-12-03 Micron Technology, Inc. Memory cells, memory arrays, methods of forming memory cells, and methods of forming a shared doped semiconductor region of a vertically oriented thyristor and a vertically oriented access transistor
US8952418B2 (en) 2011-03-01 2015-02-10 Micron Technology, Inc. Gated bipolar junction transistors
US8519431B2 (en) * 2011-03-08 2013-08-27 Micron Technology, Inc. Thyristors
US8772848B2 (en) 2011-07-26 2014-07-08 Micron Technology, Inc. Circuit structures, memory circuitry, and methods
FR2981200B1 (fr) * 2011-10-10 2017-01-13 Centre Nat De La Rech Scient (Cnrs) Cellule monolithique de circuit integre et notamment cellule de commutation monolithique
WO2014008415A1 (en) 2012-07-05 2014-01-09 Littelfuse, Inc. Crowbar device for voltage transient circuit protection
US8664690B1 (en) * 2012-11-15 2014-03-04 Macronix International Co., Ltd. Bi-directional triode thyristor for high voltage electrostatic discharge protection
CN103137646A (zh) * 2013-03-15 2013-06-05 中国科学院微电子研究所 用于双极型阻变存储器交叉阵列集成方式的选通器件单元
US9070790B2 (en) * 2013-08-29 2015-06-30 Infineon Technologies Ag Vertical semiconductor device and method of manufacturing thereof
US9224738B1 (en) 2014-08-18 2015-12-29 Micron Technology, Inc. Methods of forming an array of gated devices
US9209187B1 (en) 2014-08-18 2015-12-08 Micron Technology, Inc. Methods of forming an array of gated devices
US9673054B2 (en) 2014-08-18 2017-06-06 Micron Technology, Inc. Array of gated devices and methods of forming an array of gated devices
US20180263594A1 (en) * 2015-09-29 2018-09-20 Sony Corporation Semiconductor device, ultrasonic image pickup device, semiconductor device manufacturing method, and ultrasonic imaging system
US10032937B2 (en) * 2016-11-11 2018-07-24 Semiconductor Components Industries, Llc Monolithic series switching semiconductor device having low-resistance substrate contact structure and method
WO2020243875A1 (en) * 2019-06-03 2020-12-10 Littelfuse Semiconductor (Wuxi) Co., Ltd. Integrated mult-device chip and package
US11158759B1 (en) * 2020-04-16 2021-10-26 International Business Machines Corporation Chip carrier integrating power harvesting and regulation diodes and fabrication thereof

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3246206A (en) * 1965-02-25 1966-04-12 Gen Electric Voltage surge protector
JPS5127985B2 (de) * 1971-10-01 1976-08-16
FR2335957A1 (fr) * 1975-12-17 1977-07-15 Radiotechnique Compelec Dispositif semiconducteur monolithique comprenant un pont de redressement
FR2377132A1 (fr) * 1977-01-11 1978-08-04 Labo Cent Telecommunicat Dispositif de protection pour joncteur electronique
JPS5548962A (en) * 1978-10-04 1980-04-08 Hitachi Ltd Semiconductor switch
JPS5951743B2 (ja) * 1978-11-08 1984-12-15 株式会社日立製作所 半導体集積装置
US4278985A (en) * 1980-04-14 1981-07-14 Gte Laboratories Incorporated Monolithic integrated circuit structure incorporating Schottky contact diode bridge rectifier
DE3421185A1 (de) * 1984-06-07 1985-12-12 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleiterschaltung
JPH0666402B2 (ja) * 1985-12-12 1994-08-24 三菱電機株式会社 半導体集積回路装置の入力保護回路
JPS6365641A (ja) * 1986-09-05 1988-03-24 Nec Corp 半導体集積回路
JP2788269B2 (ja) * 1988-02-08 1998-08-20 株式会社東芝 半導体装置およびその製造方法
US5070382A (en) * 1989-08-18 1991-12-03 Motorola, Inc. Semiconductor structure for high power integrated circuits
US5306942A (en) * 1989-10-11 1994-04-26 Nippondenso Co., Ltd. Semiconductor device having a shield which is maintained at a reference potential
FR2670340B1 (fr) * 1990-12-07 1993-03-12 Sgs Thomson Microelectronics Circuit de protection a faible capacite.
GB2256743A (en) * 1991-06-11 1992-12-16 Texas Instruments Ltd A semiconductor component for transient voltage limiting
DE69207410T2 (de) * 1992-09-18 1996-08-29 Cons Ric Microelettronica Monolithisch integrierte Brückenschaltung mit Transistoren und entsprechendes Herstellungsverfahren
FR2697674B1 (fr) * 1992-10-29 1995-01-13 Sgs Thomson Microelectronics Thyristor et assemblage de thyristors à cathode commune.
US5817546A (en) * 1994-06-23 1998-10-06 Stmicroelectronics S.R.L. Process of making a MOS-technology power device
FR2729008B1 (fr) 1994-12-30 1997-03-21 Sgs Thomson Microelectronics Circuit integre de puissance

Also Published As

Publication number Publication date
KR100197912B1 (ko) 1999-07-01
PL311942A1 (en) 1996-07-08
TW290714B (de) 1996-11-11
EP0721218B1 (de) 2001-09-26
PL177994B1 (pl) 2000-02-29
US6580142B1 (en) 2003-06-17
KR960026988A (ko) 1996-07-22
US6075277A (en) 2000-06-13
JP2671886B2 (ja) 1997-11-05
CZ290986B6 (cs) 2002-11-13
JPH08241862A (ja) 1996-09-17
FR2729008B1 (fr) 1997-03-21
FR2729008A1 (fr) 1996-07-05
EP0721218A1 (de) 1996-07-10
US6017778A (en) 2000-01-25
CN1051643C (zh) 2000-04-19
DE69522920T2 (de) 2002-06-13
CA2166228C (en) 2000-12-12
CZ996A3 (en) 1997-07-16
CA2166228A1 (en) 1996-07-01
CN1131823A (zh) 1996-09-25
ATE206246T1 (de) 2001-10-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee