DE69701277T2 - Gegenstand mit dispergierten Teilchen enthaltendes feinkörniges Weichlot - Google Patents

Gegenstand mit dispergierten Teilchen enthaltendes feinkörniges Weichlot

Info

Publication number
DE69701277T2
DE69701277T2 DE69701277T DE69701277T DE69701277T2 DE 69701277 T2 DE69701277 T2 DE 69701277T2 DE 69701277 T DE69701277 T DE 69701277T DE 69701277 T DE69701277 T DE 69701277T DE 69701277 T2 DE69701277 T2 DE 69701277T2
Authority
DE
Germany
Prior art keywords
particle
fine
article
soft solder
containing dispersed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69701277T
Other languages
English (en)
Other versions
DE69701277D1 (de
Inventor
Sungho Jin
Thomas Henry Tiefel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia of America Corp
Original Assignee
Lucent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucent Technologies Inc filed Critical Lucent Technologies Inc
Publication of DE69701277D1 publication Critical patent/DE69701277D1/de
Application granted granted Critical
Publication of DE69701277T2 publication Critical patent/DE69701277T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
    • B23K35/327—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C comprising refractory compounds, e.g. carbides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/114—Manufacturing methods by blanket deposition of the material of the bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/116—Manufacturing methods by patterning a pre-deposited material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/033—Punching metal foil, e.g. solder foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0405—Solder foil, tape or wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Powder Metallurgy (AREA)
  • Wire Bonding (AREA)
DE69701277T 1996-12-03 1997-11-18 Gegenstand mit dispergierten Teilchen enthaltendes feinkörniges Weichlot Expired - Lifetime DE69701277T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US75385696A 1996-12-03 1996-12-03

Publications (2)

Publication Number Publication Date
DE69701277D1 DE69701277D1 (de) 2000-03-16
DE69701277T2 true DE69701277T2 (de) 2000-08-31

Family

ID=25032444

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69701277T Expired - Lifetime DE69701277T2 (de) 1996-12-03 1997-11-18 Gegenstand mit dispergierten Teilchen enthaltendes feinkörniges Weichlot

Country Status (4)

Country Link
US (1) US5965197A (de)
EP (1) EP0856376B1 (de)
JP (1) JPH10180483A (de)
DE (1) DE69701277T2 (de)

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EP0856376B1 (de) * 1996-12-03 2000-02-09 Lucent Technologies Inc. Gegenstand mit dispergierten Teilchen enthaltendes feinkörniges Weichlot
FR2772657B1 (fr) * 1997-12-23 2000-03-03 Thomson Csf Procedure de realisation de pate a braser et joint de soudure obtenu
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JP3204451B2 (ja) * 1999-01-26 2001-09-04 インターナショナル・ビジネス・マシーンズ・コーポレーション 接合材料及びバンプ
US6173887B1 (en) * 1999-06-24 2001-01-16 International Business Machines Corporation Method of making electrically conductive contacts on substrates
JP4367675B2 (ja) * 1999-10-21 2009-11-18 日本碍子株式会社 セラミック製部材と金属製部材の接合用接着剤組成物、同組成物を用いた複合部材の製造方法、および同製造方法により得られた複合部材
US6403399B1 (en) * 2000-08-11 2002-06-11 Lsi Logic Corporation Method of rapid wafer bumping
CN100578778C (zh) * 2000-12-21 2010-01-06 株式会社日立制作所 电子器件
EP1413004A4 (de) * 2001-05-17 2004-07-21 Cypress Semiconductor Corp Ballgitter-antennenanordnung
TWI239574B (en) * 2004-03-18 2005-09-11 Ind Tech Res Inst The method of conductive particles dispersing
US7287685B2 (en) * 2004-09-20 2007-10-30 International Business Machines Corporation Structure and method to gain substantial reliability improvements in lead-free BGAs assembled with lead-bearing solders
US20060060639A1 (en) * 2004-09-21 2006-03-23 Byrne Tiffany A Doped contact formations
US20060067852A1 (en) * 2004-09-29 2006-03-30 Daewoong Suh Low melting-point solders, articles made thereby, and processes of making same
US7703661B2 (en) * 2007-05-23 2010-04-27 International Business Machines Corporation Method and process for reducing undercooling in a lead-free tin-rich solder alloy
KR20100069667A (ko) * 2007-09-11 2010-06-24 다우 코닝 코포레이션 열계면재료, 열계면재료를 포함하는 전자장치, 그리고 이들의 제조방법 및 용도
EP2188834A4 (de) * 2007-09-11 2014-03-19 Dow Corning Verbundstoff, thermisches zwischenmaterial mit dem verbundstoff sowie verfahren zu seiner herstellung und verwendung
US20100068552A1 (en) * 2008-03-31 2010-03-18 Infineon Technologies Ag Module including a stable solder joint
JP4987823B2 (ja) * 2008-08-29 2012-07-25 株式会社東芝 半導体装置
US8128868B2 (en) 2009-02-12 2012-03-06 International Business Machines Corporation Grain refinement by precipitate formation in PB-free alloys of tin
US8493746B2 (en) * 2009-02-12 2013-07-23 International Business Machines Corporation Additives for grain fragmentation in Pb-free Sn-based solder
EP2309829A1 (de) * 2009-09-24 2011-04-13 Harman Becker Automotive Systems GmbH Mehrschichtige Leiterplatte
WO2011106421A2 (en) * 2010-02-24 2011-09-01 Ramirez Ainissa G Low melting temperature alloys with magnetic dispersions
CN103221164B (zh) * 2010-11-18 2016-06-15 同和控股（集团）有限公司 焊料粉末以及焊料粉末的制造方法
CH705327A1 (de) * 2011-07-19 2013-01-31 Alstom Technology Ltd Lot zum Hochtemperaturlöten und Verfahren zum Reparieren bzw. Herstellen von Bauteilen unter Verwendung dieses Lotes.
US8618647B2 (en) * 2011-08-01 2013-12-31 Tessera, Inc. Packaged microelectronic elements having blind vias for heat dissipation
DE102013213135B3 (de) * 2013-07-04 2014-08-28 Infineon Technologies Ag Verfahren zum Weichlöten von Halbleiterchips auf Substrate und Verfahren zum Herstellen eines Leistungshalbleitermoduls
JP5730353B2 (ja) * 2013-07-17 2015-06-10 ハリマ化成株式会社 はんだ組成物、ソルダペーストおよび電子回路基板
JP5730354B2 (ja) * 2013-07-17 2015-06-10 ハリマ化成株式会社 はんだ組成物、ソルダペーストおよび電子回路基板
KR101671062B1 (ko) * 2014-08-18 2016-10-31 주식회사 경동원 무연 솔더 합금 조성물 및 무연 솔더 합금의 제조 방법
DE102015108481B4 (de) 2015-05-29 2022-02-03 Infineon Technologies Ag Lot mit Struktur zur leichteren Vereinzelung
CN107848075B (zh) * 2015-09-15 2021-03-19 株式会社村田制作所 接合用构件、接合用构件的制造方法和接合方法
WO2017056842A1 (ja) 2015-09-28 2017-04-06 株式会社村田製作所 ヒートパイプ、放熱部品、ヒートパイプの製造方法
CN107835724B (zh) 2015-11-05 2020-09-08 株式会社村田制作所 接合用构件和接合用构件的制造方法
WO2017098554A1 (ja) * 2015-12-07 2017-06-15 三菱電機株式会社 レーザ光源装置
US10865464B2 (en) 2016-11-16 2020-12-15 Hrl Laboratories, Llc Materials and methods for producing metal nanocomposites, and metal nanocomposites obtained therefrom
JP6540869B1 (ja) * 2018-03-30 2019-07-10 千住金属工業株式会社 はんだペースト
KR102187085B1 (ko) * 2019-01-24 2020-12-04 주식회사 경동엠텍 고온 및 진동환경에 적합한 무연솔더 합금 조성물 및 그 제조방법
CN115401357B (zh) * 2022-08-31 2024-01-30 昆明理工大学 一种含有原位合成纳米增强相的复合焊料合金及其制备方法

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JPH05220375A (ja) * 1992-02-12 1993-08-31 Nara Kikai Seisakusho:Kk 固体粒子の表面改質方法と装置
US5346775A (en) * 1993-02-22 1994-09-13 At&T Laboratories Article comprising solder with improved mechanical properties
JPH08215881A (ja) * 1995-02-10 1996-08-27 Tanaka Denshi Kogyo Kk 複合半田材料及びその製造方法
EP0856376B1 (de) * 1996-12-03 2000-02-09 Lucent Technologies Inc. Gegenstand mit dispergierten Teilchen enthaltendes feinkörniges Weichlot

Also Published As

Publication number Publication date
EP0856376B1 (de) 2000-02-09
EP0856376A1 (de) 1998-08-05
JPH10180483A (ja) 1998-07-07
DE69701277D1 (de) 2000-03-16
US5965197A (en) 1999-10-12

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