DE69412996D1 - Verfahren zur lokalen härtung eines klebstoffes für eine integrierte halbleiterschaltung - Google Patents

Verfahren zur lokalen härtung eines klebstoffes für eine integrierte halbleiterschaltung

Info

Publication number
DE69412996D1
DE69412996D1 DE69412996T DE69412996T DE69412996D1 DE 69412996 D1 DE69412996 D1 DE 69412996D1 DE 69412996 T DE69412996 T DE 69412996T DE 69412996 T DE69412996 T DE 69412996T DE 69412996 D1 DE69412996 D1 DE 69412996D1
Authority
DE
Germany
Prior art keywords
adhesive
semiconductor circuit
integrated semiconductor
locally curing
locally
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69412996T
Other languages
English (en)
Other versions
DE69412996T2 (de
Inventor
Soung-Ju Samsung Electroni Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of DE69412996D1 publication Critical patent/DE69412996D1/de
Application granted granted Critical
Publication of DE69412996T2 publication Critical patent/DE69412996T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
DE69412996T 1993-09-22 1994-09-22 Verfahren zur lokalen härtung eines klebstoffes für eine integrierte halbleiterschaltung Expired - Fee Related DE69412996T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019930019264A KR0141229B1 (ko) 1993-09-22 1993-09-22 국부 경화방법
PCT/KR1994/000127 WO1995009521A1 (en) 1993-09-22 1994-09-22 Local hardening method of a semiconductor integrated circuit

Publications (2)

Publication Number Publication Date
DE69412996D1 true DE69412996D1 (de) 1998-10-08
DE69412996T2 DE69412996T2 (de) 1999-01-14

Family

ID=19364222

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69412996T Expired - Fee Related DE69412996T2 (de) 1993-09-22 1994-09-22 Verfahren zur lokalen härtung eines klebstoffes für eine integrierte halbleiterschaltung

Country Status (7)

Country Link
EP (1) EP0670103B1 (de)
JP (1) JP3623961B2 (de)
KR (1) KR0141229B1 (de)
DE (1) DE69412996T2 (de)
RU (1) RU2130699C1 (de)
TW (1) TW301038B (de)
WO (1) WO1995009521A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2481754C1 (ru) * 2011-09-13 2013-05-10 Открытое акционерное общество "Научно-производственный комплекс "ЭЛАРА" имени Г.А. Ильенко" (ОАО "ЭЛАРА") Печатная плата на металлической подложке и способ ее изготовления

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55127098A (en) * 1979-03-09 1980-10-01 Matsushita Electric Ind Co Ltd Method of mounting electronic part
DE3675734D1 (de) * 1985-09-30 1991-01-03 Siemens Ag Bauelement fuer die oberflaechenmontage und verfahren zur befestigung eines bauelements fuer die oberflaechenmontage.
DE3806738C1 (de) * 1988-03-02 1989-09-07 Espe Stiftung & Co Produktions- Und Vertriebs Kg, 8031 Seefeld, De
EP0378233B1 (de) * 1989-01-13 1994-12-28 Matsushita Electric Industrial Co., Ltd. Kleberzusammensetzung zur Verwendung beim Montieren von elektronischen Bauteilen und Verfahren zum Montieren von elektronischen Bauteilen auf eine Leiterplatte unter Verwendung des Klebers

Also Published As

Publication number Publication date
KR950009992A (ko) 1995-04-26
JP2001526829A (ja) 2001-12-18
RU2130699C1 (ru) 1999-05-20
JP3623961B2 (ja) 2005-02-23
EP0670103A1 (de) 1995-09-06
WO1995009521A1 (en) 1995-04-06
TW301038B (de) 1997-03-21
DE69412996T2 (de) 1999-01-14
KR0141229B1 (ko) 1998-07-15
RU95113457A (ru) 1997-02-20
EP0670103B1 (de) 1998-09-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee