DE69513361T2 - Trägerbehälter für Substratscheiben - Google Patents
Trägerbehälter für SubstratscheibenInfo
- Publication number
- DE69513361T2 DE69513361T2 DE69513361T DE69513361T DE69513361T2 DE 69513361 T2 DE69513361 T2 DE 69513361T2 DE 69513361 T DE69513361 T DE 69513361T DE 69513361 T DE69513361 T DE 69513361T DE 69513361 T2 DE69513361 T2 DE 69513361T2
- Authority
- DE
- Germany
- Prior art keywords
- wafer
- container
- angle
- vertical
- axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 235000012431 wafers Nutrition 0.000 title claims description 148
- 239000000758 substrate Substances 0.000 title 1
- 238000010438 heat treatment Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 12
- 239000012495 reaction gas Substances 0.000 description 12
- 208000037998 chronic venous disease Diseases 0.000 description 7
- 239000002245 particle Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67306—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/12—Substrate holders or susceptors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25980294A JP2732224B2 (ja) | 1994-09-30 | 1994-09-30 | ウエーハ支持ボート |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69513361D1 DE69513361D1 (de) | 1999-12-23 |
DE69513361T2 true DE69513361T2 (de) | 2000-05-11 |
Family
ID=17339208
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69513361T Expired - Fee Related DE69513361T2 (de) | 1994-09-30 | 1995-09-19 | Trägerbehälter für Substratscheiben |
Country Status (7)
Country | Link |
---|---|
US (1) | US5595604A (fr) |
EP (1) | EP0704554B1 (fr) |
JP (1) | JP2732224B2 (fr) |
KR (1) | KR100227915B1 (fr) |
DE (1) | DE69513361T2 (fr) |
MY (1) | MY113316A (fr) |
TW (1) | TW290706B (fr) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0155930B1 (ko) * | 1995-11-28 | 1998-12-01 | 김광호 | 종형확산로의 보우트-바 |
JPH10256161A (ja) * | 1997-03-07 | 1998-09-25 | Mitsubishi Electric Corp | Cvd用治具、それを用いた半導体装置の製造方法、およびcvd用治具の製造方法 |
JP3715073B2 (ja) * | 1997-04-22 | 2005-11-09 | 大日本スクリーン製造株式会社 | 熱処理装置 |
US6225594B1 (en) | 1999-04-15 | 2001-05-01 | Integrated Materials, Inc. | Method and apparatus for securing components of wafer processing fixtures |
US6205993B1 (en) | 1999-04-15 | 2001-03-27 | Integrated Materials, Inc. | Method and apparatus for fabricating elongate crystalline members |
US6196211B1 (en) * | 1999-04-15 | 2001-03-06 | Integrated Materials, Inc. | Support members for wafer processing fixtures |
JP4812147B2 (ja) * | 1999-09-07 | 2011-11-09 | 株式会社日立製作所 | 太陽電池の製造方法 |
EP1156515A1 (fr) * | 2000-05-16 | 2001-11-21 | Semiconductor 300 GmbH & Co. KG | Dispositif de transport d'objets en forme de disque |
US6455395B1 (en) | 2000-06-30 | 2002-09-24 | Integrated Materials, Inc. | Method of fabricating silicon structures including fixtures for supporting wafers |
US6450346B1 (en) | 2000-06-30 | 2002-09-17 | Integrated Materials, Inc. | Silicon fixtures for supporting wafers during thermal processing |
US6727191B2 (en) * | 2001-02-26 | 2004-04-27 | Integrated Materials, Inc. | High temperature hydrogen anneal of silicon wafers supported on a silicon fixture |
US20040173948A1 (en) * | 2002-09-19 | 2004-09-09 | Pandelisev Kiril A. | Process and apparatus for silicon boat, silicon tubing and other silicon based member fabrication |
AU2003249029A1 (en) * | 2002-07-15 | 2004-02-02 | Aviza Technology, Inc. | Control of a gaseous environment in a wafer loading chamber |
DE10239775B3 (de) * | 2002-08-29 | 2004-05-13 | Wacker Siltronic Ag | Verfahren zur Herstellung eines Siliciumwafers mit einer mit polykristallinem Silicium beschichteten Rückseite und Siliciumwafer hergestellt nach diesem Verfahren |
US20050098107A1 (en) * | 2003-09-24 | 2005-05-12 | Du Bois Dale R. | Thermal processing system with cross-flow liner |
US20050121145A1 (en) * | 2003-09-25 | 2005-06-09 | Du Bois Dale R. | Thermal processing system with cross flow injection system with rotatable injectors |
KR100527671B1 (ko) * | 2004-02-19 | 2005-11-28 | 삼성전자주식회사 | 웨이퍼 상에 막을 형성하는 방법 |
TW201320222A (zh) * | 2011-06-23 | 2013-05-16 | Entegris Inc | 太陽能電池製程載具 |
DE102013113687A1 (de) * | 2013-12-09 | 2015-06-11 | Otto-Von-Guericke-Universität Magdeburg | Beschichtungssystem |
JP6469046B2 (ja) * | 2016-07-15 | 2019-02-13 | クアーズテック株式会社 | 縦型ウエハボート |
CN106801223B (zh) * | 2017-02-01 | 2019-04-09 | 东南大学 | 一种双热源垂直型气氛反应炉 |
US20230111655A1 (en) * | 2020-02-07 | 2023-04-13 | Kyocera Corporation | Wafer boat |
CN112831833B (zh) * | 2020-12-31 | 2024-04-09 | 中核北方核燃料元件有限公司 | 一种可定位的物料舟皿 |
CN115662928B (zh) * | 2022-11-16 | 2023-08-29 | 杭州盾源聚芯半导体科技有限公司 | 一种降低硅片损伤的硅舟 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1137807B (de) * | 1961-06-09 | 1962-10-11 | Siemens Ag | Verfahren zur Herstellung von Halbleiteranordnungen durch einkristalline Abscheidung von Halbleitermaterial aus der Gasphase |
JPS60257129A (ja) * | 1984-06-04 | 1985-12-18 | Hitachi Ltd | 膜形成装置 |
EP0164928A3 (fr) * | 1984-06-04 | 1987-07-29 | Texas Instruments Incorporated | Réacteur vertical à parois chaudes pour dépôt chimique à partir de la phase vapeur |
JPS6127625A (ja) * | 1984-07-18 | 1986-02-07 | Deisuko Saiyaa Japan:Kk | 半導体物品の熱処理方法及びこれに使用する装置 |
JPS6247134A (ja) * | 1985-08-26 | 1987-02-28 | Mitsubishi Electric Corp | 半導体製造装置 |
DE3807710A1 (de) * | 1988-03-09 | 1989-09-21 | Heraeus Schott Quarzschmelze | Traegerhorde |
TW242196B (fr) * | 1992-12-03 | 1995-03-01 | Saint Gdbain Norton Ind Ceramics Corp |
-
1994
- 1994-09-30 JP JP25980294A patent/JP2732224B2/ja not_active Expired - Fee Related
-
1995
- 1995-08-16 TW TW084108566A patent/TW290706B/zh active
- 1995-09-15 US US08/528,560 patent/US5595604A/en not_active Expired - Lifetime
- 1995-09-19 DE DE69513361T patent/DE69513361T2/de not_active Expired - Fee Related
- 1995-09-19 EP EP95306579A patent/EP0704554B1/fr not_active Expired - Lifetime
- 1995-09-21 MY MYPI95002803A patent/MY113316A/en unknown
- 1995-09-27 KR KR1019950032190A patent/KR100227915B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100227915B1 (ko) | 1999-11-01 |
TW290706B (fr) | 1996-11-11 |
EP0704554B1 (fr) | 1999-11-17 |
MY113316A (en) | 2002-01-31 |
KR960012421A (ko) | 1996-04-20 |
EP0704554A1 (fr) | 1996-04-03 |
DE69513361D1 (de) | 1999-12-23 |
JPH08102486A (ja) | 1996-04-16 |
US5595604A (en) | 1997-01-21 |
JP2732224B2 (ja) | 1998-03-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |