DE69433411D1 - Herstellung einer mehrschichtigen kombinierten starr-flexiblen leiterplatte - Google Patents

Herstellung einer mehrschichtigen kombinierten starr-flexiblen leiterplatte

Info

Publication number
DE69433411D1
DE69433411D1 DE69433411T DE69433411T DE69433411D1 DE 69433411 D1 DE69433411 D1 DE 69433411D1 DE 69433411 T DE69433411 T DE 69433411T DE 69433411 T DE69433411 T DE 69433411T DE 69433411 D1 DE69433411 D1 DE 69433411D1
Authority
DE
Germany
Prior art keywords
manufacture
flexible pcb
layer combined
combined rigid
rigid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69433411T
Other languages
English (en)
Other versions
DE69433411T2 (de
Inventor
J Millette
Roland Caron
A Thoman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teledyne Technologies Inc
Original Assignee
Teledyne Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teledyne Technologies Inc filed Critical Teledyne Technologies Inc
Application granted granted Critical
Publication of DE69433411D1 publication Critical patent/DE69433411D1/de
Publication of DE69433411T2 publication Critical patent/DE69433411T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09109—Locally detached layers, e.g. in multilayer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1798—Surface bonding means and/or assemblymeans with work feeding or handling means with liquid adhesive or adhesive activator applying means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
DE69433411T 1994-03-08 1994-03-08 Herstellung einer mehrschichtigen kombinierten starr-flexiblen leiterplatte Expired - Lifetime DE69433411T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1994/002437 WO1995024821A1 (en) 1994-03-08 1994-03-08 Fabrication multilayer combined rigid/flex printed circuit board

Publications (2)

Publication Number Publication Date
DE69433411D1 true DE69433411D1 (de) 2004-01-22
DE69433411T2 DE69433411T2 (de) 2004-10-14

Family

ID=22242326

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69433411T Expired - Lifetime DE69433411T2 (de) 1994-03-08 1994-03-08 Herstellung einer mehrschichtigen kombinierten starr-flexiblen leiterplatte

Country Status (6)

Country Link
US (1) US5723205A (de)
EP (1) EP0749673B1 (de)
JP (1) JPH09510319A (de)
CA (1) CA2184373C (de)
DE (1) DE69433411T2 (de)
WO (1) WO1995024821A1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5551197A (en) * 1993-09-30 1996-09-03 Donnelly Corporation Flush-mounted articulated/hinged window assembly
US5877940A (en) * 1993-12-02 1999-03-02 Teledyne Industries Inc. Fabrication multilayer combined rigid/flex printed circuit board
US7838115B2 (en) 1995-04-11 2010-11-23 Magna Mirrors Of America, Inc. Method for manufacturing an articulatable vehicular window assembly
US5853895A (en) * 1995-04-11 1998-12-29 Donnelly Corporation Bonded vehicular glass assemblies utilizing two-component urethanes, and related methods of bonding
DE19653360A1 (de) * 1996-12-20 1998-06-25 Bosch Gmbh Robert Leiterfolie zur leitenden Verbindung von elektrischen und/oder elektronischen Baukomponenten
US6350387B2 (en) * 1997-02-14 2002-02-26 Teledyne Industries, Inc. Multilayer combined rigid/flex printed circuit board containing flexible soldermask
US6115910A (en) * 1997-05-08 2000-09-12 Lsi Logic Corporation Misregistration fidutial
KR100269947B1 (ko) * 1997-09-13 2000-10-16 윤종용 인쇄회로기판및이를이용한엘씨디모듈
JP3518992B2 (ja) * 1998-06-05 2004-04-12 ソニーケミカル株式会社 フレキシブルプリント配線板
JP2000091485A (ja) * 1998-07-14 2000-03-31 Denso Corp 半導体装置
US6020563A (en) * 1998-08-06 2000-02-01 Grok Industries, Inc. Multi-function stalk switch
DE10243637B4 (de) * 2002-09-19 2007-04-26 Ruwel Ag Leiterplatte mit mindestens einem starren und mindestens einem flexiblen Bereich sowie Verfahren zur Herstellung von starr-flexiblen Leiterplatten
SG121839A1 (en) * 2003-12-08 2006-05-26 Gul Technologies Singapore Ltd Rigid-flex printed circuit boards
JP4849908B2 (ja) * 2006-02-27 2012-01-11 株式会社フジクラ リジッド基板の接続構造
US8383230B2 (en) * 2007-05-24 2013-02-26 Arisawa Mfg. Co., Ltd. Flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board
JP2010540260A (ja) 2007-09-28 2010-12-24 トライ−スター ラミネーツ、 インク． プリント回路基板に孔を開けるための改善されたシステムおよび方法
JP2009170891A (ja) * 2007-12-07 2009-07-30 Integral Technology Inc リジッドプリント回路板用の改良された絶縁層
US9560748B2 (en) 2013-01-04 2017-01-31 Bose Corporation Flexible printed circuit
EP3947159A4 (de) 2019-03-22 2022-12-21 Northrop Grumman Systems Corporation Solarpaneelmodul
DE102021117278B4 (de) 2021-07-05 2023-05-04 Lisa Dräxlmaier GmbH Leiterplatte für ein steuergerät eines fahrzeugs und verfahren zum herstellen einer solchen leiterplatte

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3433888A (en) * 1967-01-24 1969-03-18 Electro Mechanisms Inc Dimensionally stable flexible laminate and printed circuits made therefrom
AU572615B2 (en) * 1983-12-27 1988-05-12 Sony Corporation Electrically conductive adhesive sheet circuit board and electrical connection structure
US4687695A (en) * 1985-09-27 1987-08-18 Hamby Bill L Flexible printed circuits and methods of fabricating and forming plated thru-holes therein
DE3624718A1 (de) * 1986-07-22 1988-01-28 Schoeller & Co Elektronik Mehrlagige, starre und flexible bereiche aufweisende leiterplatte
US4800461A (en) * 1987-11-02 1989-01-24 Teledyne Industries, Inc. Multilayer combined rigid and flex printed circuits
US4918812A (en) * 1988-06-29 1990-04-24 International Business Machines Corporation Processing of cores for circuit boards or cards
JPH0756909B2 (ja) * 1988-11-30 1995-06-14 新神戸電機株式会社 片面印刷回路板の製造法および製造装置ならびに前記製造に用いる金属箔張積層板
JPH02214939A (ja) * 1989-02-16 1990-08-27 Nkk Corp 推論実行システムの制御方法
JPH04154188A (ja) * 1990-10-18 1992-05-27 Cmk Corp 片面プリント配線板の製造法
US5144742A (en) * 1991-02-27 1992-09-08 Zycon Corporation Method of making rigid-flex printed circuit boards
GB9125173D0 (en) * 1991-11-27 1992-01-29 Northumbria Circuits Limited Printed circuit combination and process

Also Published As

Publication number Publication date
CA2184373A1 (en) 1995-09-14
CA2184373C (en) 2002-01-29
EP0749673B1 (de) 2003-12-10
US5723205A (en) 1998-03-03
JPH09510319A (ja) 1997-10-14
EP0749673A1 (de) 1996-12-27
WO1995024821A1 (en) 1995-09-14
DE69433411T2 (de) 2004-10-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition