DE69408782D1 - Abschirmungsanordnung - Google Patents

Abschirmungsanordnung

Info

Publication number
DE69408782D1
DE69408782D1 DE69408782T DE69408782T DE69408782D1 DE 69408782 D1 DE69408782 D1 DE 69408782D1 DE 69408782 T DE69408782 T DE 69408782T DE 69408782 T DE69408782 T DE 69408782T DE 69408782 D1 DE69408782 D1 DE 69408782D1
Authority
DE
Germany
Prior art keywords
shielding arrangement
shielding
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69408782T
Other languages
English (en)
Other versions
DE69408782T2 (de
Inventor
Albert Michael Benzoni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Application granted granted Critical
Publication of DE69408782D1 publication Critical patent/DE69408782D1/de
Publication of DE69408782T2 publication Critical patent/DE69408782T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0037—Housings with compartments containing a PCB, e.g. partitioning walls
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S174/00—Electricity: conductors and insulators
    • Y10S174/35—Box or housing mounted on substrate or PCB

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)
DE69408782T 1993-11-09 1994-11-02 Abschirmungsanordnung Expired - Lifetime DE69408782T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/149,422 US5416668A (en) 1993-11-09 1993-11-09 Shielded member

Publications (2)

Publication Number Publication Date
DE69408782D1 true DE69408782D1 (de) 1998-04-09
DE69408782T2 DE69408782T2 (de) 1998-07-02

Family

ID=22530204

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69408782T Expired - Lifetime DE69408782T2 (de) 1993-11-09 1994-11-02 Abschirmungsanordnung

Country Status (4)

Country Link
US (1) US5416668A (de)
EP (1) EP0652696B1 (de)
JP (1) JP2854254B2 (de)
DE (1) DE69408782T2 (de)

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DE4340108C3 (de) * 1993-11-22 2003-08-14 Emi Tec Elektronische Material Abschirmelement und Verfahren zu dessen Herstellung
TW390112B (en) * 1994-08-31 2000-05-11 Ibm Conductive insert for providing electromagnetic discharge and radio frequency interference protection
US5608188A (en) * 1994-09-02 1997-03-04 Motorola, Inc. Multi compartment electromagnetic energy shield
JP3011944U (ja) * 1994-12-01 1995-06-06 船井電機株式会社 電気機器
KR0175000B1 (ko) * 1994-12-14 1999-02-01 윤종용 전자파 억제구조를 갖는 반도체 소자
US6220878B1 (en) * 1995-10-04 2001-04-24 Methode Electronics, Inc. Optoelectronic module with grounding means
US5546281A (en) * 1995-01-13 1996-08-13 Methode Electronics, Inc. Removable optoelectronic transceiver module with potting box
US5734558A (en) * 1995-01-13 1998-03-31 Poplawski; Daniel S. Removable optoelectronic module
US5717533A (en) * 1995-01-13 1998-02-10 Methode Electronics Inc. Removable optoelectronic module
US5879173A (en) * 1995-01-13 1999-03-09 Methode Electronics, Inc. Removable transceiver module and receptacle
GB2299463B (en) * 1995-03-20 1997-06-04 Woven Electronics Corp Computer I/O support bracket and cable assembly
SE504812C2 (sv) * 1995-08-21 1997-04-28 Ericsson Telefon Ab L M Optomodul
US6072613A (en) * 1995-08-21 2000-06-06 Telefonaktiebolaget Lm Ericsson Opto module
FR2759847B1 (fr) * 1997-02-14 1999-05-07 Egide Sa Boitier opto-electronique a insert ceramique
SE9800488L (sv) * 1998-02-19 1999-08-20 Nolato Silikonteknik Ab Skärmning
US6369924B1 (en) 1998-04-20 2002-04-09 Stratos Lightwave, Inc. Optical transceiver with enhanced shielding and related methods
US6203333B1 (en) 1998-04-22 2001-03-20 Stratos Lightwave, Inc. High speed interface converter module
US6179627B1 (en) 1998-04-22 2001-01-30 Stratos Lightwave, Inc. High speed interface converter module
JP2000236189A (ja) * 1999-02-16 2000-08-29 Minebea Co Ltd 航空機用電子回路のシールド装置
US6213651B1 (en) 1999-05-26 2001-04-10 E20 Communications, Inc. Method and apparatus for vertical board construction of fiber optic transmitters, receivers and transceivers
US7013088B1 (en) 1999-05-26 2006-03-14 Jds Uniphase Corporation Method and apparatus for parallel optical interconnection of fiber optic transmitters, receivers and transceivers
US6873800B1 (en) 1999-05-26 2005-03-29 Jds Uniphase Corporation Hot pluggable optical transceiver in a small form pluggable package
US6952532B2 (en) * 1999-05-27 2005-10-04 Jds Uniphase Corporation Method and apparatus for multiboard fiber optic modules and fiber optic module arrays
US20020030872A1 (en) * 1999-05-27 2002-03-14 Edwin Dair Method and apparatus for multiboard fiber optic modules and fiber optic module arrays
US6632030B2 (en) 1999-05-27 2003-10-14 E20 Communications, Inc. Light bending optical block for fiber optic modules
US20040069997A1 (en) * 1999-05-27 2004-04-15 Edwin Dair Method and apparatus for multiboard fiber optic modules and fiber optic module arrays
US20010030789A1 (en) * 1999-05-27 2001-10-18 Wenbin Jiang Method and apparatus for fiber optic modules
US20020033979A1 (en) * 1999-05-27 2002-03-21 Edwin Dair Method and apparatus for multiboard fiber optic modules and fiber optic module arrays
US20010048793A1 (en) * 1999-05-27 2001-12-06 Edwin Dair Method and apparatus for multiboard fiber optic modules and fiber optic module arrays
US7116912B2 (en) * 1999-05-27 2006-10-03 Jds Uniphase Corporation Method and apparatus for pluggable fiber optic modules
US6220873B1 (en) 1999-08-10 2001-04-24 Stratos Lightwave, Inc. Modified contact traces for interface converter
CN1409942A (zh) * 1999-10-12 2003-04-09 电子设备屏蔽公司 Emi屏蔽设备
JP3069773U (ja) * 1999-12-20 2000-06-30 船井電機株式会社 光ディスク装置
DE10001873B4 (de) * 2000-01-18 2010-06-02 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optische Sende- und Empfangsvorrichtung
US6540412B2 (en) * 2000-02-10 2003-04-01 Sumitomo Electric Industries, Ltd. Optical transceiver
US6445583B1 (en) * 2001-01-26 2002-09-03 Laird Technologies, Inc. Snap in heat sink shielding lid
US6607308B2 (en) 2001-02-12 2003-08-19 E20 Communications, Inc. Fiber-optic modules with shielded housing/covers having mixed finger types
US6659655B2 (en) 2001-02-12 2003-12-09 E20 Communications, Inc. Fiber-optic modules with housing/shielding
US6894903B2 (en) * 2001-02-28 2005-05-17 Sumitomo Electric Industries, Ltd. Optical data link
TW529181B (en) * 2001-02-28 2003-04-21 Sumitomo Electric Industries Optical data connector
EP1246516A1 (de) * 2001-03-26 2002-10-02 Lucent Technologies Inc. Vorrichtung zur elektromagnetischen Abschirmung von elektrischen Baugruppen und Verfahren zum Montieren von Abschirmungen bei elektrischen Baugruppen
US20030235375A1 (en) * 2002-06-25 2003-12-25 Kamath Kishore K. Transceivers with improved cross talk
US7130194B2 (en) * 2002-10-31 2006-10-31 Finisar Corporation Multi-board optical transceiver
AU2003287202A1 (en) * 2002-11-26 2004-06-18 Parker-Hannifin Corporation Tubular polymeric composites for tubing and hose constructions
WO2004057709A1 (en) * 2002-12-20 2004-07-08 Fci Shielding cage
US7005573B2 (en) * 2003-02-13 2006-02-28 Parker-Hannifin Corporation Composite EMI shield
US7326862B2 (en) * 2003-02-13 2008-02-05 Parker-Hannifin Corporation Combination metal and plastic EMI shield
GB0328246D0 (en) * 2003-12-04 2004-06-16 Qinetiq Ltd Improvements relating to electronic circuit packages
TWM257084U (en) * 2004-03-15 2005-02-11 Darfon Electronics Corp Fixing apparatus
JP4453509B2 (ja) * 2004-10-05 2010-04-21 パナソニック株式会社 シールドケースを装着された高周波モジュールとこの高周波モジュールを用いた電子機器
EP1722258A1 (de) * 2005-05-13 2006-11-15 STMicroelectronics S.r.l. Kopplungsmodul für optische Strahlung
US20060280889A1 (en) * 2005-06-10 2006-12-14 Powell Steven M Tubular nylon alloy members for tubing and hose constructions
US20080080160A1 (en) * 2005-12-16 2008-04-03 Laird Technologies, Inc. Emi shielding assemblies
US7262369B1 (en) 2006-03-09 2007-08-28 Laird Technologies, Inc. Combined board level EMI shielding and thermal management
US7355857B2 (en) * 2006-02-07 2008-04-08 Methode Electronics, Inc. Heat sink gasket
US7317618B2 (en) * 2006-03-09 2008-01-08 Laird Technologies, Inc. Combined board level shielding and thermal management
US7623360B2 (en) * 2006-03-09 2009-11-24 Laird Technologies, Inc. EMI shielding and thermal management assemblies including frames and covers with multi-position latching
US7463496B2 (en) * 2006-03-09 2008-12-09 Laird Technologies, Inc. Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith
US7772505B2 (en) * 2008-02-22 2010-08-10 Laird Technologies, Inc. Electromagnetic interference (EMI) shielding apparatus and related methods
US7965514B2 (en) 2009-06-05 2011-06-21 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
US20120155053A1 (en) * 2009-08-26 2012-06-21 Yuichiro Nara Case for electronic components
JP5567412B2 (ja) * 2010-06-28 2014-08-06 日本オクラロ株式会社 光トランシーバおよび電子装置
US9380357B2 (en) * 2010-10-28 2016-06-28 Afl Telecommunications Llc Universal network interface device base module
GB2496835B (en) 2011-09-23 2015-12-30 Radio Physics Solutions Ltd Package for high frequency circuits
KR20130035675A (ko) * 2011-09-30 2013-04-09 삼성전기주식회사 튜너 모듈
JP5780148B2 (ja) * 2011-12-16 2015-09-16 富士通オプティカルコンポーネンツ株式会社 光送受信器、及び光送受信器の製造方法

