DE69519930T2 - Verfahren und gerät zum befestigen von kugelförmigen körpern an einer folienmatrix - Google Patents

Verfahren und gerät zum befestigen von kugelförmigen körpern an einer folienmatrix

Info

Publication number
DE69519930T2
DE69519930T2 DE69519930T DE69519930T DE69519930T2 DE 69519930 T2 DE69519930 T2 DE 69519930T2 DE 69519930 T DE69519930 T DE 69519930T DE 69519930 T DE69519930 T DE 69519930T DE 69519930 T2 DE69519930 T2 DE 69519930T2
Authority
DE
Germany
Prior art keywords
spherical bodies
film matrix
attaching spherical
attaching
matrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69519930T
Other languages
English (en)
Other versions
DE69519930D1 (de
Inventor
Gregory Hotchkiss
David Levine
Ray Sharrock
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Matrix Solar Technologies Inc
Original Assignee
Matrix Solar Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matrix Solar Technologies Inc filed Critical Matrix Solar Technologies Inc
Application granted granted Critical
Publication of DE69519930D1 publication Critical patent/DE69519930D1/de
Publication of DE69519930T2 publication Critical patent/DE69519930T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
    • H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
    • H01L31/03529—Shape of the potential jump barrier or surface barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
    • H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
    • H01L31/035281—Shape of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/547—Monocrystalline silicon PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Finger-Pressure Massage (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE69519930T 1994-07-22 1995-07-20 Verfahren und gerät zum befestigen von kugelförmigen körpern an einer folienmatrix Expired - Lifetime DE69519930T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/279,320 US5498576A (en) 1994-07-22 1994-07-22 Method and apparatus for affixing spheres to a foil matrix
PCT/GB1995/001710 WO1996003775A1 (en) 1994-07-22 1995-07-20 Method and apparatus for affixing spheres to a foil matrix

Publications (2)

Publication Number Publication Date
DE69519930D1 DE69519930D1 (de) 2001-02-22
DE69519930T2 true DE69519930T2 (de) 2001-08-02

Family

ID=23068469

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69519930T Expired - Lifetime DE69519930T2 (de) 1994-07-22 1995-07-20 Verfahren und gerät zum befestigen von kugelförmigen körpern an einer folienmatrix

Country Status (7)

Country Link
US (1) US5498576A (de)
EP (1) EP0772890B1 (de)
JP (1) JP3865773B2 (de)
KR (1) KR100386785B1 (de)
CA (1) CA2195098C (de)
DE (1) DE69519930T2 (de)
WO (1) WO1996003775A1 (de)

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US5620927A (en) * 1995-05-25 1997-04-15 National Semiconductor Corporation Solder ball attachment machine for semiconductor packages
US5766982A (en) * 1996-03-07 1998-06-16 Micron Technology, Inc. Method and apparatus for underfill of bumped or raised die
US6066509A (en) 1998-03-12 2000-05-23 Micron Technology, Inc. Method and apparatus for underfill of bumped or raised die
US5744759A (en) * 1996-05-29 1998-04-28 International Business Machines Corporation Circuit boards that can accept a pluggable tab module that can be attached or removed without solder
CA2239626C (en) 1996-10-09 2003-09-02 Josuke Nakata Semiconductor device
EP0940860B1 (de) * 1997-08-27 2003-10-15 Josuke Nakata Sphärische halbleiteranordnung, verfahren zu seiner herstellung und sphärisches halbleiteranordnungmaterial
KR100308243B1 (ko) * 1998-07-31 2001-09-29 니시무로 타이죠 반도체장치 및 그 제조방법
JP2001210843A (ja) * 1999-11-17 2001-08-03 Fuji Mach Mfg Co Ltd 光発電パネルおよびその製造方法
KR100324333B1 (ko) * 2000-01-04 2002-02-16 박종섭 적층형 패키지 및 그 제조 방법
US7547579B1 (en) * 2000-04-06 2009-06-16 Micron Technology, Inc. Underfill process
US6736942B2 (en) * 2000-05-02 2004-05-18 Johns Hopkins University Freestanding reactive multilayer foils
JP3922868B2 (ja) * 2000-06-23 2007-05-30 株式会社三井ハイテック 太陽電池の製造方法および太陽電池
US6441298B1 (en) * 2000-08-15 2002-08-27 Nec Research Institute, Inc Surface-plasmon enhanced photovoltaic device
JP2002104819A (ja) * 2000-09-28 2002-04-10 Kyocera Corp 結晶質シリコン粒子およびその製造方法および結晶質シリコン粒子を用いた光電変換装置
DE10052914A1 (de) * 2000-10-25 2002-05-16 Steffen Jaeger Halbleitereinrichtung und Verfahren zu deren Herstellung
AU2001277779B2 (en) * 2001-08-13 2005-04-07 Sphelar Power Corporation Semiconductor device and method of its manufacture
WO2003017382A1 (fr) * 2001-08-13 2003-02-27 Josuke Nakata Module a semi-conducteur emetteur de lumiere ou recepteur de lumiere et procede de fabrication correspondant
AU2001295987B2 (en) * 2001-10-19 2005-10-20 Sphelar Power Corporation Light emitting or light receiving semiconductor module and method for manufacturing the same
US6649901B2 (en) 2002-03-14 2003-11-18 Nec Laboratories America, Inc. Enhanced optical transmission apparatus with improved aperture geometry
US7238966B2 (en) 2002-05-02 2007-07-03 Josuke Nakata Light-receiving panel or light-emitting panel, and manufacturing method thereof
CN100380685C (zh) * 2002-06-21 2008-04-09 中田仗祐 光电或发光用器件及其制造方法
US6897085B2 (en) * 2003-01-21 2005-05-24 Spheral Solar Power, Inc. Method of fabricating an optical concentrator for a photovoltaic solar cell
US7387400B2 (en) * 2003-04-21 2008-06-17 Kyosemi Corporation Light-emitting device with spherical photoelectric converting element
AU2003242109A1 (en) * 2003-06-09 2005-01-04 Kyosemi Corporation Generator system
US20060185715A1 (en) * 2003-07-25 2006-08-24 Hammerbacher Milfred D Photovoltaic apparatus including spherical semiconducting particles
US8570373B2 (en) * 2007-06-08 2013-10-29 Cisco Technology, Inc. Tracking an object utilizing location information associated with a wireless device
US8355041B2 (en) * 2008-02-14 2013-01-15 Cisco Technology, Inc. Telepresence system for 360 degree video conferencing
US8797377B2 (en) * 2008-02-14 2014-08-05 Cisco Technology, Inc. Method and system for videoconference configuration
US8319819B2 (en) * 2008-03-26 2012-11-27 Cisco Technology, Inc. Virtual round-table videoconference
US8390667B2 (en) * 2008-04-15 2013-03-05 Cisco Technology, Inc. Pop-up PIP for people not in picture
US8694658B2 (en) * 2008-09-19 2014-04-08 Cisco Technology, Inc. System and method for enabling communication sessions in a network environment
US8659637B2 (en) * 2009-03-09 2014-02-25 Cisco Technology, Inc. System and method for providing three dimensional video conferencing in a network environment
US20100283829A1 (en) * 2009-05-11 2010-11-11 Cisco Technology, Inc. System and method for translating communications between participants in a conferencing environment
US9082297B2 (en) * 2009-08-11 2015-07-14 Cisco Technology, Inc. System and method for verifying parameters in an audiovisual environment
US9225916B2 (en) * 2010-03-18 2015-12-29 Cisco Technology, Inc. System and method for enhancing video images in a conferencing environment
USD682294S1 (en) 2010-12-16 2013-05-14 Cisco Technology, Inc. Display screen with graphical user interface
JP6024529B2 (ja) * 2013-03-11 2016-11-16 株式会社豊田自動織機 太陽電池モジュール、および太陽電池モジュールの製造方法
US10351953B2 (en) * 2017-03-16 2019-07-16 Lam Research Corporation Systems and methods for flow monitoring in a precursor vapor supply system of a substrate processing system

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US4451968A (en) * 1981-09-08 1984-06-05 Texas Instruments Incorporated Method and device for providing an ohmic contact of high resistance on a semiconductor at low temperatures
US4407320A (en) * 1981-09-08 1983-10-04 Texas Instruments Incorporated Large area, fault tolerant solar energy converter
US4614835A (en) * 1983-12-15 1986-09-30 Texas Instruments Incorporated Photovoltaic solar arrays using silicon microparticles
US4581103A (en) * 1984-09-04 1986-04-08 Texas Instruments Incorporated Method of etching semiconductor material
US4691076A (en) * 1984-09-04 1987-09-01 Texas Instruments Incorporated Solar array with aluminum foil matrix
US4917752A (en) * 1984-09-04 1990-04-17 Texas Instruments Incorporated Method of forming contacts on semiconductor members
US4872607A (en) * 1988-02-04 1989-10-10 Texas Instruments Incorporated Method of bonding semiconductor material to an aluminum foil
US4992138A (en) * 1989-07-31 1991-02-12 Texas Instruments Incorporated Method and apparatus for constructing a foil matrix for a solar cell
US5091319A (en) * 1989-07-31 1992-02-25 Hotchkiss Gregory B Method of affixing silicon spheres to a foil matrix
US5028546A (en) * 1989-07-31 1991-07-02 Texas Instruments Incorporated Method for manufacture of solar cell with foil contact point
US5258331A (en) * 1989-10-20 1993-11-02 Texas Instruments Incorporated Method of manufacturing resin-encapsulated semiconductor device package using photoresist or pre-peg lead frame dam bars
JP2828318B2 (ja) * 1990-05-18 1998-11-25 新光電気工業株式会社 多層リードフレームの製造方法

Also Published As

Publication number Publication date
JPH10503058A (ja) 1998-03-17
CA2195098C (en) 2004-10-12
US5498576A (en) 1996-03-12
EP0772890B1 (de) 2001-01-17
CA2195098A1 (en) 1996-02-08
WO1996003775A1 (en) 1996-02-08
KR100386785B1 (ko) 2003-08-25
DE69519930D1 (de) 2001-02-22
EP0772890A1 (de) 1997-05-14
KR970705186A (ko) 1997-09-06
JP3865773B2 (ja) 2007-01-10

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