DE69429690D1 - Verfahren zur Bildung eines leitfähigen Musters auf einem Substrat - Google Patents
Verfahren zur Bildung eines leitfähigen Musters auf einem SubstratInfo
- Publication number
- DE69429690D1 DE69429690D1 DE69429690T DE69429690T DE69429690D1 DE 69429690 D1 DE69429690 D1 DE 69429690D1 DE 69429690 T DE69429690 T DE 69429690T DE 69429690 T DE69429690 T DE 69429690T DE 69429690 D1 DE69429690 D1 DE 69429690D1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- forming
- conductive pattern
- conductive
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09963—Programming circuit by using small elements, e.g. small PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13860393A JP3252534B2 (ja) | 1993-06-10 | 1993-06-10 | 基板への導電パターン形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69429690D1 true DE69429690D1 (de) | 2002-03-14 |
DE69429690T2 DE69429690T2 (de) | 2002-10-17 |
Family
ID=15225955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1994629690 Expired - Lifetime DE69429690T2 (de) | 1993-06-10 | 1994-06-07 | Verfahren zur Bildung eines leitfähigen Musters auf einem Substrat |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0629110B1 (de) |
JP (1) | JP3252534B2 (de) |
DE (1) | DE69429690T2 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3099640B2 (ja) * | 1994-06-14 | 2000-10-16 | 株式会社村田製作所 | 焼結体内蔵抵抗体の製造方法及び積層セラミック電子部品の製造方法 |
US6871396B2 (en) * | 2000-02-09 | 2005-03-29 | Matsushita Electric Industrial Co., Ltd. | Transfer material for wiring substrate |
EP2355144A1 (de) * | 2010-02-09 | 2011-08-10 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Bestückung auf flexiblen und/oder dehnbaren Substraten |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0754780B2 (ja) * | 1987-08-10 | 1995-06-07 | 株式会社村田製作所 | 積層セラミックコンデンサの製造方法 |
JPH04122093A (ja) * | 1990-09-13 | 1992-04-22 | Fujitsu Ltd | ペーストの転写方法と転写治具 |
JP2990621B2 (ja) * | 1990-11-05 | 1999-12-13 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法 |
-
1993
- 1993-06-10 JP JP13860393A patent/JP3252534B2/ja not_active Expired - Fee Related
-
1994
- 1994-06-07 EP EP19940108706 patent/EP0629110B1/de not_active Expired - Lifetime
- 1994-06-07 DE DE1994629690 patent/DE69429690T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0629110A3 (de) | 1996-04-24 |
EP0629110A2 (de) | 1994-12-14 |
JPH06350225A (ja) | 1994-12-22 |
DE69429690T2 (de) | 2002-10-17 |
EP0629110B1 (de) | 2002-01-23 |
JP3252534B2 (ja) | 2002-02-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |