DE69516902T2 - Computerfestplatte und Verfahren zu deren Herstellung - Google Patents
Computerfestplatte und Verfahren zu deren HerstellungInfo
- Publication number
- DE69516902T2 DE69516902T2 DE1995616902 DE69516902T DE69516902T2 DE 69516902 T2 DE69516902 T2 DE 69516902T2 DE 1995616902 DE1995616902 DE 1995616902 DE 69516902 T DE69516902 T DE 69516902T DE 69516902 T2 DE69516902 T2 DE 69516902T2
- Authority
- DE
- Germany
- Prior art keywords
- ceramic
- phase
- hard drive
- composite material
- infiltrating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000919 ceramic Substances 0.000 abstract 7
- 239000002131 composite material Substances 0.000 abstract 3
- 229910052580 B4C Inorganic materials 0.000 abstract 2
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 230000003028 elevating effect Effects 0.000 abstract 1
- 238000011065 in-situ storage Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1036—Alloys containing non-metals starting from a melt
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C29/00—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides
- C22C29/02—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides
- C22C29/06—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds
- C22C29/062—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds based on B4C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
- C22C32/0052—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only carbides
- C22C32/0057—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only carbides based on B4C
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B23/00—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture
- G11B23/0057—Intermediate mediums, i.e. mediums provided with an information structure not specific to the method of reproducing or duplication such as matrixes for mechanical pressing of an information structure ; record carriers having a relief information structure provided with or included in layers not specific for a single reproducing method; apparatus or processes specially adapted for their manufacture
- G11B23/0064—Intermediate mediums, i.e. mediums provided with an information structure not specific to the method of reproducing or duplication such as matrixes for mechanical pressing of an information structure ; record carriers having a relief information structure provided with or included in layers not specific for a single reproducing method; apparatus or processes specially adapted for their manufacture mediums or carriers characterised by the selection of the material
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
- G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
- G11B5/7368—Non-polymeric layer under the lowermost magnetic recording layer
- G11B5/7371—Non-magnetic single underlayer comprising nickel
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
- G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
- G11B5/739—Magnetic recording media substrates
- G11B5/73911—Inorganic substrates
- G11B5/73913—Composites or coated substrates
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/74—Record carriers characterised by the form, e.g. sheet shaped to wrap around a drum
- G11B5/82—Disk carriers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/58—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following
- G11B5/596—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following for track following on disks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12049—Nonmetal component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12049—Nonmetal component
- Y10T428/12056—Entirely inorganic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12063—Nonparticulate metal component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12063—Nonparticulate metal component
- Y10T428/12069—Plural nonparticulate metal components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249994—Composite having a component wherein a constituent is liquid or is contained within preformed walls [e.g., impregnant-filled, previously void containing component, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Magnetic Record Carriers (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Ceramic Products (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US35418594A | 1994-12-12 | 1994-12-12 | |
US08/496,798 US5780164A (en) | 1994-12-12 | 1995-06-29 | Computer disk substrate, the process for making same, and the material made therefrom |
PCT/US1995/015794 WO1996018748A2 (en) | 1994-12-12 | 1995-12-06 | Computer disk substrate, the process for making same, and the material made therefrom |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69516902D1 DE69516902D1 (de) | 2000-06-15 |
DE69516902T2 true DE69516902T2 (de) | 2000-10-05 |
Family
ID=26998286
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1995616902 Expired - Fee Related DE69516902T2 (de) | 1994-12-12 | 1995-12-06 | Computerfestplatte und Verfahren zu deren Herstellung |
Country Status (6)
Country | Link |
---|---|
US (2) | US5780164A (de) |
EP (1) | EP0799325B1 (de) |
JP (1) | JPH10512082A (de) |
AT (1) | ATE192783T1 (de) |
DE (1) | DE69516902T2 (de) |
WO (1) | WO1996018748A2 (de) |
Families Citing this family (29)
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---|---|---|---|---|
FI119941B (fi) * | 1999-10-15 | 2009-05-15 | Asm Int | Menetelmä nanolaminaattien valmistamiseksi |
JP4080030B2 (ja) * | 1996-06-14 | 2008-04-23 | 住友電気工業株式会社 | 半導体基板材料、半導体基板、半導体装置、及びその製造方法 |
ATE286297T1 (de) * | 1996-07-01 | 2005-01-15 | Dyson Us Holdings Inc | Magnetplattensubstrate aus keramik-metall matrix kompositen mit oder ohne metallbeschichtung |
US5900277A (en) * | 1996-12-09 | 1999-05-04 | The Dow Chemical Company | Method of controlling infiltration of complex-shaped ceramic-metal composite articles and the products produced thereby |
WO1998028467A1 (en) * | 1996-12-20 | 1998-07-02 | The Dow Chemical Company | Method of coating complex-shaped ceramic-metal composites and the products produced thereby |
US5930581A (en) * | 1996-12-24 | 1999-07-27 | The Dow Chemical Company | Method of preparing complex-shaped ceramic-metal composite articles and the products produced thereby |
US6068905A (en) * | 1997-08-20 | 2000-05-30 | International Business Machines Corporation | Composite disk substrates |
JP4304749B2 (ja) | 1998-02-24 | 2009-07-29 | 住友電気工業株式会社 | 半導体装置用部材の製造方法 |
DE19832299B4 (de) * | 1998-07-17 | 2004-07-29 | Vacuumschmelze Gmbh | Verfahren zur Verbesserung des Korrosionsschutzes von Seltenerddauermagneten |
US6623788B1 (en) * | 2000-07-25 | 2003-09-23 | Seagate Technology Llc | Defect-free patterning of sol-gel-coated substrates for magnetic recording media |
KR100431927B1 (ko) * | 2001-04-19 | 2004-05-24 | 서울대학교 공과대학 교육연구재단 | 용침법을 통한 고밀도 탄화붕소-알루미늄 복합재료 제조방법 |
KR20020086291A (ko) * | 2001-05-11 | 2002-11-18 | 후지 샤신 필름 가부시기가이샤 | 자기전사용 마스터담체 |
US20020187295A1 (en) * | 2001-05-15 | 2002-12-12 | Fuji Photo Film Co., Ltd. | Magnetic transfer master medium |
EP1393253A4 (de) * | 2001-05-17 | 2009-12-16 | Entelos Inc | Vorrichtung und verfahren zum validieren eines computermodells |
US20030012631A1 (en) * | 2001-07-12 | 2003-01-16 | Pencis Christopher H. | High temperature substrate transfer robot |
US20030056861A1 (en) | 2001-09-24 | 2003-03-27 | Weaver Samuel C. | Metal matrix composites of aluminum, magnesium and titanium using calcium hexaboride |
DK1430160T3 (da) * | 2001-09-24 | 2006-10-09 | Saffil Ltd | Kompositmateriale med en metalmatrix af aluminium, magnesium og titan med calciumhexaborid |
TW200407556A (en) * | 2002-11-08 | 2004-05-16 | Delta Electronics Inc | A film deposition method for stress balance |
US7149047B1 (en) * | 2003-01-21 | 2006-12-12 | Seagate Technology Llc | Heating/cooling based system for obtaining a disc drive servo signal |
US7466799B2 (en) * | 2003-04-09 | 2008-12-16 | Varian Medical Systems, Inc. | X-ray tube having an internal radiation shield |
NZ546089A (en) * | 2003-10-07 | 2008-04-30 | Entelos Inc | Simulating patient-specific outcomes using virtual patients and stimulation engine |
US20050137751A1 (en) * | 2003-12-05 | 2005-06-23 | Cox Damon K. | Auto-diagnostic method and apparatus |
US8465853B2 (en) * | 2004-03-24 | 2013-06-18 | Marvell World Trade Ltd. | Glassy metal disk |
US8563869B2 (en) * | 2005-08-29 | 2013-10-22 | Hitachi Metals, Ltd. | Circuit board and semiconductor module using this, production method for circuit board |
EP2073951A2 (de) * | 2006-10-18 | 2009-07-01 | Dow Global Technologies Inc. | Verbessertes verfahren zur bindung von aluminium-bor-kohlenstoff-verbundstoffen |
US20090315093A1 (en) | 2008-04-16 | 2009-12-24 | Asm America, Inc. | Atomic layer deposition of metal carbide films using aluminum hydrocarbon compounds |
US8030234B2 (en) * | 2008-10-27 | 2011-10-04 | Dow Global Technologies Llc | Aluminum boron carbide composite and method to form said composite |
US10340520B2 (en) * | 2014-10-14 | 2019-07-02 | Sila Nanotechnologies, Inc. | Nanocomposite battery electrode particles with changing properties |
US10002936B2 (en) | 2014-10-23 | 2018-06-19 | Asm Ip Holding B.V. | Titanium aluminum and tantalum aluminum thin films |
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US5045278A (en) * | 1989-11-09 | 1991-09-03 | Allied-Signal Inc. | Dual processing of aluminum base metal matrix composites |
US5227345A (en) * | 1990-05-03 | 1993-07-13 | The Dow Chemical Company | Powder mixtures including ceramics and metal compounds |
JPH05271842A (ja) * | 1990-09-12 | 1993-10-19 | Hitachi Metals Ltd | サーメット合金及びその製造方法 |
EP0484014A1 (de) * | 1990-11-02 | 1992-05-06 | The Dow Chemical Company | Borkarbidreaktionsfähige Metall-Keramik-Werkstoffe, mit einer Mikrostruktur, die durch eine Wärmebehandlung im Anschluss an eine Verdichtung hergestellt werden |
US5298468A (en) * | 1990-11-02 | 1994-03-29 | The Dow Chemical Company | Boron carbide-aluminum cermets having microstructures tailored by a post-densification heat treatment |
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JPH05209247A (ja) * | 1991-09-21 | 1993-08-20 | Hitachi Metals Ltd | サーメット合金及びその製造方法 |
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EP0634374A1 (de) * | 1993-07-12 | 1995-01-18 | Corning Incorporated | Feinkörnige Canasit Glaskeramik zur Herstellung von Speichervorrichtungen |
US5487931A (en) * | 1993-12-02 | 1996-01-30 | Annacone; William R. | Rigid disc substrate comprising a central hard core substrate with a hard, thermally and mechanically matched overlying smoothing layer and method for making the same |
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US5480695A (en) * | 1994-08-10 | 1996-01-02 | Tenhover; Michael A. | Ceramic substrates and magnetic data storage components prepared therefrom |
US5552204A (en) * | 1995-01-13 | 1996-09-03 | International Business Machines Corporation | Magnetic disk with boron carbide overcoat layer |
US5670253A (en) * | 1995-12-20 | 1997-09-23 | Minnesota Mining And Manufacturing Company | Ceramic wafers and thin film magnetic heads |
US5712014A (en) * | 1996-07-01 | 1998-01-27 | Alyn Corporation | Metal matrix compositions for substrates used to make magnetic disks for hard disk drives |
-
1995
- 1995-06-29 US US08/496,798 patent/US5780164A/en not_active Expired - Fee Related
- 1995-12-06 JP JP51913696A patent/JPH10512082A/ja active Pending
- 1995-12-06 WO PCT/US1995/015794 patent/WO1996018748A2/en not_active Application Discontinuation
- 1995-12-06 EP EP19950944474 patent/EP0799325B1/de not_active Expired - Lifetime
- 1995-12-06 AT AT95944474T patent/ATE192783T1/de not_active IP Right Cessation
- 1995-12-06 DE DE1995616902 patent/DE69516902T2/de not_active Expired - Fee Related
-
1997
- 1997-06-03 US US08/868,217 patent/US5820965A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0799325A1 (de) | 1997-10-08 |
EP0799325B1 (de) | 2000-05-10 |
DE69516902D1 (de) | 2000-06-15 |
US5780164A (en) | 1998-07-14 |
ATE192783T1 (de) | 2000-05-15 |
US5820965A (en) | 1998-10-13 |
WO1996018748A2 (en) | 1996-06-20 |
WO1996018748A3 (en) | 1996-08-15 |
JPH10512082A (ja) | 1998-11-17 |
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