DE69402895D1 - Ein Weichlot mit verbesserten mechanischen Eigenschaften, enthaltendes Gegenstand und Verfahren zur Herstellung dieses Weichlot - Google Patents
Ein Weichlot mit verbesserten mechanischen Eigenschaften, enthaltendes Gegenstand und Verfahren zur Herstellung dieses WeichlotInfo
- Publication number
- DE69402895D1 DE69402895D1 DE69402895T DE69402895T DE69402895D1 DE 69402895 D1 DE69402895 D1 DE 69402895D1 DE 69402895 T DE69402895 T DE 69402895T DE 69402895 T DE69402895 T DE 69402895T DE 69402895 D1 DE69402895 D1 DE 69402895D1
- Authority
- DE
- Germany
- Prior art keywords
- soft solder
- producing
- mechanical properties
- improved mechanical
- containing article
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/268—Pb as the principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0215—Metallic fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10719—Land grid array [LGA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12007—Component of composite having metal continuous phase interengaged with nonmetal continuous phase
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/021,005 US5346775A (en) | 1993-02-22 | 1993-02-22 | Article comprising solder with improved mechanical properties |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69402895D1 true DE69402895D1 (de) | 1997-06-05 |
DE69402895T2 DE69402895T2 (de) | 1997-11-06 |
Family
ID=21801795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69402895T Expired - Fee Related DE69402895T2 (de) | 1993-02-22 | 1994-02-09 | Ein Weichlot mit verbesserten mechanischen Eigenschaften, enthaltendes Gegenstand und Verfahren zur Herstellung dieses Weichlot |
Country Status (7)
Country | Link |
---|---|
US (1) | US5346775A (de) |
EP (1) | EP0612577B1 (de) |
JP (1) | JP2695611B2 (de) |
KR (1) | KR100323163B1 (de) |
DE (1) | DE69402895T2 (de) |
MX (1) | MX9401269A (de) |
SG (1) | SG43782A1 (de) |
Families Citing this family (64)
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US5641454A (en) * | 1992-03-13 | 1997-06-24 | Toyota Jidosha Kabushiki Kaisha | Composite material having anti-wear property and process for producing the same |
DE69326009T2 (de) * | 1993-11-02 | 2000-02-24 | Koninklijke Philips Electronics N.V., Eindhoven | Verfahren zur Lotbeschichtung und Lötpaste dafür |
EP0704272B1 (de) * | 1994-09-30 | 2002-01-09 | AT&T Corp. | Bleifreie Legierungen zum Weichlöten |
DE4443459C2 (de) * | 1994-12-07 | 1996-11-21 | Wieland Werke Ag | Bleifreies Weichlot und seine Verwendung |
FR2728395A1 (fr) * | 1994-12-16 | 1996-06-21 | Eurocopter France | Element en materiau composite avec assemblage(s) de continuite electrique a travers l'element, son procede de fabrication et son utilisation en aeronautique |
US6216541B1 (en) * | 1995-12-13 | 2001-04-17 | Dresser Industries, Inc. | Pressure gauge overpressure safety release |
US6147870A (en) * | 1996-01-05 | 2000-11-14 | Honeywell International Inc. | Printed circuit assembly having locally enhanced wiring density |
US5839188A (en) | 1996-01-05 | 1998-11-24 | Alliedsignal Inc. | Method of manufacturing a printed circuit assembly |
DE69701277T2 (de) * | 1996-12-03 | 2000-08-31 | Lucent Technologies Inc., Murray Hill | Gegenstand mit dispergierten Teilchen enthaltendes feinkörniges Weichlot |
US6179935B1 (en) * | 1997-04-16 | 2001-01-30 | Fuji Electric Co., Ltd. | Solder alloys |
US5973405A (en) * | 1997-07-22 | 1999-10-26 | Dytak Corporation | Composite electrical contact structure and method for manufacturing the same |
US6156132A (en) * | 1998-02-05 | 2000-12-05 | Fuji Electric Co., Ltd. | Solder alloys |
US6205264B1 (en) * | 1998-04-14 | 2001-03-20 | Lucent Technologies Inc. | Optical assembly with improved dimensional stability |
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CN101001716B (zh) * | 2004-06-08 | 2012-07-04 | 千住金属工业株式会社 | 高熔点金属粒分散成形焊料的制造方法 |
JP4911933B2 (ja) * | 2005-08-31 | 2012-04-04 | サーパス工業株式会社 | 圧力計および圧力計組立体 |
US10081852B2 (en) * | 2005-09-15 | 2018-09-25 | Senju Metal Industry Co., Ltd. | Solder preform and a process for its manufacture |
GB0605884D0 (en) | 2006-03-24 | 2006-05-03 | Pilkington Plc | Electrical connector |
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US20070227627A1 (en) * | 2006-03-30 | 2007-10-04 | Daewoong Suh | Solder composition having dispersoid particles for increased creep resistance |
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US7703661B2 (en) * | 2007-05-23 | 2010-04-27 | International Business Machines Corporation | Method and process for reducing undercooling in a lead-free tin-rich solder alloy |
US20100068552A1 (en) * | 2008-03-31 | 2010-03-18 | Infineon Technologies Ag | Module including a stable solder joint |
US7878387B2 (en) * | 2009-05-07 | 2011-02-01 | GM Global Technology Operations LLC | Magnetic particle containing material for fastening together parts or substrates |
US20110079630A1 (en) * | 2009-10-07 | 2011-04-07 | Babcock & Wilcox Technical Services Y-12, Llc | System for reducing metallic whisker formation |
DE102009054068A1 (de) * | 2009-11-20 | 2011-05-26 | Epcos Ag | Lotmaterial zur Befestigung einer Außenelektrode bei einem piezoelektrischen Bauelement und piezoelektrisches Bauelement mit einem Lotmaterial |
JP5521584B2 (ja) * | 2010-01-28 | 2014-06-18 | Tdk株式会社 | Pbフリーはんだ及び電子部品内蔵モジュール |
WO2011106421A2 (en) * | 2010-02-24 | 2011-09-01 | Ramirez Ainissa G | Low melting temperature alloys with magnetic dispersions |
CN102198566B (zh) * | 2010-03-22 | 2013-03-20 | 王宣胜 | 铁粉锡基复合焊锡合金球及其覆晶植球的方法 |
US9847308B2 (en) | 2010-04-28 | 2017-12-19 | Intel Corporation | Magnetic intermetallic compound interconnect |
US8939347B2 (en) | 2010-04-28 | 2015-01-27 | Intel Corporation | Magnetic intermetallic compound interconnect |
US8434668B2 (en) | 2010-05-12 | 2013-05-07 | Intel Corporation | Magnetic attachment structure |
US8313958B2 (en) * | 2010-05-12 | 2012-11-20 | Intel Corporation | Magnetic microelectronic device attachment |
US8609532B2 (en) | 2010-05-26 | 2013-12-17 | Intel Corporation | Magnetically sintered conductive via |
US8308052B2 (en) * | 2010-11-24 | 2012-11-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Thermal gradient reflow for forming columnar grain structures for solder bumps |
JP5741137B2 (ja) * | 2011-03-30 | 2015-07-01 | Tdk株式会社 | 電子回路モジュール部品 |
CN102166690A (zh) * | 2011-05-27 | 2011-08-31 | 东南大学 | 一种锡-锌基复合焊料 |
CN102513719A (zh) * | 2011-11-17 | 2012-06-27 | 东南大学 | 一种磁性颗粒锡-锌基复合焊料及其制备方法 |
US20130199831A1 (en) * | 2012-02-06 | 2013-08-08 | Christopher Morris | Electromagnetic field assisted self-assembly with formation of electrical contacts |
CN103071942A (zh) * | 2013-01-05 | 2013-05-01 | 张家港市东大工业技术研究院 | 一种原位合成磁性相颗粒的低温焊料基复合焊料及其制备方法 |
US9142475B2 (en) * | 2013-08-13 | 2015-09-22 | Intel Corporation | Magnetic contacts |
US9472523B2 (en) | 2014-01-14 | 2016-10-18 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and manufacturing method thereof |
KR101639614B1 (ko) * | 2014-08-29 | 2016-07-15 | 한국기계연구원 | 다종 나노/마이크로 솔더 및 이의 제조방법 |
CN107073452B (zh) | 2014-10-20 | 2020-07-03 | 托普索公司 | 用于从甲烷和氨催化制备氰化氢的方法 |
KR102379931B1 (ko) * | 2015-12-17 | 2022-03-30 | 한국재료연구원 | 가스분무법을 이용한 자성솔더 복합분말의 제조방법 및 이에 의하여 제조되는 자성솔더 복합분말 |
CN108788355B (zh) * | 2017-04-27 | 2021-05-25 | 河北宇天材料科技有限公司 | 焊料可用电场驱动的焊接方法和应用 |
US10515901B2 (en) * | 2017-09-29 | 2019-12-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | InFO-POP structures with TIVs having cavities |
US10978415B2 (en) * | 2019-07-01 | 2021-04-13 | Semiconductor Components Industries, Llc | Semiconductor package having magnetic interconnects and related methods |
US20220402057A1 (en) | 2019-11-26 | 2022-12-22 | Senju Metal Industry Co., Ltd. | Magnetic-field melting solder, and joining method in which same is used |
DE112020004685B4 (de) * | 2019-11-26 | 2024-07-25 | National Institute Of Advanced Industrial Science And Technology | Vorformlötmittel und verbindungsverfahren unter verwendung desselben |
US11826858B2 (en) * | 2020-10-18 | 2023-11-28 | Mesoglue, Inc. | Amalgamation preform |
US11819953B2 (en) * | 2020-10-18 | 2023-11-21 | Mesoglue, Inc | Method of using amalgamation preform |
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CN114131237A (zh) * | 2021-12-14 | 2022-03-04 | 浙江亚通焊材有限公司 | 一种泡沫焊锡及其制备方法 |
JP7390591B1 (ja) * | 2022-07-22 | 2023-12-04 | 浩二 尊田 | パワーデバイスの接合方法 |
EP4311624A1 (de) * | 2022-07-26 | 2024-01-31 | Siemens Aktiengesellschaft | Verfahren zum aufschmelzen eines lotmaterials in magnetischen wechselfeldern |
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DE2916299A1 (de) * | 1979-04-21 | 1980-10-23 | Messerschmitt Boelkow Blohm | Verfahren zum herstellen eines verbundwerkstoffes |
GB2103980B (en) * | 1981-08-18 | 1986-01-22 | Standard Telephones Cables Ltd | Soldering components to a substrate |
JPS59193090A (ja) * | 1983-04-15 | 1984-11-01 | 富士通株式会社 | 半導体装置の実装方法 |
US4663242A (en) * | 1983-05-27 | 1987-05-05 | Olin Corporation | Method for producing a metal alloy strip |
SU1383517A1 (ru) * | 1985-11-05 | 1988-03-23 | Предприятие П/Я В-8215 | Способ пайки навесных радиоэлементов на печатной плате |
JPS6338293A (ja) * | 1986-08-04 | 1988-02-18 | ソニー株式会社 | 部品の半田付け方法 |
JPS63112091A (ja) * | 1986-10-29 | 1988-05-17 | Nippon Arumitsuto Kk | 強磁性はんだ |
JPH0746626B2 (ja) * | 1987-01-12 | 1995-05-17 | 株式会社日立製作所 | 接合用材料 |
US5134039A (en) * | 1988-04-11 | 1992-07-28 | Leach & Garner Company | Metal articles having a plurality of ultrafine particles dispersed therein |
US5093545A (en) * | 1988-09-09 | 1992-03-03 | Metcal, Inc. | Method, system and composition for soldering by induction heating |
JPH02281742A (ja) * | 1989-04-24 | 1990-11-19 | Origin Electric Co Ltd | 半導体デバイスおよび整列方法 |
US5066544A (en) * | 1990-08-27 | 1991-11-19 | U.S. Philips Corporation | Dispersion strengthened lead-tin alloy solder |
US5089356A (en) * | 1990-09-17 | 1992-02-18 | The Research Foundation Of State Univ. Of New York | Carbon fiber reinforced tin-lead alloy as a low thermal expansion solder preform |
US5088007A (en) * | 1991-04-04 | 1992-02-11 | Motorola, Inc. | Compliant solder interconnection |
JPH06168966A (ja) * | 1992-11-30 | 1994-06-14 | Nec Kansai Ltd | 半導体装置及びダイボンダ並びに半導体装置の製造方法 |
JP2517843B2 (ja) | 1994-09-30 | 1996-07-24 | 株式会社日立製作所 | 磁場印加接合方法 |
JP2521891B2 (ja) | 1994-09-30 | 1996-08-07 | 株式会社日立製作所 | 半導体装置 |
-
1993
- 1993-02-22 US US08/021,005 patent/US5346775A/en not_active Expired - Lifetime
-
1994
- 1994-02-09 EP EP94300936A patent/EP0612577B1/de not_active Expired - Lifetime
- 1994-02-09 SG SG1996000839A patent/SG43782A1/en unknown
- 1994-02-09 DE DE69402895T patent/DE69402895T2/de not_active Expired - Fee Related
- 1994-02-16 JP JP6040660A patent/JP2695611B2/ja not_active Expired - Fee Related
- 1994-02-18 MX MX9401269A patent/MX9401269A/es not_active IP Right Cessation
- 1994-02-21 KR KR1019940003034A patent/KR100323163B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0612577A1 (de) | 1994-08-31 |
EP0612577B1 (de) | 1997-05-02 |
MX9401269A (es) | 1994-08-31 |
US5346775A (en) | 1994-09-13 |
JP2695611B2 (ja) | 1998-01-14 |
KR100323163B1 (ko) | 2002-06-20 |
JPH06277871A (ja) | 1994-10-04 |
DE69402895T2 (de) | 1997-11-06 |
SG43782A1 (en) | 1997-11-14 |
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