DE69519930D1 - Verfahren und gerät zum befestigen von kugelförmigen körpern an einer folienmatrix - Google Patents

Verfahren und gerät zum befestigen von kugelförmigen körpern an einer folienmatrix

Info

Publication number
DE69519930D1
DE69519930D1 DE69519930T DE69519930T DE69519930D1 DE 69519930 D1 DE69519930 D1 DE 69519930D1 DE 69519930 T DE69519930 T DE 69519930T DE 69519930 T DE69519930 T DE 69519930T DE 69519930 D1 DE69519930 D1 DE 69519930D1
Authority
DE
Germany
Prior art keywords
spherical bodies
film matrix
attaching spherical
attaching
matrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69519930T
Other languages
English (en)
Other versions
DE69519930T2 (de
Inventor
Gregory Hotchkiss
David Levine
Ray Sharrock
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Matrix Solar Technologies Inc
Original Assignee
Matrix Solar Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matrix Solar Technologies Inc filed Critical Matrix Solar Technologies Inc
Application granted granted Critical
Publication of DE69519930D1 publication Critical patent/DE69519930D1/de
Publication of DE69519930T2 publication Critical patent/DE69519930T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
    • H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
    • H01L31/03529—Shape of the potential jump barrier or surface barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
    • H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
    • H01L31/035281—Shape of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/547—Monocrystalline silicon PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Finger-Pressure Massage (AREA)
DE69519930T 1994-07-22 1995-07-20 Verfahren und gerät zum befestigen von kugelförmigen körpern an einer folienmatrix Expired - Lifetime DE69519930T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/279,320 US5498576A (en) 1994-07-22 1994-07-22 Method and apparatus for affixing spheres to a foil matrix
PCT/GB1995/001710 WO1996003775A1 (en) 1994-07-22 1995-07-20 Method and apparatus for affixing spheres to a foil matrix

Publications (2)

Publication Number Publication Date
DE69519930D1 true DE69519930D1 (de) 2001-02-22
DE69519930T2 DE69519930T2 (de) 2001-08-02

Family

ID=23068469

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69519930T Expired - Lifetime DE69519930T2 (de) 1994-07-22 1995-07-20 Verfahren und gerät zum befestigen von kugelförmigen körpern an einer folienmatrix

Country Status (7)

Country Link
US (1) US5498576A (de)
EP (1) EP0772890B1 (de)
JP (1) JP3865773B2 (de)
KR (1) KR100386785B1 (de)
CA (1) CA2195098C (de)
DE (1) DE69519930T2 (de)
WO (1) WO1996003775A1 (de)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5620927A (en) * 1995-05-25 1997-04-15 National Semiconductor Corporation Solder ball attachment machine for semiconductor packages
US6066509A (en) * 1998-03-12 2000-05-23 Micron Technology, Inc. Method and apparatus for underfill of bumped or raised die
US5766982A (en) * 1996-03-07 1998-06-16 Micron Technology, Inc. Method and apparatus for underfill of bumped or raised die
US5744759A (en) * 1996-05-29 1998-04-28 International Business Machines Corporation Circuit boards that can accept a pluggable tab module that can be attached or removed without solder
EP0866506B1 (de) 1996-10-09 2008-12-03 Josuke Nakata Halbleitervorrichtung
DE69725601T2 (de) * 1997-08-27 2004-04-15 Nakata, Josuke, Joyo Sphärische halbleiteranordnung, verfahren zu seiner herstellung und sphärisches halbleiteranordnungmaterial
US6284568B1 (en) * 1998-07-31 2001-09-04 Kabushiki Kaisha Toshiba Method and system for producing semiconductor device
JP2001210843A (ja) * 1999-11-17 2001-08-03 Fuji Mach Mfg Co Ltd 光発電パネルおよびその製造方法
KR100324333B1 (ko) * 2000-01-04 2002-02-16 박종섭 적층형 패키지 및 그 제조 방법
US7547579B1 (en) * 2000-04-06 2009-06-16 Micron Technology, Inc. Underfill process
US6736942B2 (en) * 2000-05-02 2004-05-18 Johns Hopkins University Freestanding reactive multilayer foils
JP3922868B2 (ja) * 2000-06-23 2007-05-30 株式会社三井ハイテック 太陽電池の製造方法および太陽電池
US6441298B1 (en) * 2000-08-15 2002-08-27 Nec Research Institute, Inc Surface-plasmon enhanced photovoltaic device
JP2002104819A (ja) * 2000-09-28 2002-04-10 Kyocera Corp 結晶質シリコン粒子およびその製造方法および結晶質シリコン粒子を用いた光電変換装置
DE10052914A1 (de) * 2000-10-25 2002-05-16 Steffen Jaeger Halbleitereinrichtung und Verfahren zu deren Herstellung
WO2003017382A1 (fr) * 2001-08-13 2003-02-27 Josuke Nakata Module a semi-conducteur emetteur de lumiere ou recepteur de lumiere et procede de fabrication correspondant
AU2001277779B2 (en) * 2001-08-13 2005-04-07 Sphelar Power Corporation Semiconductor device and method of its manufacture
US7602035B2 (en) * 2001-10-19 2009-10-13 Josuke Nakata Light emitting or light receiving semiconductor module and method for manufacturing same
US6649901B2 (en) 2002-03-14 2003-11-18 Nec Laboratories America, Inc. Enhanced optical transmission apparatus with improved aperture geometry
AU2002255303B2 (en) * 2002-05-02 2006-07-06 Sphelar Power Corporation Light-Receiving panel or light-emitting panel, and manufacturing method thereof
JP4021441B2 (ja) * 2002-06-21 2007-12-12 仗祐 中田 受光又は発光用デバイスおよびその製造方法
US6897085B2 (en) * 2003-01-21 2005-05-24 Spheral Solar Power, Inc. Method of fabricating an optical concentrator for a photovoltaic solar cell
US7387400B2 (en) * 2003-04-21 2008-06-17 Kyosemi Corporation Light-emitting device with spherical photoelectric converting element
ES2307944T3 (es) * 2003-06-09 2008-12-01 Kyosemi Corporation Sistema generador.
US20060185715A1 (en) * 2003-07-25 2006-08-24 Hammerbacher Milfred D Photovoltaic apparatus including spherical semiconducting particles
US8570373B2 (en) * 2007-06-08 2013-10-29 Cisco Technology, Inc. Tracking an object utilizing location information associated with a wireless device
US8355041B2 (en) * 2008-02-14 2013-01-15 Cisco Technology, Inc. Telepresence system for 360 degree video conferencing
US8797377B2 (en) * 2008-02-14 2014-08-05 Cisco Technology, Inc. Method and system for videoconference configuration
US8319819B2 (en) * 2008-03-26 2012-11-27 Cisco Technology, Inc. Virtual round-table videoconference
US8390667B2 (en) * 2008-04-15 2013-03-05 Cisco Technology, Inc. Pop-up PIP for people not in picture
US8694658B2 (en) * 2008-09-19 2014-04-08 Cisco Technology, Inc. System and method for enabling communication sessions in a network environment
US8659637B2 (en) * 2009-03-09 2014-02-25 Cisco Technology, Inc. System and method for providing three dimensional video conferencing in a network environment
US20100283829A1 (en) * 2009-05-11 2010-11-11 Cisco Technology, Inc. System and method for translating communications between participants in a conferencing environment
US9082297B2 (en) * 2009-08-11 2015-07-14 Cisco Technology, Inc. System and method for verifying parameters in an audiovisual environment
US9225916B2 (en) * 2010-03-18 2015-12-29 Cisco Technology, Inc. System and method for enhancing video images in a conferencing environment
USD682294S1 (en) 2010-12-16 2013-05-14 Cisco Technology, Inc. Display screen with graphical user interface
JP6024529B2 (ja) * 2013-03-11 2016-11-16 株式会社豊田自動織機 太陽電池モジュール、および太陽電池モジュールの製造方法
US10351953B2 (en) * 2017-03-16 2019-07-16 Lam Research Corporation Systems and methods for flow monitoring in a precursor vapor supply system of a substrate processing system

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4451968A (en) * 1981-09-08 1984-06-05 Texas Instruments Incorporated Method and device for providing an ohmic contact of high resistance on a semiconductor at low temperatures
US4407320A (en) * 1981-09-08 1983-10-04 Texas Instruments Incorporated Large area, fault tolerant solar energy converter
US4614835A (en) * 1983-12-15 1986-09-30 Texas Instruments Incorporated Photovoltaic solar arrays using silicon microparticles
US4917752A (en) * 1984-09-04 1990-04-17 Texas Instruments Incorporated Method of forming contacts on semiconductor members
US4691076A (en) * 1984-09-04 1987-09-01 Texas Instruments Incorporated Solar array with aluminum foil matrix
US4581103A (en) * 1984-09-04 1986-04-08 Texas Instruments Incorporated Method of etching semiconductor material
US4872607A (en) * 1988-02-04 1989-10-10 Texas Instruments Incorporated Method of bonding semiconductor material to an aluminum foil
US4992138A (en) * 1989-07-31 1991-02-12 Texas Instruments Incorporated Method and apparatus for constructing a foil matrix for a solar cell
US5091319A (en) * 1989-07-31 1992-02-25 Hotchkiss Gregory B Method of affixing silicon spheres to a foil matrix
US5028546A (en) * 1989-07-31 1991-07-02 Texas Instruments Incorporated Method for manufacture of solar cell with foil contact point
US5258331A (en) * 1989-10-20 1993-11-02 Texas Instruments Incorporated Method of manufacturing resin-encapsulated semiconductor device package using photoresist or pre-peg lead frame dam bars
JP2828318B2 (ja) * 1990-05-18 1998-11-25 新光電気工業株式会社 多層リードフレームの製造方法

Also Published As

Publication number Publication date
EP0772890A1 (de) 1997-05-14
CA2195098A1 (en) 1996-02-08
KR970705186A (ko) 1997-09-06
US5498576A (en) 1996-03-12
CA2195098C (en) 2004-10-12
EP0772890B1 (de) 2001-01-17
WO1996003775A1 (en) 1996-02-08
DE69519930T2 (de) 2001-08-02
JP3865773B2 (ja) 2007-01-10
KR100386785B1 (ko) 2003-08-25
JPH10503058A (ja) 1998-03-17

Similar Documents

Publication Publication Date Title
DE69519930D1 (de) Verfahren und gerät zum befestigen von kugelförmigen körpern an einer folienmatrix
DE59701062D1 (de) Verfahren und Vorrichtung zum Applizieren von selbsthaftender Schutzfolie auf Karosserien
DE69521973D1 (de) Vorrichtung und verfahren zum aufbringen von elastischen querspannungen
DE69605789D1 (de) Dosen endverschluss und verfahren zum befestigen desselben an einem dosenkörper
DE69418901D1 (de) Vorrichtung und verfahren zum anbringen von ausgiessern
DE69628965D1 (de) Verfahren und Gerät zum Verwalten von Beziehungen zwischen Objekten in einer verteilten Objektumgebung
DE69620208D1 (de) Einrichtung und verfahren zum gemeinsamen wechseln von bauelementen in einer bauelementen-speiseanlage
DE69630928D1 (de) Vorrichtung und Verfahren zum Anzeigen einer Übersetzung
DE69631747D1 (de) Verfahren und Gerät zum Drucken
DE19581593T1 (de) Isoliervorrichtung und Verfahren zum Befestigen eines Isolierpolsters an einer Halteeinrichtung
DE69840975D1 (de) Verfahren und Vorrichtung zum Aufbringen einer Schichten auf einen Körper
DE69402086D1 (de) Verfahren und vorrichtung zum verbinden von karosserieteilen
DE69617511D1 (de) Verfahren und Gerät zum Verwalten von Objekten in einer verteilten Objektbetriebsumgebung
DE69418745D1 (de) Verfahren und Gerät zum Drucken von Bildern
DE69821154D1 (de) Verfahren und Vorrichtung zum Umhüllen einer Ladung mit Dehnfolie
DE69428431D1 (de) Verfahren und vorrichtung zum druckformen
DE69125447D1 (de) Verfahren und Vorrichtung zum Positionieren von Wandlern
DE69218107D1 (de) Vorrichtung und Verfahren zum Übertragen von Abziehbildern
DE69830763D1 (de) Verfahren und Vorrichtung zum Steuern einer Kartenanzeige
DE69419845D1 (de) Verfahren und Gerät zum Zusammenbau von mehreren Platteneinheiten
DE59608371D1 (de) Vorrichtung und Verfahren zum Verdampfen einer Flüssigkeit
DE69532433D1 (de) Verfahren und Einrichtung zum Steuern einer Anzeige
DE69527589D1 (de) Verfahren und Einrichtung zum Steuern einer Anzeige
DE69418380D1 (de) Verfahren zum Melken von Tieren und Vorrichtung zu deren Anwendung
DE69523774D1 (de) Verfahren und vorrichtung zum anbringen von sichtbaren markierungen auf transparentem material

Legal Events

Date Code Title Description
8364 No opposition during term of opposition