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US4404125A (en) * 1981-10-14 1983-09-13 General Electric Company Polyphenylene ether resin compositions for EMI electromagnetic interference shielding
JPS5887896A (ja) * 1981-11-20 1983-05-25 アルプス電気株式会社 高周波回路機器の組立構造
US4435031A (en) * 1982-01-07 1984-03-06 Holmberg Electronics Corporation Connector block with snap latch
US4474685A (en) * 1982-03-29 1984-10-02 Occidental Chemical Corporation High performance molding compounds for shielding electromagnetic interference
US4618915A (en) * 1984-12-17 1986-10-21 Illinois Tool Works Inc. Support member for electrical components
DE8604884U1 (de) * 1986-02-22 1986-05-22 Valentin, Michael, 3544 Waldeck Hochfrequenzdichtes Gehäuse für elektrotechnische Zwecke, insbesondere für einen Hausübergabepunkt
US4754101A (en) * 1986-10-23 1988-06-28 Instrument Specialties Co., Inc. Electromagnetic shield for printed circuit board
JPH062316Y2 (ja) * 1988-07-08 1994-01-19 アルプス電気株式会社 シールドケースの底面カバー取付構造
JP2612339B2 (ja) * 1989-04-18 1997-05-21 三菱電機株式会社 電子機器筐体
EP0472587A4 (en) * 1989-05-19 1993-01-20 E.I. Du Pont De Nemours And Company (A Delaware Corporation) Housing for an opto-electronic device
US5047835A (en) * 1989-12-26 1991-09-10 At&T Bell Laboratories Lightwave packaging for pairs of optical devices
JPH04343499A (ja) * 1991-05-21 1992-11-30 Matsushita Electric Ind Co Ltd シールドケース
JP2517505B2 (ja) * 1991-11-29 1996-07-24 日本写真印刷株式会社 電磁波遮蔽成形体の製造方法

Also Published As

Publication number Publication date
JPH07183681A (ja) 1995-07-21
EP0652696B1 (de) 1998-03-04
JP2854254B2 (ja) 1999-02-03
DE69408782T2 (de) 1998-07-02
US5416668A (en) 1995-05-16
EP0652696A1 (de) 1995-05-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition