DE69412678T2 - Verbesserte Mehrschichtverpackung - Google Patents

Verbesserte Mehrschichtverpackung

Info

Publication number
DE69412678T2
DE69412678T2 DE69412678T DE69412678T DE69412678T2 DE 69412678 T2 DE69412678 T2 DE 69412678T2 DE 69412678 T DE69412678 T DE 69412678T DE 69412678 T DE69412678 T DE 69412678T DE 69412678 T2 DE69412678 T2 DE 69412678T2
Authority
DE
Germany
Prior art keywords
multilayer packaging
improved multilayer
improved
packaging
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69412678T
Other languages
English (en)
Other versions
DE69412678D1 (de
Inventor
Steve Boyle
Robert J Proebsting
William H Herndon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intergraph Corp
Original Assignee
Intergraph Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intergraph Corp filed Critical Intergraph Corp
Application granted granted Critical
Publication of DE69412678D1 publication Critical patent/DE69412678D1/de
Publication of DE69412678T2 publication Critical patent/DE69412678T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

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    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T29/00—Metal working
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    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
DE69412678T 1993-03-24 1994-03-23 Verbesserte Mehrschichtverpackung Expired - Fee Related DE69412678T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/036,564 US5338970A (en) 1993-03-24 1993-03-24 Multi-layered integrated circuit package with improved high frequency performance

Publications (2)

Publication Number Publication Date
DE69412678D1 DE69412678D1 (de) 1998-10-01
DE69412678T2 true DE69412678T2 (de) 1999-04-01

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
DE69431678T Expired - Fee Related DE69431678T2 (de) 1993-03-24 1994-03-23 Verbesserte Mehrschichtverpackung
DE69412678T Expired - Fee Related DE69412678T2 (de) 1993-03-24 1994-03-23 Verbesserte Mehrschichtverpackung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69431678T Expired - Fee Related DE69431678T2 (de) 1993-03-24 1994-03-23 Verbesserte Mehrschichtverpackung

Country Status (4)

Country Link
US (2) US5338970A (de)
EP (2) EP0834922B1 (de)
JP (1) JP3530920B2 (de)
DE (2) DE69431678T2 (de)

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US5543586A (en) * 1994-03-11 1996-08-06 The Panda Project Apparatus having inner layers supporting surface-mount components
DE59608615D1 (de) * 1995-10-16 2002-02-28 Siemens Nv Polymeres höcker-matrix-gehäuse für mikrowellen-schaltungsanordnungen
FR2747235B1 (fr) * 1996-04-03 1998-07-10 Bull Sa Boitier de circuit integre
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US6054758A (en) * 1996-12-18 2000-04-25 Texas Instruments Incorporated Differential pair geometry for integrated circuit chip packages
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US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
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US5874778A (en) * 1997-06-11 1999-02-23 International Business Machines Corporation Embedded power and ground plane structure
US5977850A (en) * 1997-11-05 1999-11-02 Motorola, Inc. Multilayer ceramic package with center ground via for size reduction
US6242767B1 (en) * 1997-11-10 2001-06-05 Lightspeed Semiconductor Corp. Asic routing architecture
US5990752A (en) * 1998-05-14 1999-11-23 Cts Corporation Method for mechanically tuning a voltage controlled oscillator
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JPH07169880A (ja) 1995-07-04
EP0834922B1 (de) 2002-11-06
EP0617466B1 (de) 1998-08-26
EP0617466A2 (de) 1994-09-28
DE69431678T2 (de) 2003-09-18
EP0834922A2 (de) 1998-04-08
US5499445A (en) 1996-03-19
DE69412678D1 (de) 1998-10-01
JP3530920B2 (ja) 2004-05-24
US5338970A (en) 1994-08-16
EP0834922A3 (de) 1998-04-15
EP0617466A3 (de) 1994-11-30
DE69431678D1 (de) 2002-12-12

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