SG121839A1 - Rigid-flex printed circuit boards - Google Patents

Rigid-flex printed circuit boards

Info

Publication number
SG121839A1
SG121839A1 SG200307222A SG200307222A SG121839A1 SG 121839 A1 SG121839 A1 SG 121839A1 SG 200307222 A SG200307222 A SG 200307222A SG 200307222 A SG200307222 A SG 200307222A SG 121839 A1 SG121839 A1 SG 121839A1
Authority
SG
Singapore
Prior art keywords
rigid
printed circuit
circuit boards
flex printed
flex
Prior art date
Application number
SG200307222A
Inventor
Chua Ah Lim
Original Assignee
Gul Technologies Singapore Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gul Technologies Singapore Ltd filed Critical Gul Technologies Singapore Ltd
Priority to SG200307222A priority Critical patent/SG121839A1/en
Priority to PCT/SG2004/000306 priority patent/WO2005055685A1/en
Publication of SG121839A1 publication Critical patent/SG121839A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
SG200307222A 2003-12-08 2003-12-08 Rigid-flex printed circuit boards SG121839A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SG200307222A SG121839A1 (en) 2003-12-08 2003-12-08 Rigid-flex printed circuit boards
PCT/SG2004/000306 WO2005055685A1 (en) 2003-12-08 2004-09-21 Rigid-flex printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200307222A SG121839A1 (en) 2003-12-08 2003-12-08 Rigid-flex printed circuit boards

Publications (1)

Publication Number Publication Date
SG121839A1 true SG121839A1 (en) 2006-05-26

Family

ID=34651615

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200307222A SG121839A1 (en) 2003-12-08 2003-12-08 Rigid-flex printed circuit boards

Country Status (2)

Country Link
SG (1) SG121839A1 (en)
WO (1) WO2005055685A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9190720B2 (en) 2012-03-23 2015-11-17 Apple Inc. Flexible printed circuit structures

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5004639A (en) * 1990-01-23 1991-04-02 Sheldahl, Inc. Rigid flex printed circuit configuration
US5178318A (en) * 1990-10-12 1993-01-12 Compaq Computer Corp. Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same
US5877940A (en) * 1993-12-02 1999-03-02 Teledyne Industries Inc. Fabrication multilayer combined rigid/flex printed circuit board
WO1995024821A1 (en) * 1994-03-08 1995-09-14 Teledyne Industries, Inc. Fabrication multilayer combined rigid/flex printed circuit board
WO1996038026A1 (en) * 1995-05-22 1996-11-28 Dynaco Corporation Rigid-flex printed circuit boards

Also Published As

Publication number Publication date
WO2005055685A1 (en) 2005-06-16

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