DE69421872D1 - Plasmaerzeugungsverfahren und -gerät und Plasmabearbeitungsverfahren und -gerät - Google Patents
Plasmaerzeugungsverfahren und -gerät und Plasmabearbeitungsverfahren und -gerätInfo
- Publication number
- DE69421872D1 DE69421872D1 DE69421872T DE69421872T DE69421872D1 DE 69421872 D1 DE69421872 D1 DE 69421872D1 DE 69421872 T DE69421872 T DE 69421872T DE 69421872 T DE69421872 T DE 69421872T DE 69421872 D1 DE69421872 D1 DE 69421872D1
- Authority
- DE
- Germany
- Prior art keywords
- plasma
- processing method
- plasma processing
- generation method
- plasma generation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
- H01J37/32211—Means for coupling power to the plasma
- H01J37/32238—Windows
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
- H01J37/32211—Means for coupling power to the plasma
- H01J37/32247—Resonators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
- H01J37/32266—Means for controlling power transmitted to the plasma
- H01J37/32275—Microwave reflectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
- H01J37/32678—Electron cyclotron resonance
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23127493 | 1993-09-17 | ||
JP33496193 | 1993-12-28 | ||
JP13012594A JP3208995B2 (ja) | 1994-06-13 | 1994-06-13 | プラズマ処理方法及び装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69421872D1 true DE69421872D1 (de) | 2000-01-05 |
DE69421872T2 DE69421872T2 (de) | 2000-07-20 |
Family
ID=27316061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69421872T Expired - Fee Related DE69421872T2 (de) | 1993-09-17 | 1994-09-16 | Plasmaerzeugungsverfahren und -gerät und Plasmabearbeitungsverfahren und -gerät |
Country Status (5)
Country | Link |
---|---|
US (1) | US5580420A (de) |
EP (1) | EP0644575B1 (de) |
KR (1) | KR100321325B1 (de) |
DE (1) | DE69421872T2 (de) |
TW (1) | TW264601B (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5714009A (en) * | 1995-01-11 | 1998-02-03 | Deposition Sciences, Inc. | Apparatus for generating large distributed plasmas by means of plasma-guided microwave power |
JPH0936198A (ja) | 1995-07-19 | 1997-02-07 | Hitachi Ltd | 真空処理装置およびそれを用いた半導体製造ライン |
JP3368159B2 (ja) * | 1996-11-20 | 2003-01-20 | 東京エレクトロン株式会社 | プラズマ処理装置 |
US6066568A (en) * | 1997-05-14 | 2000-05-23 | Tokyo Electron Limited | Plasma treatment method and system |
ATE267890T1 (de) * | 1997-06-13 | 2004-06-15 | Unaxis Trading Ag | Verfahren zur herstellung von werkstücken, die mit einer epitaktischen schicht beschichtet sind |
WO1999019526A2 (en) * | 1997-10-15 | 1999-04-22 | Tokyo Electron Limited | Apparatus and method for adjusting density distribution of a plasma |
DE10010766B4 (de) * | 2000-03-04 | 2006-11-30 | Schott Ag | Verfahren und Vorrichtung zur Beschichtung von insbesondere gekrümmten Substraten |
TW551782U (en) * | 2002-10-09 | 2003-09-01 | Ind Tech Res Inst | Microwave plasma processing device |
CN100447297C (zh) * | 2003-04-16 | 2008-12-31 | 东洋制罐株式会社 | 微波等离子体处理方法 |
KR20050079860A (ko) * | 2004-02-07 | 2005-08-11 | 삼성전자주식회사 | 마이크로 웨이브 공급장치, 이를 이용한 플라즈마공정장치 및 플라즈마 공정방법 |
US8647434B2 (en) | 2005-02-28 | 2014-02-11 | Sulzer Metco Ag | System and process for high-density, low-energy plasma enhanced vapor phase epitaxy |
US8006640B2 (en) | 2006-03-27 | 2011-08-30 | Tokyo Electron Limited | Plasma processing apparatus and plasma processing method |
JP4585574B2 (ja) * | 2008-02-26 | 2010-11-24 | 東京エレクトロン株式会社 | プラズマ処理装置およびプラズマ処理方法 |
CN102171795A (zh) * | 2008-10-03 | 2011-08-31 | 维易科加工设备股份有限公司 | 气相外延系统 |
US20120186747A1 (en) * | 2011-01-26 | 2012-07-26 | Obama Shinji | Plasma processing apparatus |
US9763287B2 (en) * | 2011-11-30 | 2017-09-12 | Michael R. Knox | Single mode microwave device for producing exfoliated graphite |
JP2014154421A (ja) * | 2013-02-12 | 2014-08-25 | Tokyo Electron Ltd | プラズマ処理装置、プラズマ処理方法、および高周波発生器 |
JP2014157758A (ja) * | 2013-02-18 | 2014-08-28 | Sumitomo Heavy Ind Ltd | マイクロ波イオン源及びその起動方法 |
JP2014160557A (ja) * | 2013-02-19 | 2014-09-04 | Tokyo Electron Ltd | プラズマ処理装置 |
KR101427720B1 (ko) * | 2013-03-27 | 2014-08-13 | (주)트리플코어스코리아 | 단차부 및 블록부를 이용한 플라즈마 도파관 |
US10950421B2 (en) * | 2014-04-21 | 2021-03-16 | Lam Research Corporation | Using modeling for identifying a location of a fault in an RF transmission system for a plasma system |
JP2016009711A (ja) * | 2014-06-23 | 2016-01-18 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
US11328931B1 (en) * | 2021-02-12 | 2022-05-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of manufacturing a semiconductor device |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62294181A (ja) * | 1986-06-13 | 1987-12-21 | Canon Inc | マイクロ波プラズマcvd法による機能性堆積膜の形成方法及び装置 |
US4866346A (en) * | 1987-06-22 | 1989-09-12 | Applied Science & Technology, Inc. | Microwave plasma generator |
JPH01107538A (ja) * | 1987-10-21 | 1989-04-25 | Hitachi Ltd | マイクロ波プラズマ処理方法及び装置 |
KR960014434B1 (ko) * | 1987-12-09 | 1996-10-15 | 후세 노보루 | 플라즈마 처리장치 |
KR900013579A (ko) * | 1989-02-15 | 1990-09-06 | 미다 가쓰시게 | 마이크로파 플라즈마 처리방법 및 장치 |
JPH02230728A (ja) * | 1989-03-03 | 1990-09-13 | Hitachi Ltd | プラズマ処理方法及び装置 |
EP0395415B1 (de) * | 1989-04-27 | 1995-03-15 | Fujitsu Limited | Gerät und Verfahren zur Bearbeitung einer Halbleitervorrichtung unter Verwendung eines durch Mikrowellen erzeugten Plasmas |
JP2595128B2 (ja) * | 1990-10-31 | 1997-03-26 | 株式会社日立製作所 | マイクロ波プラズマ処理装置 |
-
1994
- 1994-09-13 TW TW083108449A patent/TW264601B/zh active
- 1994-09-13 KR KR1019940022983A patent/KR100321325B1/ko not_active IP Right Cessation
- 1994-09-16 DE DE69421872T patent/DE69421872T2/de not_active Expired - Fee Related
- 1994-09-16 EP EP94114598A patent/EP0644575B1/de not_active Expired - Lifetime
- 1994-09-16 US US08/307,272 patent/US5580420A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5580420A (en) | 1996-12-03 |
KR950010714A (ko) | 1995-04-28 |
TW264601B (de) | 1995-12-01 |
EP0644575B1 (de) | 1999-12-01 |
EP0644575A1 (de) | 1995-03-22 |
KR100321325B1 (ko) | 2002-06-20 |
DE69421872T2 (de) | 2000-07-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |