DE69511992D1 - Halbleiteranordnung und Verfahren zur Herstellung - Google Patents
Halbleiteranordnung und Verfahren zur HerstellungInfo
- Publication number
- DE69511992D1 DE69511992D1 DE69511992T DE69511992T DE69511992D1 DE 69511992 D1 DE69511992 D1 DE 69511992D1 DE 69511992 T DE69511992 T DE 69511992T DE 69511992 T DE69511992 T DE 69511992T DE 69511992 D1 DE69511992 D1 DE 69511992D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6269045A JPH08130267A (ja) | 1994-11-01 | 1994-11-01 | 樹脂封止型半導体パッケージ、それを用いた樹脂封止型半導体装置およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69511992D1 true DE69511992D1 (de) | 1999-10-14 |
DE69511992T2 DE69511992T2 (de) | 2000-04-20 |
Family
ID=17466913
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69511992T Expired - Fee Related DE69511992T2 (de) | 1994-11-01 | 1995-10-30 | Halbleiteranordnung und Verfahren zur Herstellung |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0711104B1 (de) |
JP (1) | JPH08130267A (de) |
KR (1) | KR100237912B1 (de) |
DE (1) | DE69511992T2 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007005670A (ja) * | 2005-06-27 | 2007-01-11 | Fujitsu Ltd | 電子部品パッケージおよび接合組立体 |
KR100867637B1 (ko) | 2006-11-10 | 2008-11-10 | 삼성전자주식회사 | 반도체 장치 및 이의 제조 방법 |
ITTO20120854A1 (it) * | 2012-09-28 | 2014-03-29 | Stmicroelectronics Malta Ltd | Contenitore a montaggio superficiale perfezionato per un dispositivo integrato a semiconduttori, relativo assemblaggio e procedimento di fabbricazione |
EP3470366B1 (de) * | 2017-10-12 | 2020-07-08 | Murata Manufacturing Co., Ltd. | Reduzierung von vibration einer mems installation auf einer leiterplatte |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2488445A1 (fr) * | 1980-08-06 | 1982-02-12 | Efcis | Boitier plastique pour circuits integres |
JPS60208847A (ja) * | 1984-04-02 | 1985-10-21 | Oki Electric Ind Co Ltd | 表面実装型icに内在する水分の排出方法 |
JPS62169450A (ja) * | 1986-01-22 | 1987-07-25 | Hitachi Ltd | 半導体装置 |
KR930009031A (ko) * | 1991-10-18 | 1993-05-22 | 김광호 | 반도체 패키지 |
US5177669A (en) * | 1992-03-02 | 1993-01-05 | Motorola, Inc. | Molded ring integrated circuit package |
JPH06209054A (ja) * | 1993-01-08 | 1994-07-26 | Mitsubishi Electric Corp | 半導体装置 |
-
1994
- 1994-11-01 JP JP6269045A patent/JPH08130267A/ja active Pending
-
1995
- 1995-10-30 EP EP95117099A patent/EP0711104B1/de not_active Expired - Lifetime
- 1995-10-30 DE DE69511992T patent/DE69511992T2/de not_active Expired - Fee Related
- 1995-11-01 KR KR1019950039251A patent/KR100237912B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE69511992T2 (de) | 2000-04-20 |
KR960019675A (ko) | 1996-06-17 |
EP0711104B1 (de) | 1999-09-08 |
KR100237912B1 (ko) | 2000-01-15 |
JPH08130267A (ja) | 1996-05-21 |
EP0711104A1 (de) | 1996-05-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |